01.X.TG.11CJJRI000327680

Chengdu Kingbri Frequency Technology Co., Ltd XME PRODUCT APPROVAL SHEET Product Type XTG-SMD3215 Tuning Fork Crystal Units CREC's P/N 01.X.TG.11CJRRI0000032768 Description Tuning Fork XTG-SMD3215 32.768KHz 12.5pF ±20ppm 70Kohm Customer Number CXB006 Customer P/N - Customer Name - Vevision B0 Spec No. CXB006XTG001 Drafting ISS APP. 2023/9/8 2023/9/8 杨静 Sign Date Process CHK.(R&D) 2023/9/8 Site Tel Fax Address +86-755-83475957 +86-755-83475977 No.8 Baiye Road,West Area of Hi-Tech Zone, Chengdu,sichuan,China Fab Assembly Chengdu,sichuan,China Test Web Site www.chinacrec.com PRODUCT SPECIFICATION XTG-SMD3215 Tuning Fork Crystal Units REVISION RECORD No HISTORY REASON DATE 1 New - 2023/9/8 Rev CREC's P/N Cust P/N Page B0 01.X.TG.11CJRRI0000032768 - 1 PRODUCT SPECIFICATION XTG-SMD3215 Tuning Fork Crystal Units 【 CONTENTS 】 1 2 3 4 5 6 7 8 9 10 Part explanation ---------------------------------------------------------------------------------------------------------------------------3 SCOPE --------------------------------------------------------------------------------------------------------------------------------------3 Reference Standard ---------------------------------------------------------------------------------------------------------------------3 Title Guide -----------------------------------------------------------------------------------------------------------------------------------3 Performance---------------------------------------------------------------------------------------------------------------------------------4 Figure-----------------------------------------------------------------------------------------------------------------------------------------4 6.1 Product Dimensions and Solder Pad Layout Dimensions -----------------------------------------------------------------4 6.2 Marking --------------------------------------------------------------------------------------------------------------------------------5 IR Reflow Profile --------------------------------------------------------------------------------------------------------------------------5 Packing specification --------------------------------------------------------------------------------------------------------------------6 8.1 Tape Dimensions -------------------------------------------------------------------------------------------------------------------6 8.2 Reel and Inner Box Dimensions and Q'ty ------------------------------------------------------------------------------------6 8.3 Carton Dimensions and Q'ty ------------------------------------------------------------------------------------------------------6 Reliability Test Item -----------------------------------------------------------------------------------------------------------------------7 Product handling and control procedure---------------------------------------------------------------------------------------------8 10.1 Precautions for storage-----------------------------------------------------------------------------------------------------------8 10.2 Mounting of SMD Type products------------------------------------------------------------------------------------------------8 10.3 Ultrasonic cleaning-----------------------------------------------------------------------------------------------------------------8 10.4 Ultrasonic welding------------------------------------------------------------------------------------------------------------------8 Rev CREC's P/N Cust P/N Page B0 01.X.TG.11CJRRI0000032768 - 2 PRODUCT SPECIFICATION XTG-SMD3215 Tuning Fork Crystal Units 1 Parts explanation The 32.768kHz turning fork crystal unit is the most widely used frequency control product. Its have low power consumption ideal for portable application. the different package sizes provide the customers more choices for time management. 2 SCOPE This specification only covers CREC's 01.X.TG.11CJRRI0000032768 3 Reference Standard 3.1 3.2 3.3 3.4 3.5 MIL-STD-883H :Environmental tests' Mechanical tests. MIL-STD-202 : Test Methods for Electronic and Electrical component part. IEC 60068-2 :Environmental tests' Mechanical tests. ANSI/EIA-481-C : 8mm through 200mm enbossed carrier taping and 24mm punched JEDEC J-STD-020C: Soldering 4 Title Guide ·· · 01 X TG 1 1C J R RI 0 000032768 Product Nominal Freq: 32.768KHz X'Tal Special requirement: NC Tuning Fork Type:XTG-SMD3215 Operating temp range: -20~70℃ Mode:Fundamental Temp Coefficient: -0.036ppm/℃^2 Load Capacitance:12.5pF Frequency tolerance:±20ppm Rev CREC's P/N Cust P/N Page B0 01.X.TG.11CJRRI0000032768 - 3 PRODUCT SPECIFICATION XTG-SMD3215 Tuning Fork Crystal Units 5 Performance Electrical Performance. Electrical characteristics measured by S&A250B. Electrical Specification No. Item Symb. 1 Nominal Frequency 2 Mode of vibration 3 Frequency tolerance 4 Min. Type Max. Unit Remark (Humidity: 40%~60%) F0 32.768000 KHz - - Fundamental - - ΔF/F0 -20 - 20 ppm 25℃±3℃ Operating Temperature Range TOPR -20 - 70 ℃ - 5 Storage Temperature Tstg -55 - 125 ℃ - 6 Turnover Temperature TM 20 25 30 ℃ 7 Temperature Coefficient 8 Frequency vs. Temperature 9 Load Capacitance 10 Equivalent Series Resistance 11 β - -0.036 - ppm/℃ - ppm - β*(T-TM)^2 △f / fM 2 CL - 12.5 - pF - ESR - - 70 Kohm 25℃±3℃ Drive Level DL - 0.1 - μW 25℃±3℃ 12 Insulation Resistance IR 500 - - Mohm @DC100V 13 Aging Year -3 - 3 ppm First Year 14 Quality Factor Q - - - K 25℃±3℃ 15 Shunt Capacitance C0 - - 3 pF 25℃±3℃ 6 Figure 6.1 Product Dimensions and Solder Pad Layout Dimensions (Unit:mm) Product Dimensions Solder Pad Layout Dimensions 0.9Max Rev CREC's P/N Cust P/N Page B0 01.X.TG.11CJRRI0000032768 - 4 PRODUCT SPECIFICATION XTG-SMD3215 Tuning Fork Crystal Units 6.2 Marking MARKING 7 IR Reflow Profile Remark: Referance JEDEC J-STD-020C Profiles Feature Average Ramp-up Rate (Ts max to Tp) Preheat ■Temperature Min (Ts min) ■Temperature Max (Ts max) ■Time (ts min to ts max) Time maintained above ■Temperature (TL) ■Time (tL) Pb-Free Assembly 3℃/second max. 125℃ 200℃ 60~180 seconds 217℃ 60~150 seconds Peak/Classification Temperature (Tp) Time within 5℃ of actual Peak Temperature (tp) Ramp-down rate Time 25℃ to Peak Temperature Suggest reflow times 260℃ 20~40 seconds 6℃/second Max 8 minutes Max 3 times Rev CREC's P/N Cust P/N Page B0 01.X.TG.11CJRRI0000032768 - 5 PRODUCT SPECIFICATION XTG-SMD3215 Tuning Fork Crystal Units 8 Packing specification 8.1 Tape Dimensions ITEM W P1 E F D0 P0 P2 A0 B0 K0 T L1 W1 Spec(mm) 12.0 4.00 1.75 5.50 1.50 4.00 2.00 1.85 3.60 1.00 0.30 0.20 0.20 Tol.(mm) ±0.10 ±0.10 ±0.10 ±0.1 ±0.1 ±0.10 ±0.10 ±0.10 ±0.10 ±0.10 ±0.05 ±0.05 ±0.05 8.2 Reel and Inner Box Dimensions and Q'ty Reel Item Inner Box A W N C D E T L B H SPEC(mm) 178 13.0 60.0 20.0 13.0 2.3 1.4 180 180 30 Tol.(mm) ±2.0 ±0.3 ±0.5 ±1.0 ±0.5 ±0.5 ±0.2 Q'ty (pcs) 3K/Reel Max 6K/Box Max 8.3 Carton Dimensions and Q‘ty Small Carton Item A SPEC(mm) 180 Q'ty (pcs) Weight (Kg) Carton Small Carton GW B C D E F G 230 180 0.51±0.01 GW 180 150 230 230 30K/Carton Max 2.29±0.5 NW Big Carton Carton H I J Big Carton K L M N 350 180 360 1.02±0.02 GW 180 300 230 230 60K/Carton Max 4.0±0.5 NW O P Q 300 230 350 120K/Carton Max 7.5±0.5 NW R 410 2.04±0.04 Rev CREC's P/N Cust P/N Page B0 01.X.TG.11CJRRI0000032768 - 6 PRODUCT SPECIFICATION XTG-SMD3215 Tuning Fork Crystal Units 9 Reliability Test Item No. Item 1 Drop Test Hight: 50cm Times: 2 times on hardWood IEC68-2-32 Free Fall 2 Vibration Frequency: 20 to2000Hz, full wave Amplitude: 1.5 mm (Peak to Peak) Sweep/Cycle: 2 minutes Accelerated Speed: 20g Direction: X, Y,Z Duration: 4min ,4 times in each direction IEC68-2-6 Vibration 3 Solderability Temperature: 235±5℃ Time: 10±1 Sec MIL-STD-202 Method 210B Condition B 4 Aging Temperature: 100℃ Time:168 hours MIL-STD-883H Method 1008.2 5 Fine Leak Helium Bombing:0.4~0.5Mpa Time:1 hour MIL-STD-883H METHOD 1014.13 6 Test Condition High Temperature Temperature: 85℃ ± 5℃ Storage Time 96 hours 7 Temperature Cycle 8 Resistance to Soldering Heat 9 Humidity 10 Thermal shock 11 Reference IEC 60068-2-2 Conditions: 25℃ ± 3℃ for 10 minutes -40℃ ± 3℃for 30 minutes 25℃ ± 3℃ for 10 minutes 125℃± 3℃ for 30 minutes 100 cycles MIL-STD-883H METHOD 1010.8 Pre-Heating:125℃ 60~120 Sec Solder temperature: 260± 5℃ Time: 20±5 sec MIL-STD-202 Method 210B Condition B Temperature: 60℃ ± 2℃ Relative Humidity: 95% Time: 96 hours. IEC 60068-2-3 Damp Heat -40℃ ± 3℃ to 100℃ ± 3℃, soak 15 minutes at each point, transfer time within 15 seconds, 20 cycles. MIL-STD-883H METHOD 1011.9 Low Temperature Temperature: -40℃ ± 5℃ Storage Time: 96 hours 12 IR Reflow Pre-Heating:150℃ to 200℃, 60-120 Sec Heating:217℃, 60 to 150 Sec Peak temp:260℃±5℃,20±5 Sec Times: 2 times 13 Salt Spray Temperature: 35±2℃ Salinity: 5% Time:24hrs IEC 60068-2-1 JEDEC J-STD-020C MIL-STD-883H Method 1009.8 Condition A Rev CREC's P/N Cust P/N Page B0 01.X.TG.11CJRRI0000032768 - 7 PRODUCT SPECIFICATION XTG-SMD3215 Tuning Fork Crystal Units 10 Product handling and control procedure 10.1 Precautions for storage Storage of crystal units under higher temperature or high humidity for a long term may affects frequency stability or solderability.Please store the crystal units under the normal temperature and humidity without exposing to direct sunlight and dew condensation,and avoid the storage of crystal units for more than 6 months,and mount them as soon as possible after unpacking. Item Storage peiod After customer assembly Crystal unused Min. 15 - Electrical Specification Type Max. 2 Unit Year Year 10.2 Mounting of SMD Type products When using an automatic loading machine,please test and confirm to cause no damage to the crystal units before mounting.Bending the circuit board in the process of cleaving boards after mounting and soldering crystal units may cause peeling off the soldering or package cracks by mechanical stress. 10.3 Ultrasonic cleaning General cleaning solutions or ultrasonic cleaning method may be used to clean CREC's products. However, under certain circumstances, ultrasonic cleaning machine could generate resonance at the oscillaton frequency of our products and thus deteriorate the electrical characteristics in devices, and even damage the overall structure of devices. Therefore, verification test is recommended before cleaning. 10.4 Ultrasonic welding Avoid mounting and processing by Ultrasonic welding this method has a possibility of an excessive vibration spreading inside the crystal products and becoming the cause of characteristic deterioration and not oscillating. If Ultrasonic welding is being used in process, please notify us in advance to verify it. Rev CREC's P/N Cust P/N Page B0 01.X.TG.11CJRRI0000032768 - 8