QSFP8-038-01-L-D-RA1-TR

F-218 (Rev 29MAR18) QSFPC–PF–02 QSFP8–038–01–L–D–RA1 (0.80 mm) .0315" QSFP8, QSFPC-PF, QSFPK-PF SERIES QSFP CONNECTOR & CAGE SPECIFICATIONS QSFP8 For complete specifications and recommended PCB layouts see www.samtec.com?QSFP8 Insulator Material: LCP Contact Material: Phosphor Bronze Ground Plane: Phosphor Bronze Plating: Au or Sn over 50 µ" (1.27 µm) Ni Current Rating (QSFP8/Card): 1.6 A per pin (2 pins powered) NO. OF POSITIONS CARD THICKNESS D PLATING –01 = (1.00 mm) .039" thick card –038 = Total Number of Positions –L = 10 µ" (0.25 µm) Gold on contact, Matte Tin on tail (18.20) .717 (0.80) .0315 (1.40) .055 DIA RECOGNITIONS For complete scope of recognitions see www.samtec.com/quality (1.10) .043 (1.40) .055 FILE NO. E111594 (14.40) .567 BOTTOM VIEW Note: Some lengths, styles and options are non-standard, non-returnable. SPECIFICATIONS TERMINATION TYPE For complete specifications see www.samtec.com?QSFPC-PF or www.samtec.com?QSFPK-PF OPTION –PF –01 = Press-fit QSFPC = Without Heat Sink = Cage –02 = With Heat Sink QSFPK = Cage and Connector Kit –03 = With Heat Sink and clip packaged separately (Recommended for cage press-fit processing) (58.80) 2.315 (20.76) .817 (19.94) .785 (45.65) 1.797 Heat Sink (11.91) .469 Note: Some sizes, styles and options are non-standard, non-returnable. RA1 –02 SHOWN (7.20) .283 Due to technical progress, all designs, specifications and components are subject to change without notice. WWW.SAMTEC.COM All parts within this catalog are built to Samtec’s specifications. Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.