LPAF-30-03.0-S-08-2-K-TR

LOW PROFILE OPEN-PIN-FIELD ARRAYS (1.27 mm) .050" PITCH FEATURES & BENEFITS • 4 mm, 4.5 mm, 5 mm stack heights • Up to 400 I/Os • 4, 6 and 8 row designs • .050" (1.27 mm) pitch • Dual beam contact system LPAF Dual Beam Contact • Solder crimp termination for ease of processing • Board stacking standoffs available to assist with unmating and reduce risk for component damage on board LPAM Dual Blade Terminal MAXIMUM GROUNDING & ROUTING FLEXIBILITY (32.16) 1.266 (10.72) .422 LPAM Series; 120 pins (0.51 mm) .020" Nominal Wipe Differential Pair Single-Ended Power KEY SPECIFICATIONS (LPAM/LPAF) PITCH TOTAL PINS INSULATOR MATERIAL CONTACT MATERIAL PLATING CURRENT RATING WORKING VOLTAGE LEAD-FREE SOLDERABLE 1.27 mm x 1.27 mm Up to 400 I/Os Black LCP Copper Alloy Au or Sn over 50 µ" (1.27 µm) Ni 2.2 A per pin (8 adjacent pins powered) 250 VAC YES F-224 samtec.com/LPArray Unless otherwise approved in writing by Samtec, all parts and components are designed and built according to Samtec’s specifications which are subject to change without notice. (1.27 mm) .050" PITCH • LOW PROFILE OPEN-PIN-FIELD ARRAYS SERIES - NO. PINS PER ROW LPAM –10, –20, –30, –40, Terminal LPAF –50 Socket (-08 rows only) - - LEAD STYLE –01.0 PLATING OPTION - NO. OF ROWS –L = (1.0 mm) .039" (LPAM only) = 10 µ" (0.25 µm) Gold on contact area, Matte Tin on solder tail –01.5 = (1.5 mm) .060" (LPAM only) - –04 –1 –06 –08 –03.0 –03.5 = (3.5 mm) .138" (LPAF only) –2 Board Mates: LPAF Standoffs: JSO, SO –TR =Tape & Reel –FR =Full Reel Tape & Reel (must order max. quantity per reel; contact Samtec for quantity breaks) No. of positions x (1.27) .050 + (6.76) .266 LPAM = Polyimide film Pick & Place Pad = Lead-Free Solder Crimp = 30 µ" (0.76 µm) Gold on contact area, Matt Tin on solder tail "X"R –K = Tin/Lead Alloy Solder Crimp –S = (3.0 mm) .118" (LPAF only) -K- SOLDER TYPE NO. OF ROWS B A No. of positions x (1.27) .050 + (3.10) .122 B –04 (8.18) .322 –06 (10.72) .422 –08 (13.26) .522 LEAD STYLE A -01.0 (3.68) .145 -01.5 (4.19) .165 View complete specifications at: samtec.com?LPAM No. of positions x (1.27) .050 + (5.15) .203 LPAF Board Mates: LPAM Standoffs: JSO, SO NO. OF ROWS B A No. of positions x (1.27) .050 + (3.10) .122 B –04 (6.71) .264 –06 (9.25) .364 –08 (11.79) .464 LEAD STYLE A -03.0 (2.79) .110 -03.5 (3.30) .130 MATED HEIGHTS* LPAF LEAD STYLE LPAM LEAD STYLE -03.0 -03.5 –01.0 (4.00) .157 (4.50) .177 –01.5 (4.50) .177 (5.00) .197 *Processing conditions will affect mated height. Notes: Some sizes, styles and options are non-standard, non-returnable View complete specifications at: samtec.com?LPAF samtec.com/LPArray Unless otherwise approved in writing by Samtec, all parts and components are designed and built according to Samtec’s specifications which are subject to change without notice. F-224