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P-Channel 60 V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
• TrenchFET® power MOSFET
-60
RDS(on) (Ω) at VGS = -10 V
0.050
RDS(on) (Ω) at VGS = -4.5 V
0.060
ID (A) per leg
• 100 % Rg and UIS tested
-8
S
SO-8
S
1
8
D
S
2
7
D
S
3
6
D
G
4
5
D
G
D
Top View
P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
SYMBOL
LIMIT
Drain-Source Voltage
VDS
-60
Gate-Source Voltage
VGS
± 20
PARAMETER
Continuous Drain Current
TC = 25 °C
TC = 125 °C
ID
-4.75
-4.5
Pulsed Drain Current a
IDM
-32
Single Pulse Avalanche Current
IAS
-22.4
EAS
25
Single Pulse Avalanche Energy
Maximum Power Dissipation a
L = 0.1 mH
TC = 25 °C
TC = 125 °C
PD
TJ, Tstg
Operating Junction and Storage Temperature Range
V
-8
IS
Continuous Source Current (Diode Conduction)
UNIT
5
1.67
-55 to +175
A
mJ
W
°C
THERMAL RESISTANCE RATINGS
PARAMETER
Junction-to-Ambient
Junction-to-Foot (Drain)
PCB Mount b
SYMBOL
LIMIT
RthJA
110
RthJF
30
UNIT
°C/W
Notes
a. Pulse test; pulse width ≤ 300 μs, duty cycle ≤ 2 %.
b. When mounted on 1" square PCB (FR-4 material).
c. Parametric verification ongoing.
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SPECIFICATIONS (TC = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN.
TYP.
MAX.
VDS
VGS = 0 V, ID = -250 μA
-60
-
-
VGS(th)
VDS = VGS, ID = -250 μA
-1.0
IGSS
VDS = 0 V, VGS = ± 20 V
-
-
± 100
-1
UNIT
Static
Drain-Source Breakdown Voltage
Gate-Source Threshold Voltage
Gate-Source Leakage
IDSS
Zero Gate Voltage Drain Current
On-State Drain Current a
ID(on)
Drain-Source On-State Resistance a
Forward
Transconductance b
RDS(on)
gfs
-2.5
VGS = 0 V
VDS = -60 V
-
-
VGS = 0 V
VDS = -60 V, TJ = 125 °C
-
-
-50
VGS = 0 V
VDS = -60 V, TJ = 175 °C
-
-
-150
VGS = -10 V
VDS ≤ -5 V
-30
-
-
VGS = -10 V
ID = -4.3 A
-
0.050
-
VGS = -10 V
ID = -4.3 A, TJ = 125 °C
-
0.070
-
VGS = -10 V
ID = -4.3 A, TJ = 175 °C
-
0.080
-
VGS = -4.5 V
ID = -3.8 A
-
0.060
-
-
13
-
-
1530
1910
VDS = -15 V, ID = -4.3 A
V
nA
μA
A
Ω
S
Dynamicb
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
Total Gate Charge c
Qg
Gate-Source Charge c
Qgs
Gate-Drain Charge c
Qgd
Gate Resistance
Rg
Turn-On Delay Time c
Rise Time c
Turn-Off Delay
Fall Time c
Source-Drain Diode Ratings and
VGS = -10 V
VDS = -30 V, f = 1 MHz
VDS = -30 V, ID = -5 A
f = 1 MHz
td(on)
tr
Time c
VGS = 0 V
td(off)
VDD = -30 V, RL = 8.8 Ω
ID ≅ -5 A, VGEN = -10 V, Rg = 1 Ω
tf
-
334
417
-
114
142
-
43.4
65
-
4.7
-
-
9
-
1.3
2.5
4
-
11
17
pF
nC
Ω
-
11
17
-
35
52
-
6
9
-
-
-32
A
-
-0.8
-1.2
V
ns
Characteristicsb
Pulsed Current a
ISM
Forward Voltage
VSD
IF = -2.8 A, VGS = 0 V
Notes
a. Pulse test; pulse width ≤ 300 μs, duty cycle ≤ 2 %.
b. Guaranteed by design, not subject to production testing.
c. Independent of operating temperature.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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TYPICAL CHARACTERISTICS (TA = 25 °C, unless otherwise noted)
30
30
VGS = 10 V thru 5 V
24
VGS = 4 V
ID - Drain Current (A)
ID - Drain Current (A)
24
18
12
VGS = 3 V
6
18
TC = 25 °C
12
6
TC = 125 °C
TC = - 55 °C
0
0
0
2
4
6
8
0
10
2
4
6
VGS - Gate-to-Source Voltage (V)
Output Characteristics
Transfer Characteristics
10
25
8
20
gfs - Transconductance (S)
ID - Drain Current (A)
TC = 25 °C
6
TC = 25 °C
4
2
8
VDS - Drain-to-Source Voltage (V)
TC = 125 °C
10
TC = - 55 °C
15
TC = 125 °C
10
5
TC = - 55 °C
0
0
1
2
3
4
0
5
2
4
6
VGS - Gate-to-Source Voltage (V)
ID - Drain Current (A)
Transfer Characteristics
Transconductance
0.18
3000
0.13
2400
C - Capacitance (pF)
RDS(on) - On-Resistance (Ω)
0
0.10
VGS = 4.5 V
0.07
0.04
1800
48
60
1200
Coss
Crss
0.01
10
Ciss
600
VGS = 10 V
8
0
0
6
12
18
24
30
0
12
24
36
ID - Drain Current (A)
VDS - Drain-to-Source Voltage (V)
On-Resistance vs. Drain Current
Capacitance
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TYPICAL CHARACTERISTICS (TA = 25 °C, unless otherwise noted)
10
2.0
RDS(on) - On-Resistance (Normalized)
VGS - Gate-to-Source Voltage (V)
ID = 5 A
VDS = 30 V
8
6
4
2
0
0
9
18
27
36
ID = 3.5 A
1.4
VGS = 4.5 V
1.1
0.8
0.5
- 50 - 25
45
0
Qg - Total Gate Charge (nC)
50
75
100
125
150
175
On-Resistance vs. Junction Temperature
100
0.5
10
0.4
RDS(on) - On-Resistance (Ω)
IS - Source Current (A)
25
TJ - Junction Temperature (°C)
Gate Charge
TJ = 150 °C
1
TJ = 25 °C
0.1
VGS = 10 V
1.7
0.3
0.2
0.01
0.1
0.001
0.0
TJ = 150 °C
TJ = 25 °C
0.0
0.2
0.4
0.6
0.8
1.0
1.2
0
4
6
8
10
VGS - Gate-to-Source Voltage (V)
Source Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
0.9
- 60
VDS - Drain-to-Source Voltage (V)
ID = 1 mA
0.7
VGS(th) Variance (V)
2
VSD - Source-to-Drain Voltage (V)
ID = 250 μA
0.5
0.3
ID = 5 mA
0.1
- 0.1
- 0.3
- 50 - 25
0
25
50
75
100
TJ - Temperature (°C)
Threshold Voltage
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125
150
175
- 65
- 70
- 75
- 80
- 50 - 25
0
25
50
75
100
125
150
175
TJ - Junction Temperature (°C)
Drain Source Breakdown vs. Junction Temperature
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THERMAL RATINGS (TA = 25 °C, unless otherwise noted)
100
IDM Limited
ID - Drain Current (A)
10
100 μs
Limited by RDS(on)*
1 ms
1
10 ms
100 ms
0.1
TC = 25 °C
Single Pulse
0.01
0.01
0.1
BVDSS Limited
1
10
1s
10 s, DC
100
VDS - Drain-to-Source Voltage (V)
* VGS > minimum VGS at which RDS(on) is specified
Safe Operating Area
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
0.05
t1
t2
1. Duty Cycle, D =
t1
t2
2. Per Unit Base = R thJA = 105 °C/W
0.02
3. T JM - TA = PDMZthJA(t)
Single Pulse
0.01
10 -4
10 -3
4. Surface Mounted
10 -2
10 -1
1
10
100
600
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Ambient
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THERMAL RATINGS (TA = 25 °C, unless otherwise noted)
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10 -4
10 -3
10 -2
10 -1
1
10
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Foot
Note
• The characteristics shown in the two graphs
- Normalized Transient Thermal Impedance Junction-to-Ambient (25 °C)
- Normalized Transient Thermal Impedance Junction-to-Foot (25 °C)
are given for general guidelines only to enable the user to get a “ball park” indication of part capabilities. The data are extrac ted from single
pulse transient thermal impedance characteristics which are developed from empirical measurements. The latter is valid for the part
mounted on printed circuit board - FR4, size 1" x 1" x 0.062", double sided with 2 oz. copper, 100 % on both sides. The part capabilities
can widely vary depending on actual application parameters and operating conditions.
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SOIC (NARROW): 8-LEAD
JEDEC Part Number: MS-012
8
6
7
5
E
1
3
2
H
4
S
h x 45
D
C
0.25 mm (Gage Plane)
A
e
B
All Leads
q
A1
L
0.004"
MILLIMETERS
DIM
Min
INCHES
Max
Min
Max
A
1.35
1.75
0.053
0.069
A1
0.10
0.20
0.004
0.008
B
0.35
0.51
0.014
0.020
C
0.19
0.25
0.0075
0.010
D
4.80
5.00
0.189
0.196
E
3.80
4.00
0.150
e
0.101 mm
1.27 BSC
0.157
0.050 BSC
H
5.80
6.20
0.228
0.244
h
0.25
0.50
0.010
0.020
L
0.50
0.93
0.020
0.037
q
0°
8°
0°
8°
S
0.44
0.64
0.018
0.026
ECN: C-06527-Rev. I, 11-Sep-06
DWG: 5498
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RECOMMENDED MINIMUM PADS FOR SO-8
0.172
(4.369)
0.028
0.022
0.050
(0.559)
(1.270)
0.152
(3.861)
0.047
(1.194)
0.246
(6.248)
(0.711)
Recommended Minimum Pads
Dimensions in Inches/(mm)
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