MB1-120-01-SM-S-02-SL

F-224 SUPPLEMENT MB1–130–01–F–S–01–SL–N MB1–130–01–F–S–01–SL (1.00 mm) .0394" MB1 SERIES MINI EDGE CARD SOCKET WITH GUIDES SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?MB1 Choice of two card thicknesses Mates with: (0.80 mm) .031" PCB, (1.60 mm) .062" PCB Insulator Material: Black LCP Contact Material: BeCu Plating: Sn or Au over 50 µ" (1.27 µm) Ni Current Rating: 2.2 A per pin (6 pins powered) Operating Temp Range: -55 °C to +125 °C Insertion Depth: (5.26 mm) .207" to (6.10 mm) .240" RoHS Compliant: Yes (5.44 mm) .214" (1.00 mm) .03937" pitch PROCESSING Lead–Free Solderable: Yes SMT Lead Coplanarity: (0.10 mm) .004" max (20-30) (0.15 mm) .006" max (40-50)* *(.004" stencil solution may be available; contact ipg@samtec.com) MB1 1 NO. OF PINS 01 PLATING OPTION CARD SLOT S RECOGNITIONS For complete scope of recognitions see www.samtec.com/quality = Gold flash on contact, Matte Tin on tail (No. of Positions + 2) x (1.00) .03937 + (4.06) .160 FILE NO. E111594 –L (3.81) .150 = 10 µ" (0.25 µm) Gold on contact, Matte Tin on tail ALSO AVAILABLE (MOQ Required) CARD SLOT • Other platings A (0.97) –01 –02 .038 (1.83) .072 = No Card Guides MATES WITH BOARD THICKNESS (0.80) .031 (1.60) .062 (25.5) 1.004 (7.24) .285 (7.24) .285 01 (1.00) .03937 –N OPTION 50 (0.36) .014 (1.27) .050 (No. of Positions + 2) x (1.00) .03937 (1.52) .060 Note: Some sizes, styles and options are non-standard, non-returnable. (5.44) .214 (1.27) .050 DIA OTHER OPTION –N Specify CARD SLOT from chart –F 20, 30, 40, 50 SL A (0.15) .006 (0.69) .027 (1.27) .050 (2.36) .093 Important Note: Samtec recommends that pads on the mating board be Gold plated. WWW.SAMTEC.COM Unless otherwise approved in writing by Samtec, all parts and components are designed and built according to Samtec’s specifications which are subject to change without notice.