XC6219B252MR-MS

XC6219 Product specification XC6219 General Description The XC6219 series are highly accurate, low noise, CMOS LDO Voltage Regulators.Offering low output noise, high ripple rejection ratio,low dropout and very fast turn-on times, the XC6219 series is ideal for today’s cutting edge mobile phone. Internally the XC6219 includes a reference voltage source, error a mplifiers, driver transistors, current limiters and phase compensators. The output voltage is set by current trimming. Voltages are selectable in 1 0 0 mV steps within a ran ge of 1.2V to 5.0V. The XC6219 series is also fully compatible with low ESR ceramic capacitors,reducing cost and improving output stability.This high level of output stability is maintained even during fr equent load fluctuations,due to the excellent transient response performance and high PSRR achieved across a broad range of frequencies.The CE function allows the output of regulat or to be turned off,resulting in greatly reduced power consumption. Features Application  Low power consumption:40uA (Typ.)  Battery-powered equipment  Low voltage drop:  Communication equipment 0. 12V@ 100mA@VOUT=3.3V(Typ.)  Mobile phones  Standby Mode: 0. 1uA  Portable games  Low temperature coefficient  Cameras, Video cameras  High input voltage (up to 8V)  Reference voltage sources  Output voltage accuracy: tolerance ±2%  SOT23-5、SOT89package Reference News PACKAGE OUTLINE SOT-23-5 Copyright© Msksemi Incorporated Block Diagram SOT-89 www.msksemi.com XC6219 Ordering Information XC6219 brand identity MR:SOT-23-5 PR :SOT-89 serie Without pull-down accuracy resistor Output voltage Item number package Output voltage Item number package Output voltage XC6219B122MR-MS SOT-23-5 1.2V XC6219B122PR-MS SOT-89 1.2V XC6219B152MR-MS SOT-23-5 1.5V XC6219B152PR--MS SOT-89 1.5V XC6219B182MR-MS SOT-23-5 1.8V XC6219B182PR--MS SOT-89 1.8V XC6219B252MR-MS SOT-23-5 2.5V XC6219B252PR--MS SOT-89 2.5V XC6219B282MR-MS SOT-23-5 2.8V XC6219B282PR--MS SOT-89 2.8V XC6219B302MR-MS SOT-23-5 3V XC6219B302PR--MS SOT-89 3V XC6219B332MR-MS SOT-23-5 3.3V XC6219B332PR-MS SOT-89 3.3V Copyright© Msksemi Incorporated www.msksemi.com XC6219 Package and Pin assignment SOT23-5 (Top View) PIN NUMBER SYMBOL FUNCTION 1 VIN Power Input Pin 2 GND Ground 3 CE Chip Enable Pin 4 NC No Connection 5 VOUT Output Pin SOT89 (Top View) PIN NUMBER SYMBOL FUNCTION 1 GND Ground 2 VIN Power Input Pin 3 VOUT Output Pin Absolute Maximum Ratings Supply Voltage -0.3V to 8V Operating Temperature Storage Temperature ..................-50C to 125C -40C to 85C Note: These are stress ratings only. Stresses exceeding the range specified under “Absolute Maximum Ratings” may cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability. Thermal Information Symbol Parameter Thermal Resistance ( Junction to θJA PD Ambient) (Assume no ambient airflow, no heat sink) Power Dissipation Package Max. SOT23-5 500 SOT89 200 SOT23-5 0.25 SOT89 0.5 Unit ℃/W W Note:PDismeasuredatTa=25℃ Copyright© Msksemi Incorporated www.msksemi.com XC6219 Electrical Characteristics XC6219 series Parameter (Ta=25℃) Symbol Conditions Vin=Vout+1V Output Voltage Vout Output Current* 1 Iout Vin-Vout=1V Line Regulation △Vout1/ (△Vin·Vout) 4.3V≤Vin≤8V Load Regulation △Vout Output voltage Temperature △Vout/(Ta· Vout) Coefficiency Supply Current Iss1 Input Voltage Vin PSRR PSRR 1.0mA≤ Iout≤30mA Iout=10mA Min. Vout×0.98 Iout=30mA 0 C≤ Ta≤ 7 0 C --F=1KHz, Vin=4.3Vdc+1Vpp -- Max. Vout×1.02 Unit V -- 350 -- mA -- 0.05 0.2 %/V -- 10 30 Vin= 4.3V 1.0mA≤ Iout≤100mA Typ. -- ± 100 -- V Ppm/ C -- 40 -- uA -- -- 8 V -- 60 -- dB TypicalApplicationCircuit Copyright© Msksemi Incorporated www.msksemi.com XC6219 Operational Explanation The P-channel MOSFET is connected to the VOUT pin, driven by the subsequent output signal. The output voltage at the VOUT pin is controlled and stabilized by a system of negative feedback. The IC's internal circuitry can shut-down by the CE pin's signal With the XC6219 series, a stable output voltage is achievable even if used with low ESR capacitors as a phase compensation circuit is built-in. In order to ensure the effectiveness of the phase compensation, we suggest that an output capacitor (CL) is connected as close as possible to the output pin (VOUT) and the GND pin. Please use an output capacitor with a capacitance value of at least 10uF. Also, please connect an input capacitor (CIN) of 10uF between the VIN pin and the GND pin in order to ensure a stable power input. Stable phase compensation may not be ensured if the capacitor runs out capacitance when depending on bias and temperature. In case the capacitor depends on the bias and temperature, please make sure the capacitor can ensure the actual capacitance. The IC's internal circuitry can be shutdown via the signal from the CE pin with the XC6219 series. The operational logic of the IC's CE pin is selectable (please refer to the selection guide). Although the CE pin is equal to an inverter input with CMOS hysteresis, with either the pull-up or pull-down options, the CE pin input current will increase when the IC is in operation. We suggest that you use this IC with either a VIN voltage or a VSS voltage input at the CE pin. If this IC is used with the correct specifications for the CE pin, the operational logic is fixed and the IC will operate normally. However, supply current may increase as a result of through current in the IC's internal circuitry. Notes on Use 1. Please use this IC within the stated absolute maximum ratings. The IC is liable to malfunction should the ratings be exceeded. 2. Where wiring impedance is high, operations may become unstable due to noise and/or phase lag depending on output current. Please keep the resistance low between VIN and VSS wiring in particular. 3. Please wire the input capacitor (CIN) and the output capacitor (CL) as close to the IC as possible. Copyright© Msksemi Incorporated www.msksemi.com XC6219 SOT-23-5 Package Outline Dimensions Symbol Dimensions In Millimeters Min. Dimensions In Inches Max. Min. Max. A 1.050 1.250 0.041 0.049 A1 0.000 0.100 0.000 0.004 A2 b 1.050 1.150 0.041 0.045 0.300 0.500 0.012 0.020 0.100 0.200 0.004 0.008 D 2.820 3.020 0.111 0.119 E 2.650 2.950 0.104 0.116 E1 e 1.500 1.700 0.950(BSC) 0.059 0.067 0.037(BSC) e1 1.800 2.000 0.071 0.079 L θ 0.300 0.600 0.012 0.024 0° 8° 0° 8° c SOT-23-5L Suggested Pad Layout Copyright© Msksemi Incorporated www.msksemi.com XC6219 SOT-89 Package Outline Dimensions Symbol A b b1 c D D1 E E1 e Dimensions Min 1.400 0.320 0.400 0.350 4.400 Millimeters Ma x Dimensions Inches Ma x 1.600 0.520 0.580 0.063 0.020 0.023 0.440 4.600 0.014 0.173 0.017 0.181 2.600 4.250 0.091 0.155 0.061 REF. 1.500 TYP . 3.000 TYP . 0.900 In Min 0.055 0.013 0.016 1.550 REF. 2.300 3.940 e1 L In 0.102 0.167 0.060 TYP. 0.118 TYP. 1.200 0.035 0.047 SOT-89 Suggested Pad Layout Copyright© Msksemi Incorporated www.msksemi.com XC6219 Attention ■ Any and all MSKSEMI Semiconductor products described or contained herein do not handle applications that require extremely high levels of reliability, such as life-support have specifications that can systems, aircraft's control systems, or other applications whose failure can be reasonably expected to result in serious physical and/or material damage. 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