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LP5907MFX-3.0/NOPB(MS)

LP5907MFX-3.0/NOPB(MS)

  • 厂商:

    MSKSEMI(美森科)

  • 封装:

    SOT23-5

  • 描述:

    超低功耗2ua,带EN使能脚,电流最大300ma,广泛用于各类便携式手持设备,平板电脑,智能穿戴,电子测量仪器,医疗电子等

  • 数据手册
  • 价格&库存
LP5907MFX-3.0/NOPB(MS) 数据手册
LP5907MFX-XX/NOPB(MS) Product specification LP5907MFX-XX/NOPB(MS) 产品描述 LP5907MFX-XX/NOPB(MS) 系列是一组低压差(LDO)转换器,具有 1.2V 至 5.5V 宽电压输入范围、低压差、低功耗和 小型化封装的等特性。 LP5907MFX-XX/NOPB(MS) 低至 2uA 低静态电流特性,特别适合用于电池供电、长时间待机系统设备应用,能帮助降低 系统设备的 待机功耗,有效延长待机时间和电池使用寿命。 LP5907MFX-XX/NOPB(MS) 有带 EN 使能引脚的版本可选,将 EN 脚拉低可进入关断模式,此关断模式下静态电流可降 至仅 100nA (典型值)。LP5907MFX-XX/NOPB(MS) 系列支持输出电容采用陶瓷电容器 ,在 1.2V 至 5.5V 的宽输入电 压范围内和整个输出负载电流 0mA-300mA 范围内稳定工作。 产品特性 产品应用  2uA 静态电流(无负载)  手持式、电池供电设备  ±2%输出电压精度  低功耗微处理器  300mA 输出电流能力  笔记本电脑、掌上型电脑和 PDA  100nA 关断电流(可选版本)  无线通讯设备  宽范围输入电压: 1.2V 至 5.5V  音频/视频设备  低压差: 0.18V(Vo=3.3V/Io=300mA 条件下)  车载导航系统  支持固定输出电压:1.2V, 1.5V, 1.8V, 2.5V, 2.8V, 3.0V, 3.3V  支持陶瓷电容或者钽电容  限流保护  过温保护 Reference News&Marking SOT-23-5 Pin Configurations LP5907MFX-1.2/NOPB(MS) AADB **** LP5907MFX-1.8/NOPB(MS) AABB **** LP5907MFX-2.8/NOPB(MS) AAC6 **** LP5907MFX-1.5/NOPB(MS) AADG **** LP5907MFX-2.5/NOPB(MS) AAET **** LP5907MFX-3.0/NOPB(MS) AADC **** LP5907MFX-3.3/NOPB(MS) AAC7 **** Copyright© Msksemi Incorporated www.msksemi.com LP5907MFX-XX/NOPB(MS) Part Number Code —— LP5907MFX - XX / NOPB (MS) Series Code brand identity Output voltage: 1.2=1.2V Consumer Grade 1-5=1.5V 1.8=1.8V 2.5=2.5V 2.8=2.8V 3.0=3.0V 3.3=3.3V 引脚功能描述 Pin No 脚位号 Pin Name 名称 Pin Function Ground 2 2 GND 5 5 VOUT VOUT 1 1 VIN 3 4 3 4 Copyright© Msksemi Incorporated GND VIN EN NC CE NC 功能描述 接地 Output of the Regulator 电压输出端口 Input of 电源输入端口 Supply Voltage. 使能控制 No Internal Connection. 浮空脚 . Enable Control Input. www.msksemi.com LP5907MFX-XX/NOPB(MS) 典型应用电路 VOUT VIN 1uF 1uF GND 图 1:固定输出应用电路 EN VOUT 1K VIN 1uF 1uF GND 图 2: 带使能脚的固定输出应用电路 EN VOUT 1K VIN SNS 1uF 1uF GND 图 3: 固定输出带使能功能和输出电压检测功能之应用电路 Copyright© Msksemi Incorporated www.msksemi.com LP5907MFX-XX/NOPB(MS) EN VOUT NC 1K R1 VIN 1uF SNS 1uF GND R2 图 4: 带使能脚和输出电压检测可调电压输出应用电路 产品功能框图 VIN VOUT SNS EN GND Copyright© Msksemi Incorporated www.msksemi.com LP5907MFX-XX/NOPB(MS) 最大耐压值 (Note 1) VIN 至 GND ------------------------------------------------------------------------------------------------------------------ -0.3V to 7V VOUT, EN 至 GND --------------------------------------------------------------------------------------------------- -0.3V to 6V VOUT 至 VIN ------------------------------------------------------------------------------------------------------------------- -6V to 0.3V 封装热阻 (Note 2) θJA ---------------------------------------------------------------------------------------------------------------------------------- 200 oC /W 260 oC 引脚焊锡温度 (Soldering, 10 sec.) ----------------------------------------------------------------------------------- 结点温度 ------------------------------------------------------------------------------------------------------------- 150 o C 存储温度范围 --------------------------------------------------------------------------------------- -60 o C to 150 o C ESD 静电 HBM ----------------------------------------------------------------------------------------------------------------------------- - 2KV MM ------------------------------------------------------------------------------------------------------------------------------- 200V CDM ----------------------------------------------------------------------------------------------------------------------------- - 2KV 建议应用条件 输入电压 VIN --------------------------------------------------------------------------------------------------------- 应用结温范围 ---------------------------------------------------------------------------------------应用环温范围 ----------------------------------------------------------------------------------------- Copyright© Msksemi Incorporated 1.2V to 5.5V -40 oC to 125 o C -40 o C to 85 o C www.msksemi.com LP5907MFX-XX/NOPB(MS) 电气特性 (VIN =5V, VEN = 5V TA=25oC 除另有说明外) 参数 输入电压 符号 VIN 输出电压精准度 SNS 输入电流 测试条件 ILOAD =0.1mA 典型值 最大值 单位 1.2 -- 5.5 V 2 % -2 SNS = VOUT 0.5 VDROP_3V VOUT ≥ 3V 0.18 VDROP_2.8V VOUT = 2.8V 0.23 Dropout 电压 (ILOAD =300mA) VDROP_2.5V VOUT = 2.5V 0.23 (Note 3) VDROP_1.8V VOUT = 1.8V 0.28 VDROP_1.5V VOUT = 1.5V 0.36 VDROP_1.2V VOUT = 1.2V 0.45 静态电流 IQ ILOAD = 0mA 2 关闭电流 ISD VEN = 0V, VOUT = 0V VIH EN Rising VIL EN Falling IEN VEN = 5V 使能电压阈值 EN 输入电流 ISNS 最小值 μA V 0.1 μA 0.5 μA 1.0 V 0.4 10 100 nA ILOAD =30mA, 输入电压调整率 ΔLINE 1.5V ≤ VIN ≤ 5.5V or 0.2 % 0.2 % 301 600 mA (VOUT + 0.2V) ≤ VIN ≤ 5.5V 负载电压调整率 ΔLOAD 输出电流限流值 ILIM 电源抑制比 (ILOAD =5mA) PSRR 输出电流噪声 (BW = 10Hz to 100kHz, COUT VOUT = 0V VOUT =1.2V, f = 100Hz -- 80 -- VIN = 2V f = 1kHz -- 75 -- VIN = 3.5V VOUT =1.2V -- 80 -- ILOAD =0.1A =1μF,) 过温度关断温度 10mA ≤ ILOAD ≤ 0.3A dB μVRMS VOUT =2.8V TSD -- 120 -- -- 155 -- °C -- 15 -- °C -- 30 -- Ω ILOAD =10mA 过温度关断迟滞 ΔTSD 放电电阻 RDC EN = 0V , VOUT = 0.1V Note 1. 任何超过“最大耐压值”的应用可能会导致芯片遭受永久性损坏。这些是额定最大耐压值,仅表 示在这个范围内芯片不会损伤,但不保证所有性指标都正常,在任何超过"最大耐压值“的场合 使用,都可能导致芯片永久性损坏。在接近或等于最大耐压值情况下使用,可能会影响产品可 靠性。 Note 2. θJA 测量条件: TA = 25°C,使用 EVB 板。 Note 3. VDROP = VIN − VOUT (VOUT 达到 98%标准值)。 Copyright© Msksemi Incorporated www.msksemi.com LP5907MFX-XX/NOPB(MS) 典型电气特性 Copyright© Msksemi Incorporated www.msksemi.com LP5907MFX-XX/NOPB(MS) Current Limit Response Load Transient Response I Copyright© Msksemi Incorporated Load Transient Response II www.msksemi.com LP5907MFX-XX/NOPB(MS) Line Transient Response VOUT Turn On/Off by EN PSRR vs. Frequency Noise Density Spectrum Copyright© Msksemi Incorporated www.msksemi.com LP5907MFX-XX/NOPB(MS) 应用指导 电流限制功能 输入和输出电容 5 系列产品应用,需要选择合 5 系列产品内部的电流限制 适的输入电容和输出电容,以确保产品应用获得稳定可 器可持续监控及控制输出功率晶体管,将输出电流限制 靠的性能。使用 1uF 或者更大容值的输入电容,并将其 至 600mA(典型值)。限流功能确保输出可以短路至地 靠近 IC 的 VIN 和 GND pin 脚摆放。输出电容可选用 1m ,器件不会损坏。 Ω以上 ESR(等效串联阻抗) ,有效容值 1uF 至 22uF 的 电容。并将输出电容靠近IC 的 VOUT 和 GND 脚摆放。增 OTP (过温度保护) 加输出电容的容值和降低ESR 能够提升电路的 PSRR 和 当产品的结点温度超过 155°C(典型值)时, 瞬态响应能力。 会关闭 P-MOS 关闭输出。当结点温度 Dropout 电压 5 5 往回降大约 15°C 时, 系列采用 PMOS 传输晶体 管来实现低压差。当( VIN – VOUT ) 小于 (VDROP)时,PMO 5 会重 新自动重启工作。 S 晶体管处于线性工作区域,输入至输出阻抗即为 PMO 热散功率 S 的 RDS(ON) ,在此状态下,PMOS 等效于一颗电阻,VDRO 持续工作时,IC 的结点温度不应超过其额定值。最大的 和输出电流近似成比例。和其他线性电压转换器一样, 热散功率取决于 IC 封装的热阻、PCB 布图、周围气流速 P 5 系列的PSRR 和瞬态响应能力 率以及结点和环境温度的差异。最大热散功率计算如下: 会随着( VIN – VOUT )压差接近VDROP 而下降。 环温 TA=25°C, 使用 DSTECH PCB, PD ( Max ) = ( 125°C − 25°C ) / ( 200°C/W ) = 0.5W 热散功率(PD)等于输出电流和 LDO 上的压降的乘积,计 算公式如下: PD = (VIN – VOUT) × IOUT Layout 注意事项 将输入电容、输出电容和 LDO 放置在 PCB 的同一面,并尽量将电容器靠近 IC 的输入输出脚摆放,可实现电路最佳 性能。输入电容和输出电容的接地连接必须拉回到 5 的接地引脚,并使用短而粗的铺线 连接。避免使用长走线、窄走线、或者通过过孔走线,这些会增加寄生电感和电阻,导致电路性能变差,特别是在 瞬态工作条件下。 Copyright© Msksemi Incorporated www.msksemi.com LP5907MFX-XX/NOPB(MS) Package Outline Dimensions Symbol Dimensions In Millimeters Dimensions In Inches Min. Max. Min. Max. A 1.050 1.250 0.041 0.049 A1 0.000 0.100 0.000 0.004 A2 1.050 1.150 0.041 0.045 b 0.300 0.500 0.012 0.020 c 0.100 0.200 0.004 0.008 D 2.820 3.020 0.111 0.119 E 2.650 2.950 0.104 0.116 E1 1.500 1.700 0.950(BSC) 0.059 e 0.067 0.037(BSC) e1 1.800 2.000 0.071 0.079 L 0.300 0.600 0.012 0.024 θ 0° 8° 0° 8° Suggested Pad Layout Copyright© Msksemi Incorporated www.msksemi.com LP5907MFX-XX/NOPB(MS) 订购信息 订单型号 封装形式 包装/数量 LP5907MFX-1.2/NOPB(MS) SOT-23-5 盘装/3000pcs LP5907MFX-1.5/NOPB(MS) SOT-23-5 盘装/3000pcs LP5907MFX-1.8/NOPB(MS) SOT-23-5 盘装/3000pcs LP5907MFX-2.5/NOPB(MS) SOT-23-5 盘装/3000pcs LP5907MFX-2.8/NOPB(MS) SOT-23-5 盘装/3000pcs LP5907MFX-3.0/NOPB(MS) SOT-23-5 盘装/3000pcs LP5907MFX-3.3/NOPB(MS) SOT-23-5 盘装/3000pcs Copyright© Msksemi Incorporated www.msksemi.com LP5907MFX-XX/NOPB(MS) Attention ■ Any and all MSKSEMI Semiconductor products described or contained herein do not handle applications that require extremely high levels of reliability, such as life-support have specifications that can systems, aircraft's control systems, or other applications whose failure can be reasonably expected to result in serious physical and/or material damage. Consult with your MSKSEMI Semiconductor representative nearest you before using any MSKSEMI Semiconductor products described or contained herein in such applications. ■ MSKSEMI Semiconductor assumes no responsibility for equipment failures that result from using products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in products specificationsof any andall MSKSEMI Semiconductor products described orcontained herein. ■ Specifications of any and all MSKSEMI Semiconductor products described or contained herein stipulate the performance, characteristics, and functions of the described products in the independent state, and are not guarantees of the performance, characteristics, and functions of the described products as mounted in the customer’s products or equipment. To verify symptoms and states that cannot be evaluated in an independent device, the customer should always evaluate and test devices mounted in the customer’sproducts orequipment. ■ MSKSEMI Semiconductor. strives to supply high-quality high-reliability products. However, any and all semiconductor products fail with someprobability. It is possiblethat these probabilistic failures could give rise to accidents or events that could endanger human lives, that could give rise to smoke or fire, or that could cause damage to other property. When designing equipment, adopt safety measures so that these kinds of accidents or events cannot occur. Such measures include but are not limited to protective circuits anderror prevention circuitsfor safedesign, redundant design, and structural design. ■ In the event that any or all MSKSEMI Semiconductor products(including technical data, services) described or contained herein are controlled under any of applicable local export control laws and regulations, such products must not be exported without obtaining the export license from theauthorities concerned in accordance with the above law. ■ No part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopying and recording, or any information storage or retrieval system, or otherwise, without the prior written permission of MSKSEMI Semiconductor. ■ Information (including circuit diagrams and circuit parameters) herein is for example only ; it is not guaranteed for volume production. MSKSEMI Semiconductor believes information herein is accurate and reliable, but no guarantees are made or implied regarding its use or any infringementsof intellectual property rights or other rightsof third parties. ■ Any and all information described or contained herein are subject to change without notice due to product/technology improvement, etc. Whendesigning equipment, referto the "Delivery Specification" for the MSKSEMI Semiconductor productthat you intend to use. Copyright© Msksemi Incorporated www.msksemi.com
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