SS32B

SS32B THRU SS3200B Reverse Voltage - 20 to 200 Volts Forward Current - 3.0 Ampere SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER DO-214AA/SMB Features  The plastic package carries Underwriters Laboratory Flammability Classification 94V-0  For surface mounted applications  Metal silicon junction,majority carrier conduction  Low power loss,high efficiency 0.155(3.95) 0.130(3.30) 0.086 (2.20) 0.071 (1.80)  Built-in strain relief,ideal for automated placement 0.185(4.70) 0.160(4.05)  High forward surge current capability  High temperature soldering guaranteed: 0.012(0.305) 0.006(0.152) 250 °C/10 seconds at terminals 0.098(2.45) 0.080(2.00) 0.062(1.55) 0.030(0.75) 0.008(0.203)MAX. Mechanical Data 0.224(5.60) 0.196(4.90) Case: JEDEC DO-214AA/SMB molded plastic body Terminals: Solderable per MIL-STD-750,Method 2026 Polarity: Color band denotes cathode end Mounting Position: Any Weight : 0.003 ounce, 0.095 grams Dimensions in inches and (millimeters) Maximum Ratings And Electrical Characteristics Ratings at 25 C ambient temperature unless otherwise specified. Single phase half-wave 60Hz,resistive or inductive load,for capacitive load current derate by 20%. Parameter SYMBOLS Marking Code Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage VRRM VRMS VDC MDD SS32B MDD SS33B MDD SS34B MDD SS35B MDD SS36B MDD SS38B MDD SS310B MDD SS3150B MDD SS3200B UNITS 20 14 20 30 21 30 40 28 40 50 35 50 60 42 60 80 56 80 100 70 100 150 105 150 200 140 200 V V V Maximum average forward rectified current I(AV) 3 A Peak forward surge current 8.3ms single half sine-wave superimposed onrated load (JEDEC Method) IFSM 80 A Maximum instantaneous forward voltage at 3.0A VF Maximum DC reverse current at rated DCblocking voltage TA=25℃ TA=100℃ Typical junction capacitance (NOTE 1) 0.55 IR CJ 0.5 0.7 0.85 5 450 400 V 0.95 0.3 3 mA pF Typical thermal resistance (NOTE 2) RJA 60 ℃/W Operating junction temperature range TJ -55 to +150 ℃ TSTG -55 to +150 ℃ Storage temperature range Note:1.Measured at 1MHz and applied reverse voltage of 4.0V D.C. 2.P.C.B. mounted with 2.0”x2.0”(5.0x5.0cm) copper pad areas http://www.microdiode.com Rev:2025A4 Page :1 SS32B THRU SS3200B Reverse Voltage - 20 to 200 Volts Forward Current - 3.0 Ampere Typical Characterisitics Fig.2 Typical Reverse Characteristics 3.5 3.0 2.4 1.8 1.2 0.6 0.0 25 50 75 100 125 150 Instaneous Reverse Current ( μA) Average Forward Current (A) Fig.1 Forward Current Derating Curve 10 4 10 3 10 2 TJ=100°C TJ=75°C SS32B~SS36B TJ=25°C 0 10 0 Case Temperature (°C) 40 60 100 80 Fig.4 Typical Junction Capacitance TJ=25°C 20 1000 10 1.0 Junction Capacitance (pF) 500 SS32B~SS34B SS35B~SS36B SS38B~SS310B SS315B~SS3200B 0.1 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 200 100 20 SS32B~SS36B SS38B~SS3200B 10 0.1 Fig.5 Maximum Non-Repetitive Peak Forward Surage Current 100 Fig.6- Typical Transient Thermal Impedance 100 60 40 20 8.3 ms Single Half Sine Wave (JEDEC Method) 1 10 Number of Cycles at 60Hz 100 Transient Thermal Impedance（°C/W） 100 80 00 10 1 Reverse Voltage (V) Instaneous Forward Voltage (V) Peak Forward Surage Current (A) 20 Percent of Rated Peak Reverse Voltage（%） Fig.3 Typical Forward Characteristic Instaneous Forward Current (A) SS38B~SS3200B 101 10 1 0.01 0.1 1 10 100 t, Pulse Duration（sec） The curve above is for reference only. http://www.microdiode.com Rev:2025A4 Page :2 SS32B THRU SS3200B Reverse Voltage - 20 to 200 Volts Forward Current - 3.0 Ampere Packing information unit:mm P0 P1 Item Symbol Tolerance SMB Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width A B C d D D1 D2 E F P P0 P1 T W Reel width W1 0.1 0.1 0.1 0.05 2.0 min 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.3 1.0 3.81 5.41 2.42 1 50 . 330.00 50.00 13.00 1.75 5.55 8.00 4.00 2.00 0.30 12.00 12.30 d E F B A W P D2 T D1 C W1 D Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. Reel packing PACKAGE REEL SIZE REEL (pcs) COMPONENT SPACING (mm) BOX (pcs) INNER BOX (mm) REEL DIA, (mm) SMB 13" 3,000 4.0 6,000 340*350*40 330 CARTON SIZE (mm) 370*370*370 CARTON (pcs) APPROX. GROSS WEIGHT (kg) 48 ,000 14.0 Suggested Pad Layout Unit (inch) Symbol Unit (mm) A 2.8 0.110 B 0.094 C 2.4 4.6 0.181 D 2.2 0.086 E 7.0 0.276 Important Notice and Disclaimer Microdiode Electronics (Shenzhen) reserves the right to make changes to this document and its products and specifications at any time without notice. Customers should obtain and confirm the latest product information and specifications before final design,purchase or use. Microdiode Electronics (Shenzhen) makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, not does Microdiode Electronics (Shenzhen) assume any liability for application assistance or customer product design. Microdiode Electronics (Shenzhen) does not warrant or accept any liability with products which are purchased or used for any unintended or unauthorized application. No license is granted by implication or otherwise under any intellectual property rights of Microdiode Electronics (Shenzhen). Microdiode Electronics (Shenzhen) products are not authorized for use as critical components in life support devices or systems without express written approval of Microdiode Electronics (Shenzhen). http://www.microdiode.com Rev:2025A4 Page :3