QSH-060-01-F-D-DP-A-TR

F-214 QSH–060–01–L–D–DP–A QSH–060–01–L–D–A–K ® QSH–030–01–F–D–A (0,50 mm) .0197" QSH SERIES HIGH SPEED GROUND PLANE SOCKET SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?QSH Insulator Material: Liquid Crystal Polymer Contact Material: Phosphor Bronze Plating: Au or Sn over 50µ" (1,27 µm) Ni Current Rating: Contact: 2 A per pin (1 pin powered per row) Ground Plane: 25 A per ground plane (1 ground plane powered) Operating Temp Range: -55°C to +125°C Voltage Rating: 125 VAC (5 mm Stack Height) Max Cycles: 100 RoHS Compliant: Yes Processing: Lead-Free Solderable: Yes SMT Lead Coplanarity: (0,10 mm) .004" max (030-060) (0,15 mm) .006" max (090) Board Stacking: For applications requiring more than two connectors per board contact ipg@samtec.com Blade & Beam Design Board Mates: QTH Integral metal plane for power or ground Cable Mates: HQCD, HQDP (See Also Available note) 100 GbE ™ transport er yp H XAUI ® s PCI Expres SATA ™ InfiniBand notes at Download app ppnote /a om c.c te www.sam @ samtec.com Contact SIG on protocols for questions Rated @ 3dB Insertion Loss with PCB effects* w/o PCB effects** Single-Ended Signaling –D 9 GHz / 18 Gbps 9.5 GHz / 19 Gbps Differential Pair Signaling –D 8 GHz / 16 Gbps 10.5 GHz / 21 Gbps Differential Pair Signaling –DP 9.5 GHz / 19 Gbps 16.5 GHz / 33 Gbps *Performance data includes effects of a non-optimized PCB. **Test board losses de-embedded from performance data. Performance data for other stack heights and complete test data available at www.samtec.com?QSH or contact sig@samtec.com QTH/QSH 5 mm Stack Height Type PINS PER ROW NO. OF PAIRS QSH 01 RECOGNITIONS PLATING OPTION A TYPE OTHER OPTION –F For complete scope of recognitions see www.samtec.com/quality = Gold Flash on Signal Pins and Ground Plane, Matte Tin on tails –030, –060, –090 (60 total pins per bank = –D) –020, –040, –060 ALSO AVAILABLE –DP = (No. of Pairs per Row/20) x (20,00) .7875 + (1,27) .050 (20,00) .7875 –C* 02 (7,49) .295 01 (0,50) .0197 (0,15) .006 (3,25) .128 (3,05) .120 (7,24) .285 (0,76) .030 (0,89) .035 DIA = Electro-Polished Selective 50µ" (1,27 µm) min Au over 150µ" (3,81 µm) Ni on Signal Pins in contact area, 10µ" (0,25 µm) min Au over 50µ" (1,27 µm) Ni on Ground Plane in contact area, Matte Tin over 50µ" (1,27 µm) min Ni on all solder tails QTH MATED LEAD HEIGHT STYLE WITH QSH* –01 –02 –03 –04 –05 –07 –L WWW.SAMTEC.COM (5,00) .197 (8,00) .315 –TR = Tape & Reel (–090 positions maximum) –L = Latching Option (N/A on –060 (–D–DP) & –09 positions) (11,00) .433 (16,00) .630 (19,00) .748 (25,00) .984 *Processing conditions will affect mated height. *Note: –C Plating passes 10 year MFG testing (0,64) .025 –K = (8,25 mm) .325" DIA Polyimide Film Pick & Place Pad = Differential Pair (–01 only) = 10µ" (0,25 µm) Gold on Signal Pins and Ground Plane, Matte Tin on tails –D = (No. of Pins per Row/30) x (20,00) .7875 + (1,27) .050 (MOQ Required) –D = SingleEnded –D–DP –L (20 pairs per bank = –D–DP) FILE NO: 090871_0_000 • 14 mm, 15 mm, 22 mm and 30 mm stack height (Caution: Some automatic placement/inspection machines may have component height restrictions. Please consult machinery specifications.) • 30µ" (0,76 µm) Gold (Specify -H plating for Data Rate cable mating applications.) • Edge Mount & Guide Posts • 80 (-DP), 120, 150 positions per row • Retention Option Contact Samtec. s ocol t o r d P orte p p u S Note: Some lengths, styles and options are non-standard, non-returnable. OTHER SOLUTIONS • Board Spacing Standoffs. See SO Series