HT76L33BRTZ

HT76LxxB Low Power,Low Dropout,RF-Linear Regulators GENERAL DESCRIPTION The HT76LxxB series low-power, low-noise, low-dropout, CMOS linear voltage regulators operate from a 2.5V to 5.5V input voltage. They are the perfect choice for low voltage, low power applications. A low ground current makes this part attractive for battery operated power systems. The HT76LxxB series also offer ultra low dropout voltage to prolong battery life in portable electronics. Systems requiring a quiet voltage source, such as RF applications, will benefit from the HT76LxxB series' ultra low output noise (30µVRMS) and high PSRR. An external noise bypass capacitor connected to the device's BP pin can further reduce the noise level.The output voltage is preset to voltages in the range of 1.2V to 5.0V. Other features include a 10nA logic-controlled shutdown mode, foldback current limit and thermal shutdown protection. The HT76LxxB is available in Green SOT-23-5 and SC70-5 packages. It operates over an ambient temperature range of -40℃ to +85℃. FEATURES ⚫ ⚫ ⚫ ⚫ ⚫ ⚫ ⚫ ⚫ ⚫ ⚫ ⚫ Low Output Noise Low Dropout Voltage Thermal-Overload Protection Output Current Limit High PSRR (74dB at 1kHz) 10nA Logic-Controlled Shutdown Available in Multiple Output Voltage Versions Fixed Outputs of 1.2V, 1.5V, 1.8V, 2.5V, 2.6V, 2.8V, 2.85V, 3.0V and 3.3V Adjustable Output from 1.2V to 5.0V -40℃ to +85 ℃ Operating Temperature Range Available in Green SC70-5 and SOT-23-5 Packages APPLICATIONS Cellular Telephones Cordless Telephones PCMCIA Cards Modems MP3 Player Hand-Held Instruments Palmtop Computers Electronic Planners Portable/Battery-Powered Equipment PIN CONNECTIONS SOT23-5 T SUFFIX HT76LXXBRTZ SC-70-5 C SUFFIX HT76LxxBRCZ 1 Pin 1.VIN 2.GND 3. EN 4. BP/FB 5.VOUT Pin 1.VIN 2.GND 3. EN 4. BP/FB 5.VOUT Pin XDFN4 X SUFFIX HT76LXXBRXZ A1 A2 A1.Vout B1.EN B1 B2 B2. BP/FB A2.VOUT (Top View) TA = -40 to 125C for all packages Rev. 01 HT76LxxB PIN CONFIGURATIONS(TOP VIEW) IN 1 GND 2 EN 3 5 OUT HT76LxxB 4 BP/FB NOTES: 1.The location of pin 1 on the RExx is determined by orienting the package marking as shown. 2. “xx” is the output voltage code. (For Example: when the output voltage is 1.8V, it is expressed as 18.) ABSOLUTE MAXIMUM RATINGS IN to GND................................................-0.3V to 6V Output Short-Circuit Duration...................Infinite EN to GND............................................ -0.3V to VIN OUT, BP/FB to GND.............-0.3V to (VIN + 0.3V) Power Dissipation, PD @ TA = 25℃ SOT-23-5.............................................................0.4W SC70-5 .................................................................0.3W Package Thermal Resistance SOT-23-5,θJA...............................................260℃/W SC70-5,θJA....................................................330℃/W Operating Temperature Range..-40℃ to +85℃ Junction Temperature.................................... 150℃ Storage Temperature Range....-65℃ to +150℃ Lead Temperature (Soldering, 10s)..............260℃ ESD Susceptibility HBM....................................................................2000V MM....................................................................... 200V NOTE: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rev. 01 HT76LxxB PIN DESCRIPTION PIN NAME FUNCTION 1 IN Regulator Input. Supply voltage can range from 2.5V to 5.5V. Bypass with a 1µF capacitor to GND. 2 GND 3 EN Shutdown Input. A logic low reduces the supply current to 10nA. Connect to IN for normal operation. BP Reference-Noise Bypass (fixed voltage version only). Bypass with a low-leakage 0.01µF ceramic capacitor for reduced noise at the output. FB Adjustable Voltage Version Only. This is used to set the output voltage of the device. SC70-5/SOT-23-5 4 5 OUT Ground. Regulator Output. Rev. 01 HT76LxxB ELECTRICAL CHARACTERISTICS (1) (VIN = VOUT (NOMINAL) + 0.5V , Full = -40℃ to +85℃, unless otherwise noted.) PARAMETER SYMBOL Input Voltage CONDITIONS TEMP VIN Output Voltage Accuracy (1) IOUT = 0.1mA (1) (1) Dropout Voltage (2) Line Regulation (1) IQ 2.5 5.5 V -2.5 2.5 % +25℃ Load Regulation ΔVLDR Output Voltage Noise en Power Supply Rejection Ratio SHUTDOWN PSRR +25℃ No load, EN = 2V 310 500 100 +25℃ IOUT = 300mA VIN = 2.5V or (VOUT + 0.5V) to 5.5V, IOUT = 1mA IOUT =0.1mA to 300mA, COUT = 1µF, VOUT > 2V IOUT =0.1mA to 300mA, COUT = 1µF, VOUT ≤ 2V f = 10Hz to 100kHz, CBP = 0.01µF, COUT = 10µF CBP = 0.1μF, ILOAD = 50mA, COUT = 1μF, VIN = VOUT+1V mA 150 250 IOUT = 1mA ΔVLNR UNITS 300 VOUT = 1.2V, 1.5V, 1.8V, SC70-5 ILIM Ground Pin Current MAX +25℃ VOUT > 2V, SC70-5 Current Limit TYP +25℃ SOT-23-5 Maximum Output Current MIN mA 200 0.9 +25℃ +25℃ 270 400 0.02 0.05 0.002 0.005 0.004 0.008 µA mV %/V %/mA +25℃ 30 +25℃ µVRMS f = 217Hz +25℃ 77 dB f = 1kHz +25℃ 74 dB (3) VIH EN Input Threshold VIL EN Input Bias Current Shutdown Supply Current Shutdown Exit Delay VIN = 2.5V to 5.5V, VEN = -0.3V to VIN Full 1.5 Full 0.3 +25℃ 0.01 Full 0.01 Full 0.01 μA +25℃ 30 μs TSHDN 150 ℃ ΔTSHDN 15 ℃ IB(SHDN) EN = 0V or EN = 5.5V IQ(SHDN) EN = 0.4V (4) CBP = 0.01μF, COUT = 1μF, No Load 1 V μA THERMAL PROTECTION Thermal Shutdown Temperature Thermal Shutdown Hysteresis NOTES: 1. VIN = VOUT (NOMINAL) + 0.5V or 2.5V, whichever is greater. 2. The dropout voltage is defined as VIN - VOUT, when VOUT is 100mV below the value of VOUT for VIN = VOUT + 0.5V. (Only applicable for VOUT = +2.5V to +5.0V.) 3. VEN = -0.3V to VIN 4. Time needed for VOUT to reach 90% of final value. Rev. 01 HT76LxxB TYPICAL APPLICATION CIRCUIT INPUT 2.5V to 5.5V OUTPUT IN CIN 1μF ON OFF OUT R1 HT76LXX COUT 1μF FB EN R2 GND Standard 1% Resistor Values for Common Output Voltages of Adjustable Voltage Version VOUT (V) R1 (kΩ) R2 (kΩ) 1.2 0 63.4 1.5 10.5 42.2 1.8 34 63.4 2.8 84.5 63.4 3.0 63.4 42.2 3.3 73.2 42.2 3.6 84.5 42.2 4.2 105 42.2 NOTE: VOUT = (R1 + R2)/ R2 × 1.207 Rev. 01 HT76LxxB TYPICAL APPLICATION CIRCUIT INPUT 2.5V to 5.5V OUTPUT IN CIN 1μF OUT COUT 1μF HT76LXX ON EN OFF BP CBP 0.01μF GND CBP (nF) Shutdown Exit Delay (μs) PSRR (dB) at 217Hz VOUT = 2.8V, VIN = 3.3V, EN = 0V to 2V VOUT = 2.8V, VIN = VOUT + 1V ILOAD = 50mA ILOAD = 150mA ILOAD = 300mA ILOAD = 50mA ILOAD = 150mA ILOAD = 300mA None 21.5 21.5 21 71.1 64.4 55.0 0.001 21.5 21.5 22 71.1 64.6 55.1 0.01 22 22.5 22.5 71.6 64.7 55.2 0.1 22.5 23 23 71.7 64.8 55.4 1 25 27 28.5 72.1 65.2 55.9 10 30 35 39 74.3 68.8 59.6 100 265 280 300 77.0 73.7 63.1 Rev. 01 HT76LxxB TYPICAL PERFORMANCE CHARACTERISTICS VIN=VOUT(NOMINAL)+0.5V or 2.5V(whichever is greater),CIN=1µF, COUT=1µF, CBP=0.01µF,TA= +25℃, unless otherwise noted. Rev. 01 HT76LxxB TYPICAL PERFORMANCE CHARACTERISTICS VIN=VOUT(NOMINAL)+0.5V or 2.5V(whichever is greater),CIN=1µF, COUT=1µF, CBP=0.01µF,TA= +25℃, unless otherwise noted. Rev. 01 HT76LxxB TYPICAL PERFORMANCE CHARACTERISTICS VIN=VOUT(NOMINAL)+0.5V or 2.5V(whichever is greater),CIN=1µF, COUT=1µF, CBP=0.01µF,TA= +25℃, unless otherwise noted. Rev. 01 HT76LxxB TYPICAL PERFORMANCE CHARACTERISTICS VIN=VOUT(NOMINAL)+0.5V or 2.5V(whichever is greater),CIN=1µF, COUT=1µF, CBP=0.01µF,TA= +25℃, unless otherwise noted. Rev. 01 HT76LxxB TYPICAL PERFORMANCE CHARACTERISTICS VIN=VOUT(NOMINAL)+0.5V or 2.5V(whichever is greater),CIN=1µF, COUT=1µF, CBP=0.01µF,TA= +25℃, unless otherwise noted. Rev. 01 HT76LxxB APPLICATION NOTE When LDO is used in handheld products, attention must be paid to voltage spikes which could damage HT76LxxB. In such applications, voltage spikes will be generated at charger interface and VBUS pin of USB interface when charger adapters and USB equipments are hot-plugged. Besides this, handheld products will be tested on the production line without battery. Test engineer will apply power from the connector pin which connects with positive pole of the battery. When external power supply is turned on suddenly, the voltage spikes will be generated at the battery connector. The voltage spikes will be very high, and it always exceeds the absolute maximum input voltage (6.0V) of LDO. In order to get robust design, design engineer needs to clear up this voltage spike. Zener diode is a cheap and effective solution to eliminate such voltage spike. For example, BZM55B5V6 is a 5.6V small package Zener diode which can be used to remove voltage spikes in cell phone designs. The schematic is shown below. HT76L00B 1 Vcc Input 1µF 5 IN C2 C1 EN BZM55B5V6 VOUT 3 GND 2 4.7µF BP 4 0.01µF Control Rev. 01 HT76LxxB PACKAGE OUTLINE DIMENSIONS SOT23-5 D θ 0.20 Symbol L E E1 e C A1 e1 Min Max Min Max 1.250 0.041 0.049 A1 0.000 0.100 0.000 0.004 A2 1.050 1.150 0.041 0.045 b 0.300 0.400 0.012 0.016 c 0.100 0.200 0.004 0.008 D 2.820 3.020 0.111 0.119 E 1.500 1.700 0.059 0.067 E1 2.650 2.950 0.104 0.116 e1 A Dimensions In Inches 1.050 e A2 Dimensions In Millimeters A L b L 0.950TYP 1.800 2.000 0.700REF 0.037TYP 0.071 0.079 0.028REF L1 0.300 0.600 0.012 0.024 θ 0° 8° 0° 8° Rev. 01 HT76LxxB PACKAGE OUTLINE DIMENSIONS SC70-5 D θ e1 Symbol L1 E E1 L e b 0.20 A1 C Min Max Min Max 0.900 1.100 0.035 0.043 A1 0.000 0.100 0.000 0.004 A2 0.900 1.000 0.035 0.039 b 0.150 0.350 0.006 0.014 c 0.080 0.150 0.003 0.006 D 2.000 2.200 0.079 0.087 E 1.150 1.350 0.045 0.053 E1 2.150 2.450 0.085 0.096 e1 A2 Dimensions In Inches A e A Dimensions In Millimeters L 0.650TYP 1.200 1.400 0.525REF 0.026TYP 0.047 0.055 0.021REF L1 0.260 0.460 0.010 0.018 θ 0° 8° 0° 8° Rev. 01 HT76LxxB PACKAGE DIMENSIONS XDFN4 1.0x1.0, 0.65P X SUFFIX PIN ONE REFERENCE 2X 4X A B D E 4X 0.05 C L2 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20 mm FROM THE TERMINAL TIPS. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. b2 DETAIL A DIM A A1 A3 b b2 D D2 E e L L2 0.05 C 2X TOP VIEW (A3) 0.05 C A 0.05 C NOTE 4 A1 SIDE VIEW e DETAIL A e/2 1 4X 2 D2 45 5 C SEATING PLANE RECOMMENDED MOUNTING FOOTPRINT* L 0.65 PITCH D2 4 PACKAGE OUTLINE 3 4X BOTTOM VIEW b 0.05 MILLIMETERS MIN MAX 0.33 0.43 0.00 0.05 0.10 REF 0.15 0.25 0.02 0.12 1.00 BSC 0.43 0.53 1.00 BSC 0.65 BSC 0.20 0.30 0.07 0.17 4X M 0.11 2X 0.52 4X 0.39 C A B 1.20 NOTE 3 4X 0.24 4X 0.26 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Rev. 01