QTH-090-02-F-D-A-TR

F-213 QTH–090–01–C–D–A ® (0,50 mm) .0197" QTH–030–01–L–D–A QTH–060–07–F–D–A QTH SERIES HIGH SPEED GROUND PLANE HEADER SPECIFICATIONS Integral metal plane for power or ground Board Mates: QSH Standard Stack Heights from 5 mm to 25 mm ® For complete specifications and recommended PCB layouts see www.samtec.com?QTH Insulator Material: Liquid Crystal Polymer Terminal Material: Phosphor Bronze Plating: Au or Sn over 50µ" (1,27 µm) Ni Current Rating: Contact: 1.0A per contact @ 30°C Temperature Rise Ground Plane: 7.8A per ground plane @ 30°C Temperature Rise Operating Temp Range: -55°C to +125°C Voltage Rating: 125 VAC (5 mm Stack Height) Max Cycles: 100 RoHS Compliant: Yes Processing: Lead–Free Solderable: Yes SMT Lead Coplanarity: (0,10 mm) .004" max (030-060) (0,15 mm) .006" max (090) Board Stacking: For applications requiring more than two connectors per board contact ipg@samtec.com Cable Mates: HQCD, HQDP (See Application Specific note) fina TM s ocol Prot orted Supp EXTENDED LIFE PRODUCT 10 year Mixed Flowing Gas with 50µ" Gold Call Samtec for maximum cycles mated with QSH Type LEAD STYLE PINS PER ROW NO. OF PAIRS QTH Specify LEAD STYLE from chart –030, –060, –090 (60 total pins per bank = –D) –020, –040, –060 APPLICATION SPECIFIC OPTION • 14 mm, 15 mm, 22 mm and 30 mm stack height (Caution: Some automatic placement/inspection machines may have component height restrictions. Please consult machinery specifications.) • 30µ" (0,76 µm) Gold (Specify -H plating for Data Rate cable mating applications.) • Edge Mount & Guide Posts • 80 (-DP), 120, 150 positions per row • Retention Option Call Samtec. *Note: –C Plating passes 10 year MFG testing Note: Some lengths, styles and options are non-standard, non-returnable. 100 GbE ™ sport Hyper tran XAUI ® s PCI Expres SATA ™ InfiniBand Rated @ 3dB Insertion Loss with PCB effects* w/o PCB effects** Single-Ended Signaling –D 9 GHz / 18 Gbps 9.5 GHz / 19 Gbps Differential Pair Signaling –D 8 GHz / 16 Gbps 10.5 GHz / 21 Gbps Differential Pair Signaling –DP 9.5 GHz / 19 Gbps 16.5 GHz / 33 Gbps *Performance data includes effects of a non-optimized PCB. **Test board losses de-embedded from performance data. Performance data for other stack heights and complete test data available at www.samtec.com?QTH or contact sig@samtec.com QTH/QSH 5 mm Stack Height (20 pairs per bank = –D–DP) notes at Download app ppnote /a om c.c www.samte @ samtec.com G SI t ac nt Co on protocols for questions PLATING OPTION 01 = Gold Flash on Signal Pins and Ground Plane, Matte Tin on tails = Single-Ended –C* (7,11) .280 (0,50) .0197 (0,20) .008 A A –01 & –02 –03 thru –07 (0,76) .030 (0,89) .035 DIA (0,64) .025 –L WWW.SAMTEC.COM OTHER OPTION –K –D = 10µ" (0,25 µm) Gold on Signal Pins and Ground Plane, Matte Tin on tails –DP = (No. of Pairs per Row/20) x (20,00) .7875 (20,00) .7875 A TYPE –F –L –D = (No. of Pins per Row/30) x (20,00) .7875 02 l i nch.com = Electro-Polished Selective 50µ" (1,27 µm) min Au over 150µ" (3,81 µm) Ni on Signal Pins in contact area, 10µ" (0,25 µm) min Au over 50µ" (1,27 µm) Ni on Ground Plane in contact area, Matte Tin over 50µ" (1,27 µm) min Ni on all solder tails –D–DP = Differential Pair (–01 only) = (7,00 mm) .275" DIA Polyimide film Pick & Place Pad (N/A with -05 & -07 lead style) –TR QTH LEAD STYLE –01 –02 –03 –04 –05 –07 = Tape & Reel HEIGHT (–090 positions maximum) WITH QSH* A (4,27) .168 (7,26) .286 (10,27) .404 (15,25) .600 (18,26) .718 (24,24) .954 (5,00) .197 (8,00) .315 (11,00) .433 (16,00) .630 (19,00) .748 (25,00) .984 –L = Latching Option (–01 lead style only) (N/A on –060 (–D–DP), –080, –090 & –120) *Processing conditions will affect mated height. ALSO AVAILABLE Board Spacing Standoffs. See SO Series.