MIS-038-01-L-D-K-TR

F-224 SUPPLEMENT MIS–019–01–F–D ® MIS–057–01–L–D MIS–038–01–F–D MIS SERIES (0.635 mm) .025" MIXED TECHNOLOGY SOCKET SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?MIS Board Mates: MIT Standoffs: SO Integral metal plane for power or ground Insulator Material: Liquid Crystal Polymer Contact Material: Phosphor Bronze Plating: Au or Sn over 50 µ" (1.27 µm) Ni Operating Temp Range: -55 °C to +125 °C Voltage Rating: 275 VAC Max Cycles: 100 RoHS Compliant: Yes Polarized PROCESSING Lead–Free Solderable: Yes SMT Lead Coplanarity: (0.10 mm) .004" max (019-057) Board Stacking: For applications requiring more than two connectors per board contact ipg@samtec.com 76 signal lines per linear inch MIS RECOGNITIONS For complete scope of recognitions see www.samtec.com/quality POSITIONS PER ROW D = Gold Flash on Signal Pins and Ground Plane, Matte Tin on tails —L Leave blank for tray packaging = (7.00 mm) .275" DIA Polyimide film Pick & Place Pad —TR =Tape & Reel —FR = 10 µ" (0.25 µm) Gold on Signal Pins and Ground Plane, Matte Tin on tails ALSO AVAILABLE (MOQ Required) —C* • 11 mm, 16 mm, 18.75 mm and 22 mm stack height • 30 µ" (0.76 µm) Gold • Differential Pair and “Partitionable” (combine differential & single-ended banks in same connector) available. • 76, 95, 114 and 133 positions per row = Electro-Polished Selective 50 µ" (1.27 µm) min Au over 150 µ" (3.81 µm) Ni on Signal Pins in contact area, 10 µ" (0.25 µm) min Au over 50 µ" (1.27 µm) Ni on Ground Plane *Note: in contact area, Matte Tin over 50 µ" –C Plating passes 10 year (1.27 µm) min Ni on all solder tails MFG testing = Full Reel Tape & Reel (must order max. quantity per reel; contact Samtec for quantity breaks) (No. of Positions/19) x (12.70) .500 + (12.70) .500 (12.70) .500 01 (6.22) .245 MATED HEIGHT* (0.635) .025 (0.15) .006 MIS LEAD STYLE 02 (1.32) .052 (3.43) .135 (0.69) .027 Note: Some lengths, styles and options are non-standard, non-returnable. PACKAGING OPTION —K —F —019, —038, —057 (38 total positions per bank) FILE NO. E111594 PLATING OPTION 01 Note: Rugged through-hole ground plane soldered to board (requires paste-over-hole, not press-fit) for added retention to PCB. (7.49) .295 (3.63) .143 (0.18) .007 –01 MIT LEAD STYLE –01 –02 (5.00) (8.00) .197 .315 *Processing conditions will affect mated height. See SO Series for board space tolerances. WWW.SAMTEC.COM Unless otherwise approved in writing by Samtec, all parts and components are designed and built according to Samtec’s specifications which are subject to change without notice.