QTE-060-02-H-D-A-K

1-DH1 F-219 QTE–014–01–F–D–DP–A ® QTE–040–01–L–D–A QTE–060–01–L–D–A (0.80 mm) .0315" QTE SERIES HIGH-SPEED GROUND PLANE HEADER Integral metal plane for power or ground Board Mates: QSE SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?QTE Standard stack heights from 5 mm to 25 mm Cable Mates: EQCD, EQDP (See Also Available Note) Insulator Material: Liquid Crystal Polymer Terminal Material: Phosphor Bronze Plating: Au or Sn over 50 µ" (1.27 µm) Ni Current Rating: Contact: 2 A per pin (2 pins powered) Ground Plane: 23 A per ground plane (1 ground plane powered) Operating Temp Range: -55 °C to +125 °C Voltage Rating: 225 VAC mated with QSE & 5 mm Stack Height Max Cycles: 100 RoHS Compliant: Yes Standoffs: SO POWER/SIGNAL APPLICATION Compatible with UMPT/UMPS for flexible two-piece power/signal solutions PROCESSING Lead–Free Solderable: Yes SMT Lead Coplanarity: (0.10 mm) .004" max (020-060) Board Stacking: For applications requiring more than two connectors per board contact ipg@samtec.com QTE-D/QSE-D or QTE-DP/QSE-DP @ 5 mm Mated Stack Height Rating based on Samtec reference channel.For full SI performance data visit Samtec.comor contact SIG@samtec.com PINS PER ROW NO. OF PAIRS QTE –020, –040, –060 (40 total pins per bank = –D) RECOGNITIONS –014, –028, –042 ALSO AVAILABLE Note: Some lengths, styles and options are non-standard, non-returnable. QTE-DP/QSE-DP G b p s Specify LEAD STYLE from chart –F = Gold Flash on Signal Pins and Ground Plane, Matte Tin on tails –L FILE NO. E111594 01 02 (0.80) .0315 (0.20) .008 A *Note: –C Plating passes 10 year MFG testing –L G b p s OTHER OPTION A TYPE –K –D = (7.00 mm) .275" DIA Polyimide Film Pick & Place Pad = Single-Ended –D–DP = Differential Pair (–01 only) –TR = Tape & Reel Packaging (N/A –05 & –07 lead style) –L –C* = Electro-Polished Selective (7.11) .280 50 µ" (1.27 µm) min Au over 150µ" (3.81 µm) Ni on Signal Pins in contact area, 10 µ" (0.25 µm) min Au over 50 µ" (1.27 µm) Ni on Ground Plane in contact area, Matte Tin over 50µ" (1.27 µm) min Ni on all solder tails (0.76) .030 (0.89) .035 DIA HIGH MATING CYCLES = 10 µ" (0.25 µm) Gold on Signal Pins and Ground Plane, Matte Tin on tails –D = (No. of Positions per Row/20) x (20.00) .7875 (20.00) .7875 (5.97) .235 EXTENDED LIFE PRODUCT 14 28 PLATING OPTION –D–DP = (No. of Positions per Row/14) x (20.00) .7875 • 15 mm, 22 mm and 30 mm stack height • 30 µ" (0.76 µm) Gold (Specify -H plating for Data Rate cable mating applications.) • Edge Mount, Guide Posts, Screw Down & Friction Lock • 56 (-DP), 80, 100 positions per row • Retention Option QTE-D/QSE-D LEAD STYLE (14 pairs per bank = –D–DP) For complete scope of recognitions see www.samtec.com/quality (MOQ Required) 10 YEAR MFG WITH 50 µ" GOLD HIGH-SPEED CHANNEL PERFORMANCE (0.64) .025 = Latching Option (N/A on –042 & –060 positions) QTE LEAD STYLE –01 –02 –03 –04 –05 –07 –09 HEIGHT WITH QSE* (4.27) .168 (5.00) .197 (7.26) .286 (8.00) .315 (10.27) .404 (11.00) .433 (15.25) .600 (16.00) .630 (18.26) .718 (19.00) .748 (24.24) .954 (25.00) .984 (13.26) .522 (14.00) .551 *Processing conditions will affect mated height. See SO Series for board space tolerances Due to technical progress, all designs, specifications and components are subject to change without notice. WWW.SAMTEC.COM A All parts within this catalog are built to Samtec’s specifications. Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.