HLE-123-02-L-DV-BE-A-P-TR

COST-EFFECTIVE RELIABLE SOCKET (2.54 mm) .100" PITCH • HLE SERIES HLE Board Mates: TSW, MTSW, DW, EW, ZW, TLW, TSM, MTLW, HW HLE -1 NO. PINS PER ROW - 02 - 02 thru 50 - DV - –F TAIL OPTION Leave blank for Surface Mount (Requires –BE for Bottom Entry) = Gold flash on contact, Matte Tin on tail SPECIFICATIONS Insulator Material: Black Liquid Crystal Polymer Contact Material: BeCu Plating: Au or Sn over 50 µ" (1.27 µm) Ni Current Rating (HLE/TSM): 4.1 A per pin (2 pins powered) Voltage Rating: 400 VAC Operating Temp Range: -55 °C to +125 °C Insertion Depth: (1.78 mm) .070" to (3.43 mm) .135" pass-through, or (2.59 mm) .102" min plus board thickness for bottom entry PLATING OPTION –TE –L = Through-hole Top Entry = 10 µ" (0.25 µm) Gold on contact, Matte Tin on tail –PE = Through-hole Pass-through Entry (Requires –BE for Bottom Entry) 1RRI3RVLWLRQV[   –BE = Bottom Entry (Not available with –TE) –A = Alignment Pin (4 positions min.) Metal or plastic at Samtec discretion (Not available with -TE, -PE & -LC) –LC = Locking Clip (2 positions min.) (Not available with -A) (Manual placement required) = (6.50 mm) .256" DIA Polyimide Film Pick & Place Pad (3 positions min.) Not available with –TE or –PE tail option     Lead–Free Solderable: Yes SMT Lead Coplanarity: (0.10 mm) .004" max (02-20) (0.15 mm) .006" max (21-50)* *(.004" stencil solution may be available; contact ipg@samtec.com) OTHER OPTION –K   PROCESSING - –P = Metal Pick & Place Pad (3 positions min.) –TR = Tape & Reel (29 positions max.) –FR   —PE   = Full Reel Tape & Reel (must order max. quantity per reel; contact Samtec for quantity breaks) ALSO AVAILABLE MOQ Required Other Platings     —TE Note: Some lengths, styles and options are non-standard, non-returnable. F-224 —P —LC —A samtec.com?HLE Unless otherwise approved in writing by Samtec, all parts and components are designed and built according to Samtec’s specifications which are subject to change without notice.