TLV70228DBVR(MS)

TLV702XXDBVR(MS) Product specification TLV702XXDBVR(MS) 产品描述 TLV702XXDBVR(MS) 系列是一组低压差（LDO）转换器，具有 1.2V 至 5.5V 宽电压输入范围、低压差、低功耗和小型化 封装的等特性。 TLV702XXDBVR(MS) 低至 2uA 低静态电流特性，特别适合用于电池供电、长时间待机系统设备应用，能帮助降低系统设 备的 待机功耗，有效延长待机时间和电池使用寿命。 TLV702XXDBVR(MS) 有带 EN 使能引脚的版本可选，将 EN 脚拉低可进入关断模式，此关断模式下静态电流可降至仅 100nA （典型值）。TLV702XXDBVR(MS) 系列支持输出电容采用陶瓷电容器 ，在 1.2V 至 5.5V 的宽输入电压范围内和 整个输出负载电流 0mA-300mA 范围内稳定工作。 产品特性 产品应用  2uA 静态电流（无负载）  手持式、电池供电设备  ±2%输出电压精度  低功耗微处理器  300mA 输出电流能力  笔记本电脑、掌上型电脑和 PDA  100nA 关断电流(可选版本)  无线通讯设备  宽范围输入电压: 1.2V 至 5.5V  音频/视频设备  低压差: 0.18V（Vo=3.3V/Io=300mA 条件下）  车载导航系统  支持固定输出电压：1.2V, 1.5V, 1.8V, 2.5V, 2.8V, 3.0V, 3.3V  支持陶瓷电容或者钽电容  限流保护  过温保护 封装脚位图 SOT-23-5 Pin Configurations 引脚功能描述 脚位号 名称 功能描述 2 GND 接地 5 VOUT 电压输出端口 1 VIN 电源输入端口 3 EN 使能控制 4 NC 浮空脚 Copyright© Msksemi Incorporated www.msksemi.com TLV702XXDBVR(MS) 产品信息—— TLV702 - XX 系列代码 DBVR (MS) 品牌标识 输出电压: 12=1.2V SOT-23-5 封装 15=1.5V 18=1.8V 25=2.5V 28=2.8V 30=3.0V 33=3.3V TLV70212DBVR(MS) TLV70215DBVR(MS) AADB **** AADG **** TLV70218DBVR(MS) TLV70225DBVR(MS) AABB **** AAET **** TLV70228DBVR(MS) TLV70230DBVR(MS) AAC6 **** AADC **** TLV70233DBVR(MS) AAC7 **** Copyright© Msksemi Incorporated www.msksemi.com TLV702XXDBVR(MS) 典型应用电路 VOUT VIN 1uF 1uF GND 图 1：固定输出应用电路 EN VOUT 1K VIN 1uF 1uF GND 图 2: 带使能脚的固定输出应用电路 EN VOUT 1K VIN SNS 1uF 1uF GND 图 3: 固定输出带使能功能和输出电压检测功能之应用电路 Copyright© Msksemi Incorporated www.msksemi.com TLV702XXDBVR(MS) EN VOUT NC 1K R1 VIN 1uF SNS 1uF GND R2 图 4: 带使能脚和输出电压检测可调电压输出应用电路 产品功能框图 Current/Thermal Sense EN VREF VOUT (Without SNS Pin) (Without EN Pin) VIN SNS RT EN RB GND Copyright© Msksemi Incorporated www.msksemi.com TLV702XXDBVR(MS) 最大耐压值 (Note 1) VIN 至 GND ------------------------------------------------------------------------------------------------------------------ -0.3V to 7V VOUT, EN 至 GND --------------------------------------------------------------------------------------------------- -0.3V to 6V VOUT 至 VIN ------------------------------------------------------------------------------------------------------------------- -6V to 0.3V 封装热阻 (Note 2) θJA ------------------------------------------------------------------------------------------------------------------------------------ 200 oC /W 引脚焊锡温度 (Soldering, 10 sec.) --------------------------------------------------------------------------------------- 260 oC 结点温度 --------------------------------------------------------------------------------------------------------------- 150 o C 存储温度范围 --------------------------------------------------------------------------------------- -60 o C to 150 o C ESD 静电 HBM ----------------------------------------------------------------------------------------------------------------------------- 2KV MM ------------------------------------------------------------------------------------------------------------------------------- 200V CDM ----------------------------------------------------------------------------------------------------------------------------- - 2KV 建议应用条件 输入电压 VIN ------------------------------------------------------------------------------------------------------- - 1.2V to 5.5V 应用结温范围 ------------------------------------------------------------------------------------------- -40 o C to 125 o C 应用环温范围 ------------------------------------------------------------------------------------------- -40 o C to 85 o C Copyright© Msksemi Incorporated www.msksemi.com TLV702XXDBVR(MS) 电气特性 (VIN =5V, VEN = 5V TA=25oC 除另有说明外) 参数 输入电压 符号 VIN 输出电压精准度 SNS 输入电流 测试条件 ILOAD =0.1mA 典型值 最大值 单位 1.2 -- 5.5 V 2 % -2 SNS = VOUT 0.5 VDROP_3V VOUT ≥ 3V 0.18 VDROP_2.8V VOUT = 2.8V 0.23 Dropout 电压 (ILOAD =300mA) VDROP_2.5V VOUT = 2.5V 0.23 (Note 3) VDROP_1.8V VOUT = 1.8V 0.28 VDROP_1.5V VOUT = 1.5V 0.36 VDROP_1.2V VOUT = 1.2V 0.45 静态电流 IQ ILOAD = 0mA 2 关闭电流 ISD VEN = 0V, VOUT = 0V VIH EN Rising VIL EN Falling IEN VEN = 5V 使能电压阈值 EN 输入电流 ISNS 最小值 μA V 0.1 μA 0.5 μA 1.0 V 0.4 10 100 nA ILOAD =30mA, 输入电压调整率 ΔLINE 1.5V ≤ VIN ≤ 5.5V or 0.2 % 0.2 % 301 600 mA (VOUT + 0.2V) ≤ VIN ≤ 5.5V 负载电压调整率 ΔLOAD 输出电流限流值 ILIM 电源抑制比 (ILOAD =5mA) PSRR 输出电流噪声 (BW = 10Hz to 100kHz, COUT VOUT = 0V VOUT =1.2V, f = 100Hz -- 80 -- VIN = 2V f = 1kHz -- 75 -- VIN = 3.5V VOUT =1.2V -- 80 -- ILOAD =0.1A =1μF,) 过温度关断温度 10mA ≤ ILOAD ≤ 0.3A dB μVRMS VOUT =2.8V TSD -- 120 -- -- 155 -- °C -- 15 -- °C -- 30 -- Ω ILOAD =10mA 过温度关断迟滞 ΔTSD 放电电阻 RDC EN = 0V , VOUT = 0.1V Note 1. 任何超过“最大耐压值”的应用可能会导致芯片遭受永久性损坏。这些是额定最大耐压值，仅表 示在这个范围内芯片不会损伤，但不保证所有性指标都正常，在任何超过"最大耐压值“的场合 使用，都可能导致芯片永久性损坏。在接近或等于最大耐压值情况下使用，可能会影响产品可 靠性。 Note 2. θJA 测量条件： TA = 25°C，使用 EVB 板。 Note 3. VDROP = VIN − VOUT （VOUT 达到 98%标准值）。 Copyright© Msksemi Incorporated www.msksemi.com TLV702XXDBVR(MS) 典型电气特性 Copyright© Msksemi Incorporated www.msksemi.com TLV702XXDBVR(MS) Current Limit Response Load Transient Response I Copyright© Msksemi Incorporated Load Transient Response II www.msksemi.com TLV702XXDBVR(MS) Line Transient Response VOUT Turn On/Off by EN PSRR vs. Frequency Noise Density Spectrum Copyright© Msksemi Incorporated www.msksemi.com TLV702XXDBVR(MS) 应用指导 输入和输出电容 2 电流限制功能 2 系列产品应用，需要选择合适的输 系列产品内部的电流限制器可持 入电容和输出电容，以确保产品应用获得稳定可靠的性能 续监控及控制输出功率晶体管，将输出电流限制至 。使用 1uF 或者更大容值的输入电容，并将其靠近 IC 的 600mA（典型值）。限流功能确保输出可以短路至地， VIN 和 GND pin 脚摆放。输出电容可选用 1m　Ω以上 ESR 器件不会损坏。 （等效串联阻抗） ，有效容值 1uF 至 22uF 的电容。并将 输出电容靠近IC 的 VOUT 和 GND 脚摆放。增加输出电容 OTP (过温度保护) 的容值和降低ESR 能够提升电路的 PSRR 和瞬态响应能 当产品的结点温度超过 155°C（典型值）时, 力。 2 会关闭 P-MOS 关闭输出。当结点温度往回降 Dropout 电压 2 大约 15°C 时， 2 会重新自动重启工 作。 系列采用 PMOS 传输晶体管来实 现低压差。当( VIN – VOUT ) 小于 (VDROP)时，PMO　S 晶体 管处于线性工作区域，输入至输出阻抗即为 PMO　S 的 热散功率 RDS(ON) ，在此状态下，PMOS 等效于一颗电阻，VDRO 持续工作时，IC 的结点温度不应超过其额定值。最大的 P 热散功率取决于 IC 封装的热阻、PCB 布图、周围气流速 和输出电流近似成比例。和其他线性电压转换器一样， 2 率以及结点和环境温度的差异。最大热散功率计算如下： 系列的PSRR 和瞬态响应能力会随 着( VIN – VOUT )压差接近VDROP 而下降。 环温 TA=25°C, 使用 K PCB, PD ( Max ) = ( 125°C − 25°C ) / ( 200°C/W ) = 0.5W 热散功率(PD)等于输出电流和 LDO 上的压降的乘积，计 算公式如下： PD = (VIN – VOUT) × IOUT Layout 注意事项 将输入电容、输出电容和 LDO 放置在 PCB 的同一面，并尽量将电容器靠近 IC 的输入输出脚摆放，可实现电路最佳 性能。输入电容和输出电容的接地连接必须拉回到 2 的接地引脚，并使用短而粗的铺线连接。 避免使用长走线、窄走线、或者通过过孔走线，这些会增加寄生电感和电阻，导致电路性能变差，特别是在瞬态工 作条件下。 Copyright© Msksemi Incorporated www.msksemi.com TLV702XXDBVR(MS) Package Outline Dimensions Symbol Dimensions In Millimeters Dimensions In Inches Min. Max. Min. Max. A 1.050 1.250 0.041 0.049 A1 0.000 0.100 0.000 0.004 A2 1.050 1.150 0.041 0.045 b 0.300 0.500 0.012 0.020 c 0.100 0.200 0.004 0.008 D 2.820 3.020 0.111 0.119 E 2.650 2.950 0.104 0.116 E1 1.500 1.700 0.950(BSC) 0.059 e 0.067 0.037(BSC) e1 1.800 2.000 0.071 0.079 L 0.300 0.600 0.012 0.024 θ 0° 8° 0° 8° Suggested Pad Layout Copyright© Msksemi Incorporated www.msksemi.com TLV702XXDBVR(MS) 订购信息 订单型号 封装形式 包装/数量 TLV70212DBVR(MS) SOT-23-5 盘装/3000pcs TLV70215DBVR(MS) SOT-23-5 盘装/3000pcs TLV70218DBVR(MS) SOT-23-5 盘装/3000pcs TLV70225DBVR(MS) SOT-23-5 盘装/3000pcs TLV70228DBVR(MS) SOT-23-5 盘装/3000pcs TLV70230DBVR(MS) SOT-23-5 盘装/3000pcs TLV70233DBVR(MS) SOT-23-5 盘装/3000pcs Copyright© Msksemi Incorporated www.msksemi.com TLV702XXDBVR(MS) Attention ■ Any and all MSKSEMI Semiconductor products described or contained herein do not handle applications that require extremely high levels of reliability, such as life-support have specifications that can systems, aircraft's control systems, or other applications whose failure can be reasonably expected to result in serious physical and/or material damage. 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