SL322532M10P

SL322532M10P SMD Crystal Resonator 贴片石英晶体谐振器 3225 32.000MHz 10PF 40Ω±10PPM 1. Electrical characteristics电气性能 Items 项目 Symbol 符号 Specification 规格说明 Min 最 小 Typ 标准 Max 最大 Model No 型号 Seam Seal 3225 Blank Cutting Mode 晶片切型 AT FUND. Nominal Frequency 标称频率 FL 32.000000 Oscillation Mode 振荡模式 Load Capacitance 负载电容 ■Fundamental CL Frequency Tolerance at 25 degrees 25℃频率公差 Unit 单位 MHz □3rd 10 pF -10 10 ppm Topr -20 70 ℃ Storage Temperatur 储存温度 Tstg -40 85 ℃ Drive Level 驱动功率 DL Trim Sensitivity/Pulling Factor 微调灵敏度/拉力系数 TS Effective Resistance RR 等效电阻 Rr - Typical Shunt Capacitance 典型并联电容 C0 Motional Capacitance C1 动态电容 Insulation Resistance 绝缘电阻 Operating Temperature 工作温度 Aging:老化率 100 Ppm/ pf - 40 Ω - - - 7 pF - C1 - - NA fF - Rins 500 - - MΩ at DC 100V +3 ppm Per year -3 0.018 Sample Data See Attachment抽样资料见附件 Measure equipment测量设备 : Electrical characteristics measured by S&A 250B or equivalent. www.slkormicro.com uW - Weight 重量 Remark备注: ~ Notes 1 g SL322532M10P 电气性能测量为S&A 250B或相当设备。 Hermetically密封性 : Fine Leak细漏: Helium Bombing 4kg/cm2 for 1 Hour, Leak ate Less Than 1×10-8 atm. cc/sec 氦气加压4kg/cm2 1小时，氦质谱检漏仪检测泄漏小于 1×10-8 atm. cc/sec Gross Leak精漏: 125℃ FC#40 , 120 Seconds, No Bubble 放入125度氟油120秒不起泡 2.Solder Dimension And Pattern焊接模型尺寸图： 3、 Equivalent Circuit等效电路图： 4. Structure drawing结构图： www.slkormicro.com 2 SL322532M10P 1 Cap上盖 2 Base基座 MATERIALS 原料 Metal ( Fe ) 金 属 Ceramic陶瓷制 品 3 PAD焊盘 NO QTY 数量 FINISH / SPECIFICATIONS 结束/说明 1 - 1 Color black炭黑色 Au金 4 Tungsten metalize钨合金 + Ni plating镍电镀 + Au plating金电镀 SiO2二氧化硅 1 - 5 Crystal Blank石英晶 片 Conductive Adhesive 导电粘合剂 Ag银 4 Silicone硅树脂 6 Electrode电极 Ag银 + Cr铬 2 - 4 5. COMPONENTS 构成 Reliability Specification可靠性说明 Item 项目 Condition 条件 Standard 标准 1. Drop characteristics 跌落特性 Free drop from 75cm height on a hard wooden board for 3 times. (Board is thickness more than 30 mm.) Frequency change:≤±5ppm Rr as specification 2 Mechanical shock 机械冲击 Device are shocked to half sine wave (1000g) three mutually perpendicular axes each 3 times Frequency change:≤±5ppm Rr as specification 3. Shake characteristics 震动特性 Shake frequency 10~55Hz, cyc1~2 minutes, swing 1.5mm, direction x/y/z, all 30 minutes, test after 1 hours. Frequency change:≤±5ppm Rr as specification 4. Humidity characteristics 湿度特性 +40±2℃ & 90%~95% R.H. 250 hours Frequency change:≤±5ppm Rr as specification 5. Low temperature characteristics 低温特性 -40±2 ℃ , 250 hours, put in room temperature, test after 1 hours. Frequency change:≤±5ppm Rr as specification 6. High temperature characteristics 高温特性 +85±2℃, 250 hours, put in room temperature, test after 1 hours. Frequency change:≤±5ppm Rr as specification 7. Temperature cycling 温度循环 -30±3℃/30±3 min~+85±2℃/30±3min, 5 cycles Frequency change:≤±5ppm Rr as specification 8. Refluence examination 回流焊 特性 www.slkormicro.com Frequency change:≤±5ppm Rr as specification 3 SL322532M10P 6. Type & Reel编带类型及卷盘 www.slkormicro.com HC-49SMD 5032 3225 2520 2016 W 24.00±0.30 12.00±0.05 8.00±0.05 8.00±0.05 8.00±0.05 E 1.75±0.10 1.75±0.10 1.75±0.05 1.75±0.05 1.75±0.05 F 11.5±0.10 5.5±0.10 3.5±0.05 3.5±0.05 3.5±0.10 T 0.40±0.05 0.30±0.05 0.25±0.03 0.25±0.03 0.20±0.05 P 12.00±0.10 8.00±0.10 4.00±0.05 4.00±0.05 4.00±0.10 P0 4.00±0.10 4.00±0.10 4.00±0.05 4.00±0.05 4.00±0.10 P2 2.00±0.10 2.00±0.10 2.00±0.05 2.00±0.05 2.00±0.10 D0 φ1.50+0.10 φ1.50+0.10 φ1.50+0.10 φ1.50+0.10 1.00±0.10 D1 φ1.50MIN φ1.50MIN φ1.00MIN φ1.00MIN 1.10±0.10 A0 4.60±0.10 3.50±0.10 2.70±0.05 2.25±0.05 1.80±0.05 K0 4.40±0.10 1.60±0.10 1.50±0.10 0.70±0.10 0.65±0.10 B0 14.20±0.15 5.20±0.10 3.50±0.05 2.75±0.05 2.20±0.10 4