0
登录后你可以
  • 下载海量资料
  • 学习在线课程
  • 观看技术视频
  • 写文章/发帖/加入社区
会员中心
创作中心
发布
  • 发文章

  • 发资料

  • 发帖

  • 提问

  • 发视频

创作活动
LN210421Q1CFR

LN210421Q1CFR

  • 厂商:

    LEN(瓴芯)

  • 封装:

    DFN8_EP

  • 描述:

    线性稳压器/LDO 输入2.75V~42V 输出0.6V~24V DFN8_EP

  • 数据手册
  • 价格&库存
LN210421Q1CFR 数据手册
LN21042Q1 LEN Technology LTD. V0.3 - December 2023 2.75V-42V, Low IQ, LDO Linear Regulator 1 FEATURES ⚫ ⚫ ⚫ ⚫ ⚫ ⚫ ⚫ 3 DESCRIPTION Automotive AEC-Q100 Grade 1 Qualified Ultra-Low IQ 7.5µA Wide Input Voltage Range: 2.75V to 42V ±2% FB Tolerance for Adjustable Output Up to 200mA Output Current Shutdown Current 1µA PG Indicator with Adjustable Delay Time for MCU Applications High PSRR 70dB @ 100Hz Stable Operation with only 1µF Low-ESR Ceramic Output Capacitor LN21042Q1 is an ultra-low quiescent current, low dropout linear regulator (LDO) with a wide input voltage range of 2.75V to 42V. The series provides 0.6V to 24V adjustable output and delivers up to 200mA output current. Typical shutdown current of LN21042Q1 is less than 1μA, while the quiescent current under no-load condition is 7.5μA. ⚫ Low Dropout:260mV @ 200mA ⚫ Up to 42V High Voltage EN Pin with Logic Threshold Over-Current Protection Over Temperature Shutdown and Auto Restart Internal Soft Start -40˚C to 150 ˚C Junction Temperature Product Package: DFN-EP8 Package with Wettable Flanks DFN-EP8 Package without Wettable Flank LN21042Q1 features over-current protection and over-temperature shutdown with auto restart. The product family is available in DFN-EP8 package with wettable flanks and without wettable flank. ⚫ ⚫ ⚫ ⚫ ⚫ ⚫ ⚫ LN21042Q1 provides a power good indicator with programmable delay to directly drive the reset pin of a microprocessor (MCU). Typical MCU Application Diagram 2 APPLICATIONS ⚫ ⚫ ⚫ Automotive Power Supplies Industrial Power Supplies Battery Powered Systems NDA Confidential LEN Technology LTD. LN21042Q1 Table of Contents 1 FEATURES ........................................................................................................................................................................ 1 2 APPLICATIONS ................................................................................................................................................................. 1 3 DESCRIPTION ................................................................................................................................................................... 1 4 VERSION HISTORY ........................................................................................................................................................... 3 5 ORDER INFORMATION .................................................................................................................................................... 4 6 PIN CONFIGURATION AND FUNCTION ............................................................................................................................ 5 7 8 9 6.1 Pin Configuration ..................................................................................................................................................... 5 6.2 Pin Function ............................................................................................................................................................. 5 SPECIFICATIONS .............................................................................................................................................................. 6 7.1 Absolute Maximum Ratings ..................................................................................................................................... 6 7.2 ESD Ratings .............................................................................................................................................................. 6 7.3 Recommended Operating Condition ....................................................................................................................... 6 7.4 Package Thermal Parameters .................................................................................................................................. 7 7.5 Electrical Characteristics .......................................................................................................................................... 8 7.6 Typical Characteristics ........................................................................................................................................... 10 FUNCTIONAL DESCRIPTION........................................................................................................................................... 14 8.1 Overview ................................................................................................................................................................ 14 8.2 Functional Diagram ................................................................................................................................................ 14 APPLICATIONS ............................................................................................................................................................... 15 9.1 Application Diagram .............................................................................................................................................. 15 9.2 Application Considerations .................................................................................................................................... 15 10 PACKAGE INFORMATION .............................................................................................................................................. 16 10.1 Package Outline ..................................................................................................................................................... 16 IMPORTANT NOTICE AND DISCLAIMERS ............................................................................................................................. 18 ENVIRONMENTAL DECLARATION ........................................................................................................................................ 18 2 NDA Confidential LEN Technology LTD. LN21042Q1 4 VERSION HISTORY Version Change Record Time 0.1 Initial Draft 2023/4/20 0.2 Add New Part Number, Typical Characteristic Curves, Waveforms and POD 2023/10/11 0.3 Fix error in block diagram; Fix writing/editing errors. 2023/12/20 Note: For the product datasheet with version number 0.X, the corresponding product is an unreleased product. LEN Technology Ltd. reserves the right to make any changes to the product and the documents and services related to the product and does not need to notify the recipient of this document. 3 NDA Confidential LEN Technology LTD. LN21042Q1 5 ORDER INFORMATION Top Marking (2) Part Number VOUT Max Load IQ IC Package MSL-PeakTemp (1) LN210421Q1CFR Adjustable 200mA 7.5uA DFN-EP8 with wettable flanks Level-2-260C RoHS Tape & Reel 3000 0421 LN210421Q1NFR Adjustable 200mA 7.5uA DFN-EP8 without wettable flank Level-2-260C RoHS Tape & Reel 3000 0421N Material Package Qty (1) MSL (Moisture Sensitivity Level) is based on JEDEC industrial classification, and the tabled temperature is the maximum solder temperature; (2) There may be additional marking related to the internal trace code on the device. 4 NDA Confidential LEN Technology LTD. LN21042Q1 6 PIN CONFIGURATION AND FUNCTION 6.1 Pin Configuration DFN-EP8 (3mm X 3mm) Top View 6.2 Pin Function Name Number Description IN 1 Input pin, place a ceramic capacitor of at least 1µF between IN and GND. EN 2 Enable pin, connect to a logic control signal or to IN directly. NC 3 No internal connection. Recommend connecting to GND. GND 4 Connect to GND. FB 5 Feedback pin, connect through a resistor divider to the output for operation. NC 6 No internal connection. Recommend connecting to GND. NC 7 No internal connection. Recommend connecting to GND. OUT 8 Output pin, place a ceramic capacitor of at 1µF between OUT and GND. Thermal Pad - Connect the pad to GND for best thermal performance. 5 NDA Confidential LEN Technology LTD. LN21042Q1 SPECIFICATIONS 7.1 Absolute Maximum Ratings Parameters Min Max VIN -0.3 45 VEN -0.3 VIN VFB -0.3 5.5 VOUT -0.3 VIN Operating Junction Temperature -40 150 Operating Ambient Temperature -40 125 Storage Temperature -55 150 Min Max Unit V ˚C 7.2 ESD Ratings Parameters HBM Human Body Model ±2000 CDM Charge Device Model ±750 Unit V 7.3 Recommended Operating Condition Parameters Min Max VIN 2.75 42 VEN 0 VIN VFB 0 0.7 VOUT 0.6 24 Operating Junction Temperature -40 150 Unit V ˚C 6 NDA Confidential LEN Technology LTD. LN21042Q1 7.4 Package Thermal Parameters Parameter (1) DFN-EP8 Units RθJA Junction-to-Ambient Thermal Resistance 53 ˚C/W ψJT Junction-to-Top Characterization Parameter 3 ˚C/W (1) Measurements are based on standard 2s2p PCB defined in JESD 51-7 2s2p,under no wind, 2W loss, and 25˚C ambient temperature. 7 NDA Confidential LEN Technology LTD. LN21042Q1 7.5 Electrical Characteristics Unless otherwise stated, the minimum and maximum limits apply over the recommended operating junction temperature range of -40˚C to 150˚C. Typical values are measured at 25˚C and represent the most likely norm. The default conditions apply: VIN = 13.5V. SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS VIN, VOUT (IN, OUT, GND PINS) VIN VOUT Operating Input Voltage Range Operating Output Voltage Range for Adjustable Output 2.75 42 V 0.6 24 V ISHDN Input Shutdown Current VEN = 0V, VIN = 13.5V 0.8 3 µA IQ Input Quiescent Current VEN = 5V, VIN = 13.5V, IOUT = 0A 7.5 17 µA 0.588 0.6 0.612 V -0.1 0 0.1 µA 2 % REGULATION, (OUT, FB PINS) VFB Regulated Feedback Voltage VFB = VOUT, 4.3V
LN210421Q1CFR 价格&库存

很抱歉,暂时无法提供与“LN210421Q1CFR”相匹配的价格&库存,您可以联系我们找货

免费人工找货