KMS-1102NL

10/100BASE-TX TRANSFORMER MODULES Features： IEEE 802.3af/ANSI X3.263 compliant performance. ● Operating Humidity:90%RH ● Storage temperature range:：-40～+85℃,90%RH ● RoHS compliant 子 ● Specifications Electrical Specification@25℃ Operating Temperature 0 to +70℃ Part NO Trun Ratio (±3%) TX RX OCL primary@ 100KHz,0.1Vrms,8mA Leakage primary@ 10KHz,0.1Vrms Cww (Pri.:Sec.) 350uH Min 0.5uH max 35pF Max KMS-1102NL 1CT:1CT 1CT:1CT DCR (Ω) Primary Secondary 0.9 Max 1.2 Max Isolation Voltage (Vrms min) 1500 Electrical Specification@25℃ Operating Temperature 0 to +70℃ KMS-1102NL 1-30 40 50 60-100 1-60 60-100 -1.0 -18 -16 -16 -10 -35 -30 -33 电 Part NO Crosstalk (dB min .) MHz 1-100 Return Ioss(dB min) MHz Insertion Ioss (dB max) 1-100MHz CMRR (dB min .) MHz Dimension Unless otherwise specified, all tolerances are ±0.25mm 6.90(0.27) KMS-1102NL YYWW 0.64(0.025) 9.40(0.37) 9 16 1.27(0.05) 10.67(0.42) 8 韩 1 8.89(0.35) 5.65(0.23) 12.7(0.5) 0.25(0.01) ±0.25Min 0.76(0.03) 0.25(0.01) ±0.05 TD+1 16TX+ CT 2 15 CT TD-3 14TX- RD+6 11RX+ CT 7 10 CT RD-8 9 RX- Ｔｅｌ：０７６９－８７８６９９０２　　　　　　ｈｔｔｐ／／ｗｗｗ．ｕｓａｋｒｏ．ｃｏｍ Cable Side Phy Side 美 Schematic 5.SUGGEST PROFILE IR reflow graph (4)Peak Tp Tb (3)Ramp up (2)Preheat Ta RT (1)Ramp up t1 子 TL Soldering Zone TL t2 电 Temperature Tp Time IR reflow profile Form-1 （Reference JEDEC J-STD-020C Table 5-2 ）） Sn-Pb IR reflow profile step# Profile Feature step1 Ramp-up rate step2 Preheat : 100~150℃(Ta-Tb) step4 step5 Ramp-up rate(T L to TP ) Condition/Duration Condition/Duration 1.5-3℃/se c. 1 .5 -3 ℃/sec. t1-t2 : 60~120 sec. t1-t2 : 60~180 sec. 1.5-3℃/se c. 1 .5 -3 ℃/sec. Temperature maintained above 183℃(TL ) T L :60-150sec. T L :80-150sec. Peak temperature(TP ) 230+5/-10℃ 260+0/-5℃ 3 0 ±1 0 se c. 3 0 ±1 0 se c. 6℃/se c.M a x 6 ℃/sec.Max 韩 step3 Pb-free Time within ℃ 5 of actual peak temperature Ramp-down rate Note1 Subject the samples to 3 cycles of the above Subject the samples to 3 cycles of the above defind reflow conditions defind reflow conditions Note2 Time 25 ℃ to p e a k te m p e ra tu re : 6 m in u te s m a x. Form-2 The time between reflows shall be 5 minutes minimum and 60minutes maximum SnPb Eutectic Process- “Package Peak Reflow Temperature” (Reference JEDEC J-STD-020C Table 4-1) 产品体积＜350mm3 产品体积≥350mm3 产品厚度 ＜2.5mm 240 +0/-5℃ 225 +0/-5℃ ≥2.5mm 225 +0/-5℃ 225 +0/-5℃ 美 Note3 T im e 2 5 ℃ to peak temperature : 8 minutes max. Pb-free Process - “Package Peak Reflow Temperature” Form-3 (Referencre JEDEC J-STD-020C Table 4-2) 产品厚度 产品体积＜350mm 3 产品体积350mm 3 -2000mm 260 +0/-5℃ 260 +0/-5℃ ＜1.6mm 1.6mm-2.5mm 260 +0/-5℃ 250 +0/-5℃ 250 +0/-5℃ 245 +0/-5℃ ＞2.5mm 3 产品体积＞2000mm 260 +0/-5℃ 245 +0/-5℃ 245 +0/-5℃ 3 东莞市美韩电子科技有限公司 REV： 00 Dongguan Usakro Electronic Technology Co., Ltd. Page：2 of 3 6.Reliability 1 Test Item Resistance To Soldering Heat-Convection Reflow Refer To Standard Test Condition IPC/JEDEC J-STD020D 1).Peak Temperature: Refer to Specification According to Package Body Thickness And Volume 2).Preheat Temperature and Soak Time: 150~200℃,60~120 Seconds 3).Average Ramp-up Rate: 3℃/Second Max 4).Above 217℃: 60~150 Seconds 5).Peak Temperature-5℃: Over 30 S 1.Low Temperature:-40℃ 2.High Temperature:125 3.Dwell Time:30 Minutes 4.Transition Time: Less Than 5Minutes 5.Number of Cycles: 10 电子 No. 2 Thermal Shock IEC68-2-14 Method A 3 High Temperature IEC68-2-2 Method A 125 ℃,96Hours 4 Low Temperature IEC68-2-1 Method A -40℃,96Hours 6 Temperature Humidity Cycle Vibration IEC68-2-38 IEC68-2-6 Humidity 93+/-3%RH 93+/-3%RH 80~96%RH 93+/-3%RH 93+/-3%RH 80~96%RH soak time 1.5 hr 4 hr 2.5 hr 1.5hr 4hr 2 1.Sine Wave 2.Amplitude:0.75mm 3.Frequence:5~500~5Hz 4.Direction: X,Y,Z 5.Number of Sweep Cycles Per Direction:10 6.Duration: 2 Hours Each Direction 美韩 5 Temp 25~65°C 65°C 65~25°C 25~65°C 65°C 65~25°C 7 Mechanical Shock MIL-STD-202 1).Half -Sine Wave 2).Peak Acceleration:50G 3).Duration:11mS 4).Direction: X,Y,Z,-X,-Y,-Z 5).Number of Shock Per Direction:3 8 Free Drop ISO4180 1) Height: Refer to Specification According to Production weight 2).1Corner,3Edges,6Faces .Total Are 10 Times 9 Solderability JESD22-B102D 10 Accelerated Moisture Resistance--JESD22-A102-C Unbiased Autoclave 1).Precondition:150±5°C,16±0.5Hours 2).Flux Type:ROL1 3).Immersion Flux Time: 5~10 Seconds 4).Solder Temperature:245±5°C 5).Solder Immersion Time:5±0.5 Seconds 6).Solder Immersion/Emersion Speed:25.4±6.4mm/Second 1.Temperature:121°C 2. Humidity: 100% 3. Vapor Pressure: 29.7 Psia or 205KPa 4.Duration:96 hours 东莞市美韩电子科技有限公司 Dongguan Usakro Electronic Technology Co., Ltd. REV： 00 Page：3 of 3