LTH-010-01-G-D-A-TR

LSH–030–01–G–D–A F-215 (Rev 14AUG15) LSH–050–01–G–D–A LSH–010–01–G–D–A LTH–010–01–G–D–A LTH–030–01–G–D–A LTH–050–01–G–D–A (0.50 mm) .0197" LTH, LSH SERIES LOW PROFILE BLADE AND BEAM LTH Mates with: LSH NO. OF POSITIONS PER ROW LTH LSH Mates with: LTH PLATING OPTION 01 D OTHER OPTION A SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?LTH or www.samtec.com?LSH Insulator Material: Liquid Crystal Polymer Terminal Material: Phosphor Bronze Contact Material: BeCu Plating: Au over 50µ" (1.27 µm) Ni Operating Temp Range: -55°C to +125°C RoHS Compliant: Yes –K –G –010, –020, –030, –040, –050 = (5.50 mm) .217" DIA Polyimide Film Pick & Place Pad = 10µ" (0.25 µm) Gold (No. of positions per row +2) x (0.50) .01969 + (2.79) .110 –TR 01 = Tape and Reel (1.27) .050 (0.76) .030 (4.80) .189 02 (0.20) .008 (0.50) .01969 (1.68) .066 (1.55) .061 (0.89) .035 Processing: Lead-Free Solderable: Yes SMT Lead Coplanarity: (0.10 mm) .004" max Board Stacking: For applications requiring more than two connectors per board, contact ipg@samtec.com (0.76) .030 DIA (No. of positions per row +2) x (0.50) .01969 + (1.27) .050 (5.05) .199 RECOGNITIONS For complete scope of recognitions see www.samtec.com/quality NO. OF POSITIONS PER ROW LSH 01 –010, –020, –030, –040, –050 PLATING OPTION –G = 10µ" (0.25 µm) Gold MATED HEIGHT LEAD STYLE MATED HEIGHT* –01 (2.31) .091 *Processing conditions will affect mated height. (No. of positions per row + 2) x (0.50) .01969 + (4.06) .160 (0.74) .029 02 (0.50) .01969 OTHER OPTION –K = (7.50 mm) .295" DIA Polyimide Film Pick & Place Pad –TR (1.22) .048 (0.15) .006 (1.91) .075 (0.89) .035 (No. of positions per row + 2) x (0.50) .01969 + (1.91) .075 A = Tape and Reel (6.50) .256 01 D (0.76) .030 DIA (6.73) .265 Note: Some lengths, styles and options are non-standard, non-returnable. WWW.SAMTEC.COM Due to technical progress, all designs, specifications and components are subject to change without notice.