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LR G6SP-CBEA-1-1-Z

LR G6SP-CBEA-1-1-Z

  • 厂商:

    AMSOSRAM(艾迈斯半导体)

  • 封装:

    SMD6

  • 描述:

    LED 照明 - 彩色 Advanced Power TOPLED® 红色 625nm(620nm ~ 629nm) 6-SMD,J 引线

  • 数据手册
  • 价格&库存
LR G6SP-CBEA-1-1-Z 数据手册
www.osram-os.com Produktdatenblatt | Version 1.1 LR G6SP   LR G6SP Advanced Power TOPLED ® Advanced Power TOPLED features a compact package with a wide brightness range and high luminous efficiency. Applications ——Custom Tuning ——Interior Illumination (e.g. Ambient Map) ——Displays (Backlighting) ——Signalling Features: ——Package: white SMT package, colorless clear silicone resin ——Chip technology: Thinfilm ——Typ. Radiation: 120° (Lambertian emitter) ——Color: λdom = 623 nm (● red) ——Optical efficacy: 56 lm/W ——Corrosion Robustness Class: 3B  ——Qualifications: AEC-Q102 Qualified with RV-level 1 Not for new design ——ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) 1 Version 1.6 | 2021-05-05 LR G6SP   Ordering Information  Type Luminous Intensity 1) IF = 140 mA Iv LR G6SP-CBEA-1-1 3.55 ... 9.00 cd Not for new design  2 Version 1.6 | 2021-05-05 Ordering Code Q65111A0536 LR G6SP   Maximum Ratings Parameter Symbol Operating Temperature Top min. max. -40 °C 110 °C Storage Temperature Tstg min. max. -40 °C 110 °C Junction Temperature Tj max. 125 °C Junction Temperature for short time applications* Tj max. 150 °C Forward current TS = 25 °C IF min. max. 30 mA 200 mA Surge current t ≤ 10 µs; D = 0.005 ; TS = 25 °C IFS max. 1000 mA Reverse voltage 2) TS = 25 °C VR max. 12 V ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) VESD * The median lifetime (L70/B50) for Tj = 150°C is 100h. Not for new design  3 Version 1.6 | 2021-05-05 Values 2 kV LR G6SP   Characteristics IF = 140 mA; TS = 25 °C Parameter Symbol Peak Wavelength λpeak typ. 634 nm Dominant Wavelength 3) IF = 140 mA λdom min. typ. max. 620 nm 623 nm 629 nm Spectral Bandwidth at 50% Irel,max ∆λ typ. 18 nm Viewing angle at 50% IV 2φ typ. 120 ° Forward Voltage 4) IF = 140 mA VF min. typ. max. 1.90 V 2.10 V 2.50 V Reverse current 2) VR = 12 V  IR typ. max. 0.01 µA 10 µA Real thermal resistance junction/solderpoint 5) RthJS real typ. max. 50 K / W 60 K / W Electrical thermal resistance junction/solderpoint 5) with efficiency ηe = 38 % RthJS elec. typ. max. 31 K / W 37 K / W Not for new design  4 Version 1.6 | 2021-05-05 Values LR G6SP   Brightness Groups  Group Luminous Intensity 1) IF = 140 mA min. Iv Luminous Intensity. 1) IF = 140 mA max. Iv Luminous Flux 6) IF = 140 mA typ. ΦV CB 3.55 cd 4.50 cd 12.10 lm DA 4.50 cd 5.60 cd 15.10 lm DB 5.60 cd 7.10 cd 19.00 lm EA 7.10 cd 9.00 cd 24.20 lm Forward Voltage Groups  Group Forward Voltage 4) IF = 140 mA min. VF Forward Voltage 4) IF = 140 mA max. VF 3A 1.90 V 2.05 V 3B 2.05 V 2.20 V 4A 2.20 V 2.35 V 4B 2.35 V 2.50 V Not for new design  5 Version 1.6 | 2021-05-05 LR G6SP   Group Name on Label  Example: CB-1-3A Brightness Wavelength CB 1 Not for new design  6 Version 1.6 | 2021-05-05 Forward Voltage 3A LR G6SP   Relative Spectral Emission 6) Irel = f (λ); IF = 140 mA; TS = 25 °C Irel LR G6SP 1.0 : Vλ : red 0.8 0.6 0.4 0.2 0.0 350 400 450 500 550 600 650 700 750 800 λ [nm] Radiation Characteristics 6) Irel = f (ϕ); TS = 25 °C LR G6SP ϕ [°]  -40° -50° -20° -10° 0° 10° 20° 30° 40° 50° 60° 70° 80° 90° 1.0 -30° 0.8 0.6 -60° -70° Not for new design -80° -90° -100° 7 Version 1.6 | 2021-05-05 0.4 0.2 0.0 Irel LR G6SP   Forward current Relative Luminous Intensity 6) IF = f(VF); TS = 25 °C IF / mA 6), 7) Iv/Iv(140 mA) = f(IF); TS = 25 °C LR G6SP IV LR G6SP 200 IV(140mA) 1.4 180 1.2 160 1.0 140 0.8 120 100 0.6 80 0.4 60 0.2 40 VF / V Not for new design  8 Version 1.6 | 2021-05-05 20 0 18 0 16 0 14 0 2.3 12 0 2.2 10 0 2.1 80 2.0 60 0.0 1.9 30 30 1.8 IF / mA LR G6SP   Forward Voltage Relative Luminous Intensity 6) ΔVF = VF - VF(25 °C) = f(Tj); IF = 140 mA ∆VF / V Iv/Iv(25 °C) = f(Tj); IF = 140 mA LR G6SP 0.3 6) Iv LR G6SP 1.6 Iv(25°C) 1.4 0.2 1.2 0.1 1.0 0.0 0.8 0.6 -0.1 0.4 -0.2 0.2 -0.3 -40 -20 0 20 40 60 80 100 120 Tj / °C Dominant Wavelength 6) Δλdom = λdom - λdom(25 °C) = f(Tj); IF = 140 mA ∆λ dom / nm LR G6SP 10  5 0 Not for new design -5 -10 -40 -20 0 20 40 60 80 100 120 Tj / °C 9 Version 1.6 | 2021-05-05 0.0 -40 -20 0 20 40 60 80 100 120 Tj / °C LR G6SP   Max. Permissible Forward Current IF = f(T) IF OHL02180 250 mA 200 TA TS 150 100 50 TA temp. ambient TS temp. solder point 0 0 20 40 60 ˚C 120 80 T Permissible Pulse Handling Capability Permissible Pulse Handling Capability IF = f(tp); D: Duty cycle; TS = 25 °C IF = f(tp); D: Duty cycle; TS = 85 °C 1.2 IF A 1.0 OHL01184 t tP D = TP D= 0.8 0.6 0.4 IF  T 1.0 0.8 0.6 0.4 t D = TP IF T 0.005 0.01 0.02 0.033 0.05 0.1 0.2 0.5 1 0.2 0.2 Not for new design OHL01185 tP D= 0.005 0.01 0.02 0.033 0.05 0.1 0.2 0.5 1 0 -5 10 10-4 10-3 10-2 10-1 100 101 s 102 tp 10 Version 1.6 | 2021-05-05 1.2 IF A 0 -5 10 10-4 10-3 10-2 10-1 100 101 s 102 tp LR G6SP   Dimensional Drawing 8) Further Information: Approximate Weight: 40.0 mg Package marking: Cathode Corrosion test: Class: 3B Test condition: 40°C / 90 % RH / 15 ppm H2S / 14 days (stricter than IEC 60068-2-43) Not for new design  11 Version 1.6 | 2021-05-05 LR G6SP   Recommended Solder Pad 8) 0.8 (0.031) min 9 mm 2 per anode pad for improved heat dissipation 4.7 (0.185) C A 1.4 (0.055) A A A 0.8 (0.031) Package marking 0.35 (0.014) 0.35 (0.014) 0.6 (0.024) Lötstopplack Solder resist Package marking OHLPY925 For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Not for new design  12 Version 1.6 | 2021-05-05 LR G6SP   Reflow Soldering Profile Product complies to MSL Level 2 acc. to JEDEC J-STD-020E OHA04525 300 ˚C T 250 Tp 245 ˚C 240 ˚C tP 217 ˚C 200 tL 150 tS 100 50 25 ˚C 0 0 50 100 150 200 250 s 300 t Profile Feature Symbol Pb-Free (SnAgCu) Assembly Minimum Recommendation Maximum Ramp-up rate to preheat*) 25 °C to 150 °C tS Time tS TSmin to TSmax Ramp-up rate to peak*) TSmax to TP Liquidus temperature  3 100 120 2 3 K/s s K/s TL 217 Time above liquidus temperature tL 80 100 s Peak temperature TP 245 260 °C Time within 5 °C of the specified peak temperature TP - 5 K tP 20 30 3 6 Ramp-down rate* TP to 100 °C Not for new design 60 2 Unit 10 Time 25 °C to TP All temperatures refer to the center of the package, measured on the top of the component * slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range 13 Version 1.6 | 2021-05-05 °C 480 s K/s s LR G6SP   Taping 8) Not for new design  14 Version 1.6 | 2021-05-05 LR G6SP   Tape and Reel 9) Reel Dimensions A W Nmin W1 W2 max Pieces per PU 180 mm 12 + 0.3 / - 0.1 mm 60 mm 12.4 + 2 mm 18.4 mm 1000 330 mm 12 + 0.3 / - 0.1 mm 60 mm 12.4 + 2 mm 18.4 mm 4000 Not for new design  15 Version 1.6 | 2021-05-05 LR G6SP   Barcode-Product-Label (BPL) Dry Packing Process and Materials 8) Moisture-sensitive label or print L E E V l e be sela ). k, H de L If an bl r co ba (R id m ity . H R hu 0% e e /6 tiv ˚C la ared ag ck re fr 30 _ < in pa % k of to 90 rs ea s d ). rs ou or te (p on rs H de , ou iti H an bjec ng ou rs co ˚C 72 si nd H ou 5 te 48 ˚C su es e H co ± 24 6 da e y 40 be oc tim ˚C e or < ith tim ill pr). or ct w O w nt 23 tim e at lo or fa M TO F s al tim at le ˚C at lo at or e. P th F l tic th va lo or ur O F lo s ui on be if: read en w ed l 4 5 F m la ce eq id lo g, n oc l ve vi 5a is in or be 24 de pr ve l 6 Le de , nt whe e te co g: , w e Le ve l ke r ou se da ba ed flo ur e Le ve m % ba e ba al st ur e Le r en re ed e re> 10 oi st e e fo tim ur se al op fo M se oi st ur as k, is or . 33 se is M oi st bed k, lo H an , g ph -0 M oi in an in F R ng ar rbl D M e ba T r po If bl ith % lif ki r C. (if S is p. w ea r ks lf J10 ba to et th va Y ea m rs m _ r w, < he ed 1 ee te Y d, EC iredicat S fte at nt > 1 W Hou D A flody qu In no ire 1. d e ou 4 8 re reity is qu/JE re 2. bo e M tim to es id 2b re C 16 : e a) S tim is IP ic ed loor tim e b) ev Humor or e en F tim lo or D 2a king nc te F op a) lo or 3. b) ba re F lo da e fe l 1 2 F If al re tim ve l 4. se d l 2a ve Le 3 an ve l ag e Le e B ve ur e Le at st ur e Le D oi st ur e M oi st ur M oi st M oi M N E RS s in IV O IT T S C nta N U TIO U coSEND Ais bUagRMEICO T E CThIS S d Barcode label < M RA OS  Humidity indicator Barcode label Please check the HIC immidiately after bag opening. Discard if circles overrun. Avoid metal contact. Do not eat. Comparator check dot WET If wet, examine units, if necessary bake units 15% If wet, examine units, if necessary bake units 10% 5% If wet, parts still adequately dry. change desiccant Not for new design Humidity Indicator MIL-I-8835 Desiccant AM OSR OHA00539 Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033. 16 Version 1.6 | 2021-05-05 LR G6SP   Notes The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specified in this data sheet fall into the class exempt group (exposure time 10000 s). Under real circumstances (for exposure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light sources have a high secondary exposure potential due to their blinding effect. When looking at bright light sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irritation, annoyance, visual impairment, and even accidents, depending on the situation. Subcomponents of this device contain, in addition to other substances, metal filled materials including silver. Metal filled materials can be affected by environments that contain traces of aggressive substances. Therefore, we recommend that customers minimize device exposure to aggressive substances during storage, production, and use. Devices that showed visible discoloration when tested using the described tests above did show no performance deviations within failure limits during the stated test duration. Respective failure limits are described in the IEC60810. For further application related information please visit www.osram-os.com/appnotes Not for new design  17 Version 1.6 | 2021-05-05 LR G6SP   Disclaimer Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. If printed or downloaded, please find the latest version on the OSRAM OS website. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Product and functional safety devices/applications or medical devices/applications OSRAM OS components are not developed, constructed or tested for the application as safety relevant component or for the application in medical devices. OSRAM OS products are not qualified at module and system level for such application. In case buyer – or customer supplied by buyer – considers using OSRAM OS components in product safety devices/applications or medical devices/applications, buyer and/or customer has to inform the local sales partner of OSRAM OS immediately and OSRAM OS and buyer and /or customer will analyze and coordinate the customer-specific request between OSRAM OS and buyer and/or customer. Not for new design  18 Version 1.6 | 2021-05-05 LR G6SP   Glossary 1) Brightness: Brightness values are measured during a current pulse of typically 25 ms, with an internal reproducibility of ±8 % and an expanded uncertainty of ±11 % (acc. to GUM with a coverage factor of k = 3). 2) Reverse Operation: This product is intended to be operated applying a forward current within the specified range. Applying any continuous reverse bias or forward bias below the voltage range of light emission shall be avoided because it may cause migration which can change the electro-optical characteristics or damage the LED. 3) Wavelength: The wavelength is measured at a current pulse of typically 25 ms, with an internal reproducibility of ±0.5 nm and an expanded uncertainty of ±1 nm (acc. to GUM with a coverage factor of k = 3). 4) Forward Voltage: The forward voltage is measured during a current pulse of typically 8 ms, with an internal reproducibility of ±0.05 V and an expanded uncertainty of ±0.1 V (acc. to GUM with a coverage factor of k = 3). 5) Thermal Resistance: Rth max is based on statistic values (6σ). 6) Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devices, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice. 7) Characteristic curve: In the range where the line of the graph is broken, you must expect higher differences between single devices within one packing unit. 8) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and dimensions are specified in mm. 9) Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm. Not for new design  19 Version 1.6 | 2021-05-05 LR G6SP   Revision History Version Date Change 1.3 2019-02-22 Reflow Soldering Profile Reel Dimensions Dimensions of Transportation Box Notes 1.4 2019-10-31 Features 1.5 2020-06-15 Not for new design Glossary Schematic Transportation Box Dimensions of Transportation Box 1.6 2021-05-05 Electro - Optical Characteristics (Diagrams) Not for new design  20 Version 1.6 | 2021-05-05 LR G6SP   Not for new design  Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D-93055 Regensburg www.osram-os.com © All Rights Reserved. 21 Version 1.6 | 2021-05-05
LR G6SP-CBEA-1-1-Z 价格&库存

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LR G6SP-CBEA-1-1-Z
  •  国内价格 香港价格
  • 1+7.384111+0.88254
  • 10+4.4553910+0.53250
  • 100+2.96735100+0.35466
  • 500+2.38263500+0.28477

库存:10827

LR G6SP-CBEA-1-1-Z
    •  国内价格
    • 1+3.47760
    • 10+2.89440
    • 30+2.60280

    库存:67

    LR G6SP-CBEA-1-1-Z
    •  国内价格 香港价格
    • 1000+2.203181000+0.26332
    • 2000+2.056232000+0.24576
    • 3000+1.982883000+0.23699
    • 5000+1.901855000+0.22731
    • 7000+1.854587000+0.22166
    • 10000+1.8092110000+0.21624
    • 25000+1.7118525000+0.20460
    • 50000+1.6534250000+0.19762

    库存:10827