QTS-075-01-L-D-RA-WT-LS2 数据手册
F-214
QTS–025–01–L–D–A
®
QTS–050–01–F–D–A
QTS–075–01–F–D–A
(0,635 mm) .025"
QTS SERIES
HIGH SPEED GROUND PLANE HEADER
SPECIFICATIONS
Board Mates:
QSS
For complete specifications and
recommended PCB layouts see
www.samtec.com?QTS
Cable Mates:
SQCD
Insulator Material:
Liquid Crystal Polymer
Contact Material:
Phosphor Bronze
Plating:
Au or Sn over
50µ" (1,27 µm) Ni
Current Rating:
Contact:
1.8 A per pin
(1 pin powered per row)
Ground Plane:
7.8 A per ground plane
(1 ground plane powered)
Operating Temp:
-55°C to +125°C
Voltage Rating: 285 VAC
Max Cycles: 100
RoHS Compliant: Yes
Processing:
Lead–Free Solderable: Yes
SMT Lead Coplanarity:
(0,10 mm) .004" max (025-075)
Board Stacking:
For applications requiring more
than two connectors per board
contact ipg@samtec.com
Integral metal plane
for power or ground
Alignment
Pin
QTS/QSS
Type
Rated @ 3dB Insertion Loss*
5 mm Stack Height
Single-Ended Signaling
–D
9 GHz / 18 Gbps
Differential Pair Signaling
–D
8.5 GHz / 17 Gbps
Differential Pair Signaling –DP
8.5 GHz / 17 Gbps
*Performance data includes effects of a non-optimized PCB.
Performance data for other stack heights and complete
test data available at www.samtec.com?QTS or contact
sig@samtec.com
NO. OF POSITIONS
PER ROW
QTS
Polarized
(0,635 mm)
.025"
pitch
OTHER SOLUTIONS
• Board spacing
standoffs
(See SO Series)
LEAD
STYLE
PLATING
OPTION
D
OTHER
OPTION
A
RECOGNITIONS
For complete scope
of recognitions see
www.samtec.com/quality
–025, –050, –075
(50 total positions per bank)
Specify
LEAD
STYLE
from
chart.
ALSO AVAILABLE
(MOQ Required)
• 11 mm & 16 mm stack
height (Caution: Some
automatic placement/
inspection machines may
have component height
restrictions. Please consult
machinery specifications.)
• 30µ" (0,76 µm) Gold
• Differential Pair and
“Partitionable” (combine
differential & single-ended
banks in same connector)
available.
• 100 & 125 positions per row
• Edge Mount
Contact Samtec.
–F
= Gold Flash on Signal Pins
and Ground Plane,
Matte Tin on tails
–K
–L
= (7,00 mm)
.275" DIA
Polyimide film
Pick &
Place Pad
= 10µ" (0,25 µm) Gold on Signal
Pins and Ground Plane,
Matte Tin on tails
= Tape & Reel
–TR
–C*
= Electro-Polished Selective
50µ" (1,27 µm) min Au over
150µ" (3,81 µm) Ni on Signal
Pins in contact area,
10µ" (0,25 µm) min Au over
50µ" (1,27 µm) Ni on Ground
Plane in contact area,
Matte Tin over 50µ" (1,27 µm)
min Ni on all solder tails
(No. of Positions per Row/25) x (20,00) .7875
(20,00) .7875
01
(5,97)
.235
(7,11)
.280
02
(0,635) .025
(0,20) .008
(0,76)
.030
A
(0,89)
.035
DIA
*Note: –C Plating passes
10 year MFG testing
Note: Some lengths, styles
and options are non-standard,
non-returnable.
WWW.SAMTEC.COM
STACK HEIGHTS
LEAD
MATED
A
STYLE
HEIGHT
–01
–02
(4,27) .168 (5,00) .197
(7,26) .286 (8,00) .315
Processing conditions will
affect mated height.
QTS-075-01-L-D-RA-WT-LS2 价格&库存
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