QTH-120-01-F-D-A

F-211-1 QTH–090–01–C–D–A ® QTH–030–01–L–D–A–RT1 (0,50mm) .0197" QTH–060–07–F–D–A QTH SERIES HIGH SPEED GROUND PLANE HEADER SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?QTH Insulator Material: Liquid Crystal Polymer Terminal Material: Phosphor Bronze Plating: Au or Sn over 50µ" (1,27µm) Ni Current Rating: Contact: 1.0A @ 30°C Temperature Rise Ground Plane: 7.8A @ 30°C Temperature Rise Operating Temp Range: -55°C to +125°C Voltage Rating: 125 VAC (5mm Stack Height) Max Cycles: 100 Unmating Force (-RT1 option): -RT1 option increases unmating force up to 50% RoHS Compliant: Yes Processing: Lead–Free Solderable: Yes SMT Lead Coplanarity: (0,10mm) .004" max (030-060) (0,15mm) .006" max (090-120) Board Stacking: For applications requiring more than two connectors per board or 4 banks or more, contact ipg@samtec.com APPLICATION SPECIFIC OPTION • 14mm, 15mm, 22mm and 30mm stack height (Caution: Some automatic placement/inspection machines may have component height restrictions. Please consult machinery specifications.) • 30µ" (0,76µm) Gold (Specify -H plating for Data Rate cable mating applications.) • Edge Mount & Guide Posts • 150 positions per row Call Samtec. Integral metal plane for power or ground Board Mates: QSH Cable Mates: HFHM2, HQCD, HQDP (See Application Specific note) Note: Some lengths, styles and options are non-standard, non-returnable. fina sport™ Hypertran XAUI ® s E I PC xpres SATA Infiniband EXTENDED LIFE PRODUCT 10 year Mixed Flowing Gas with 50µ" Gold Call Samtec for maximum cycles mated with QSH 5mm Stack Height Type Rated @ 3dB Insertion Loss Single-Ended Signaling –D 9 GHz / 18 Gbps Differential Pair Signaling –D 8 GHz / 16 Gbps Differential Pair Signaling –DP 9.5 GHz / 19 Gbps Performance data for other stack heights and complete test data available at www.samtec.com?QTH or contact sig@samtec.com PINS PER ROW NO. OF PAIRS QTH –030, –060, –090, –120 (60 total pins per bank = –D) –020, –040, –060, –080 Polarized notes at Download app ppnote /a m co c. www.samte mtec.com sa @ IG S t Contac protocols on s on for questi ALSO AVAILABLE Board Spacing Standoffs. See SO Series. LEAD STYLE PLATING OPTION Specify LEAD STYLE from chart –F –D = Gold Flash on Signal Pins and Ground Plane, Matte Tin on tails = Single-Ended (20 pairs per bank = –D–DP) A TYPE –D–DP = Differential Pair (–01 only) = 10µ" (0,25µm) Gold on Signal Pins and Ground Plane, Matte Tin on tails –DP = (No. of Pairs per Row/20) x (20,00) .7875 (20,00) .7875 01 02 (0,50) .0197 (0,20) .008 A A –01 & –02 –03 thru –07 (3,30) .130 (1,57) .062 (1,57) .062 DIA –RT1 = Electro-Polished Selective 50µ" (1,27µm) min Au over 150µ" (3,81µm) Ni on Signal Pins in contact area, 10µ" (0,25µm) min Au over 50µ" (1,27µm) Ni on Ground Plane in contact area, Matte Tin over 50µ" (1,27µm) min Ni on all solder tails –TR –RT1 QTH LEAD STYLE –01 –02 –03 –04 –05 (0,64) .025 –L WWW.SAMTEC.COM = (7,00mm) .275" DIA Polyimide film Pick & Place Pad (N/A with -05 & -07 lead style) = Tape & Reel (–090 positions maximum) –C* (7,11) .280 OTHER OPTION –K –L –D = (No. of Pins per Row/30) x (20,00) .7875 (0,89) .035 DIA • Retention pin option s ocol Prot orted Supp l i nch.com TM (0,76) .030 *Note: –C Plating passes 10 year MFG testing ® Standard Stack Heights from 5mm to 25mm –07 A HEIGHT WITH QSH* (4,27) .168 (7,26) .286 (10,27) .404 (15,25) .600 (18,26) .718 (24,24) .954 (5,00) .197 (8,00) .315 (11,00) .433 (16,00) .630 (19,00) .748 (25,00) .984 *Processing conditions will affect mated height. = Retention Option (–01 lead style only & –090 positions maximum) –L = Latching Option (–01 lead style only) (N/A on –090 & –120 or –RT1 option)