KP15TL-SF(800)

FLYER Space-saving, micro SD™/nano SIM Combo Card Socket Features Dimensions 1 Combo socket for nano SIM & micro SDTM cards produces a space saving design (Top slot : micro SD card, bottom slot : nano SIM card) 2 User friendly card removal design with top and bottom slot 3 Easy inspection with exposed contact design 4 User-friendly reverse card insertion prevention 5 Card detection switch for microSD and nano SIM cards Specifications User friendly card removal design Unit : mm micro SD Pull 2.0 Battery micro SDTM removal (Top) To eject micro SD card, simply pull out micro SD card Contact Resistance 100ｍΩ Max. Withstanding Voltage 500V AC for 1 minute No need to remove battery pack Mold Resistance 1,000MΩ Min. (500V DC) Rated Current 0.5A Rated Voltage 10V AC Operating Temperature -30℃ to +85℃ Mating cycles 10,000 times (micro SD) 5,000 times (nano Sim) Battery nano SIM removal (Bottom) Easy to eject nano SIM card by simply sliding eject bar with a finger ・ RoHS compliant, Halogen-free product* No need to remove upper card Eject bar Pull Jul.1.2020 Copyright 2020 HIROSE ELECTRIC CO., LTD. All Rights Reserved. KP15B Series Height 2.0ｍｍ nano SIM *This product satisfies halogen free requirements defined as 900ppm maximum chlorine.900ppm maximum bromine, and 1500ppm maximum total of chlorine and bromine ※ Please contact Hirose’s sales representative prior to adopting the products to in-vehicle devices. MKT-J-17196F Issued: Feb. 5, 2018 © 2018 HIROSE ELECTRIC CO., LTD. All rights reserved. Specifications herein are subject to change without notice. Contact Hirose for the latest specifications, drawings, and availabilities. Jul.1.2020 Copyright 2020 HIROSE ELECTRIC CO., LTD. All Rights Reserved. KP15TLSeries Height 2.0ｍｍ Bar-Push with Tray,3-in-2 Hybrid Card Connector Features Dual card use design Combo Type nano SIM A ’ nano SIM×2 nano SIM Easy to remove tray with eject pin 2 3 in 2 hybrid design provides various usage patterns. 3 Buckling prevention eliminates contact damage 4 Enhanced durability with ample eject bar thickness (40N) 5 Card detection switch Specifications Buckling prevention design Dual Sim card Type micro SD™ + nano SIM 1 nano SIM Dual-contact design allows the longer contact to reach tray first, and then the shorter contact smoothly moves along with it. When the tray passes on the main contact, there will be no contact buckling. A Main-Contact Sub-Contact Tray ejection (0.1) FLYER ⇒ Can be use in 2 cards patterns 100ｍΩ Max. Withstanding Voltage 500V AC for 1 minute Mold Resistance 1000MΩ Min. (500V DC) Rated Current 0.5A Rated Voltage 10V AC Operating Temperature -30℃ to +85℃ Mating cycles 3,000 times ・ RoHS compliant, Halogen-free product* (A-A’) *Note : Tray is not included and should be prepared by customers. Contact Resistance Dimension of Contact tail to mold *This product satisfies halogen free requirements defined as 900ppm maximum chlorine.900ppm maximum bromine, and 1500ppm maximum total of chlorine and bromine ※ Please contact Hirose’s sales representative prior to adopting the products to in-vehicle devices. MKT-J-17196F Issued: Feb. 5, 2018 © 2018 HIROSE ELECTRIC CO., LTD. All rights reserved. Specifications herein are subject to change without notice. Contact Hirose for the latest specifications, drawings, and availabilities.