QSH-060-01-L-D-DP-A-GP

® 25 (0.50 mm) .0197" PITCH • QTH/QSH SERIES QTH Board Mates: QSH QTH - QSH –030, –060, –090 Board Mates: QTH –020, –040, –060 Cable Mates: HQCD, HQDP Standoffs: SO LEAD STYLE Insulator Material: Liquid Crystal Polymer Contact Material: Phosphor Bronze Plating: Au or Sn over 50 µ" (1.27 µm) Ni Current Rating: Contact: 2 A per pin (2 pins powered) Ground Plane: 25 A per ground plane (1 ground plane powered) Operating Temp Range: -55 °C to +125 °C Voltage Rating: 175 VAC (5 mm Stack Height) Max Cycles: 100 –F = Gold flash on contact, Matte Tin on tail –L - - –D A HEIGHT WITH QSH* –01 (4.27) .168 (5.00) .197 –02 (7.26) .286 (8.00) .315 –03 (10.27) .404 (11.00) .433 –04 (15.25) .600 (16.00) .630 –05 (18.26) .718 (19.00) .748 –07 (24.24) .954 (25.00) .984 –09 (13.26) .522 (14.00) .551 - OTHER OPTIONS A TYPE –K = SingleEnded –D-DP = Differential Pair (–01 only) –TR =Tape & Reel (Not available with –05 & –07 lead style) –FR –L = Full Reel Tape & Reel (must order max. quantity per reel; contact Samtec for quantity breaks) (Not available with –05 & –07 lead style) = Latching Option (–01 lead style only) (Not available on –060 (–D–DP) & –090) = 50 µ" (1.27 µm) Electro-Polished Selective Gold on contact, Matte Tin on tail (passes 10 year MFG testing) ”X”R Leave blank for Tray Packaging = (7.00 mm) .275" DIA Polyimide film Pick & Place Pad (Not available with -05 & -07 lead style) –C QTH LEAD STYLE –D = (No. of Pins per Row/30) x (20.00) .7875 –DP = (No. of Pairs per Row/20) x (20.00) .7875 (20.00) .7875 (7.11) .280 (0.76) .030 A A *Processing conditions will affect mated height. See SO Series for board space tolerances. –01 & –02 –03 THRU –09 View complete specifications at: samtec.com?QTH PROCESSING QSH - PINS PER ROW NO. OF PAIRS - - - –F = Gold flash on contact, Matte Tin on tail (60 total pins per bank = –D) –L –020, –040, –060 = 10 µ" (0.25 µm) Gold on contact, Matte Tin on tail (20 pairs per bank = –D–DP) TYPE –D = SingleEnded –D–DP = Differential Pair –C PISMO™ 1: Visit samtec.com/standards for more information. –D = (No. of Pins per Row/30) x (20.00) .7875 + (1.27) .050 10 YEAR MFG PLATING OPTION 01 –030, –060, –090 STANDARDS = 50 µ" (1.27 µm) Electro-Polished Selective Gold on contact, Matte Tin on tail (passes 10 year MFG testing) - A OTHER OPTIONS –K = (8.25 mm) .325" DIA Polyimide film Pick & Place Pad –L = Latching Option (Not available on –060 (–D–DP) & –090) - ”X”R Leave blank for Tray Packaging –TR =Tape & Reel (N/A –05 to –07 lead style) –FR = Full Reel Tape & Reel (must order max. quantity per reel; contact Samtec for quantity breaks) ) –DP = (No. of Pairs per Row/20) x (20.00) .7875 + (1.27) .050 (20.00) .7875 EXTENDED LIFE PRODUCT HIGH MATING CYCLES - PLATING OPTION = 10 µ" (0.25 µm) Gold on contact, Matte Tin on tail (20 pairs per bank = –D–DP) SPECIFICATIONS - Specify LEAD STYLE from chart (60 total pins per bank = –D) QTH/QSH Lead–Free Solderable: Yes SMT Lead Coplanarity: (0.10 mm) .004" max (030-060) (0.15 mm) .006" max (090)* *(.004" stencil solution may be available; contact ipg@samtec.com) Board Stacking: For applications requiring more than two connectors contact ipg@samtec.com - PINS PER ROW NO. OF PAIRS (7.49) .295 (7.24) .285 (0.76) .030 Note: Some lengths, styles and options are non-standard, non-returnable. (3.05) .120 (3.25) .128 View complete specifications at: samtec.com?QSH samtec.com/QSeries Unless otherwise approved in writing by Samtec, all parts and components are designed and built according to Samtec’s specifications which are subject to change without notice. F-224