MXD8631

MXD8631 0.1-3.0GHz SP3T Switch VED APPRO This document contains information that is confidential and proprietary to Maxscend Technologies Inc. (Maxscend) and may not be reproduced in any form without express written consent of Maxscend. No transfer or licensing of technology is implied by this document. Page 1 of 6 Maxscend Technologies Inc. All rights reserved. Maxscend Confidential MXD8631 – 0.1-3.0GHz SP3T Switch General Description Applications The MXD8631 is a CMOS silicon-on-insulator (SOI), single-pole, triple-throw (SP3T) receive switch. The high linearity performance and low insertion loss makes the device an ideal choice for GSM/WCDMA/LTE handset and data card applications. The MXD8631 SP3T switch is provided in a compact Quad Flat No-Lead (QFN) 1.15mm x  GSM/WCDMA/LTE receive  802.11a/b/g/n WLANs Features  Broadband frequency range: 0.1 to 3.0 GHz  Low insertion: 0.50 dB @ 2.7 GHz  High isolation: 25 dB up to 2.7 GHz  No external DC blocking capacitors required  Positive low voltage control: VC = 1.6 to 3.00 1.15mm x 0.55mm package. A functional block diagram is shown in Figure 1. The pin V, VDD = 2.5 to 3.0 V  configuration and package are shown in Figure 2. Signal pin assignments and functional Small, QFN (9-pin, 1.15mm x 1.15mm x 0.55mm) package pin descriptions are provided in Table 1. Functional Block Diagram and Pin Function Figure 1.Functional Block Diagram Figure 2.Pin-out (Top View) Page 2 of 6 Maxscend Technologies Inc. All rights reserved. Maxscend Confidential MXD8631 – 0.1-3.0GHz SP3T Switch Application Circuit Figure 3. MXD8631 Application Circuit Table 1. Pin Description Pin No. Name Description Pin No. Name Description 1 2 3 4 5 V1 RF3 RF1 RFin RF2 Control Pin 1 RF-Port 3 RF-Port 1 RF Input RF-Port 2 6 7 8 9 GND VDD V2 GND Ground Power Supply Control Pin 2 Ground Truth Table Table 2. V1 V2 Active Path 0 1 0 1 0 0 1 1 OFF ANT to RF1 ANT to RF2 ANT to RF3 Note: “1” = 1.0 V to 3.00 V. “0” = –0 V to +0.3 V. Recommended Operation Range Table 3. Parameters Operation Frequency Power supply Switch Control Voltage High Switch Control Voltage Low Symbol Min Typ Max f1 0.1 2.5 1.6 0 2.8 1.8 0 3.0 3.0 3.0 0.3 VDD VCTL_H VCTL_L Units GHz V V V Page 3 of 6 Maxscend Technologies Inc. All rights reserved. Maxscend Confidential MXD8631 – 0.1-3.0GHz SP3T Switch Specifications Table 4.Electrical Specifications Parameter DC Specifications Control voltage: Low High Supply voltage Supply current Symbol VCTL_L VCTL_H VDD IDD Control current Min. Specification Typical Max. 0 1.60 2.5 Ictl +1.8 2.8 20 0.3 3.00 3.0 1 Units Test Condition V V V uA VDD = 2.8 V uA VC= 1.8 V RF Specifications Insertion loss IL Isolation ISO Return loss |S11| 3rd Order Input Intercept Point IIP3 30 24 20 +60 Input 0.1 dB compression point P0.1dB 2nd harmonic 2fo 3rd harmonic 3fo 0.30 0.40 0.50 35 28 24 15 +70 0.40 0.50 0.60 +29 dB dB dB dB dB dB dB dBm 0.8 to 1.0 GHz 1.0 to 2.2 GHz 2.2 to 3.0 GHz 0.8 to 1.0 GHz 1.0 to 2.2 GHz 2.2 to 3.0 GHz 0.8 to 3.0 GHz 0.8 to 3.0 GHz, ΔF = 1 MHz, PIN = +20 dBm/tone dBm 0.8 to 3.0 GHz Switching on time Switching off time Startup time +83 dBc +70 dBc 100 ns 100 ns 300 ns 0.8~3GMHz, PIN = +26 dBm 0.8~3GMHz, PIN = +26 dBm 50% VCTL to 10/90% RF 50% VCTL to 90/10% RF Shutdown state to any RF switch state Absolute Maximum Ratings Table 5. Maximum ratings Parameters Symbol Minimum Maximum Supply voltage Digital control voltage RF input power Operating temperature Storage temperature Electrostatic discharge: Human Body Model (HBM), Class 1C Machine Model (MM), Class A VDD VCTL PIN TOP TSTG +2.5 0 +3.0 +3.0 +29 +85 +150 V V dBm ℃ ℃ 2000 V 100 V –30 –55 ESD Units Note: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device. Page 4 of 6 Maxscend Technologies Inc. All rights reserved. Maxscend Confidential MXD8631 – 0.1-3.0GHz SP3T Switch Package Outline Dimension SEATING PLANE M 1 PIN 1 CORNER M TOP VIEW PIN 1 I.D. 7 8 1 DESCRIPTION SYMBOL TOTAL THICKNESS A 0.50 9 A1 0.00 --- 0.05 0.35 0.40 0.45 L/F THICKNESS A3 3 0.150 REF b 0.10 0.20 0.30 X D 1.10 1.15 1.20 Y E 1.10 1.15 1.20 LEAD LENGTH 4 0.60 A2 LEAD PITCH 5 MAX 0.55 STAND OFF BODY SIZE 2 MILLIMETER NOM MOLD THICKNESS LEAD WIDTH 6 MIN 0.40 BSC e L 0.10 0.20 PACKAGE EDGE TOLERANCE aaa MOLD FLATNESS bbb 0.1 COPLANARITY ccc 0.08 0.30 0.1 LEAD OFFSET ddd 0.1 EXPOSED PAD OFFSET eee 0.1 BOTTOM VIEW VIEW M-M Figure 4. Package outline dimension Page 5 of 6 Maxscend Technologies Inc. All rights reserved. Maxscend Confidential MXD8631 – 0.1-3.0GHz SP3T Switch Reflow Chart Fi gure 5. Recommended Lead-Free Reflow Profile Table 6. Profile Parameter Lead-Free Assembly, Convection, IR/Convection Ramp-up rate（TSmax to Tp） 3℃/second max. Preheat temperature（TSmin to TSmax） 150℃ to 200℃ Preheat time（ts） 60 - 180 seconds Time above TL , 217℃（tL） 60 - 150 seconds Peak temperature（Tp） 260℃ Time within 5℃ of peak temperature(tp) 20 - 40 seconds Ramp-down rate 6℃/second max. Time 25℃ to peak temperature 8 minutes max. ESD Sensitivity Integrated circuits are ESD sensitive and can be damaged by static electric charge. Proper ESD protection techniques should be used when handling these devices. RoHS Compliant This product does not contain lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB) and polybrominated diphenyl ethers (PBDE), and are considered RoHS compliant. Page 6 of 6 Maxscend Technologies Inc. All rights reserved. Maxscend Confidential