HDAF-23-18.0-S-13-2-P

F-224 SUPPLEMENT HDAF–23–08.0–S–13–2 (2.00 mm) .0787" HDAF SERIES HDAF–15–18.0–S–13–2 RUGGED ELEVATED HIGH-DENSITY ARRAY SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?HDAF Mates with: HDAM Intermateable with Molex HD Mezz Insulator Material: Black LCP Contact Material: Copper Alloy Plating: Au or Sn over 50 µ" (1.27 µm) Ni Current Rating: 3.4 A per pin (6 adjacent pins powered) Operating Temp Range: -55 °C to +125 °C Working Voltage: 200 VAC Mated Cycles: 100 RoHS Compliant: Yes Lead-Free Solderable: Yes Open-pin-field for Single-Ended or Differential Pair configurations 299, 195 and 143 pins Lead-Free Solder Charge Elevated stack heights of 20 mm, 25 mm, 30 mm and 35 mm RECOGNITIONS For complete scope of recognitions see www.samtec.com/quality NO. PINS PER ROW HDAF LEAD STYLE PLATING OPTION Specify LEAD STYLE from chart = 30 µ" (0.76 µm) Gold on contact area, Matte Tin on tails and guide pins FILE NO. E111594 DIFFERENTIAL APPLICATIONS —11, —15, —23 (1.20) .0472 (2.00) .0787 —S 13 SOLDER TYPE OPTION —P —2 = Lead-Free Tin Alloy 95.5% Sn/ 3.8% Ag/0.7% Cu Solder Charge = Pick & Place Pad 11x13 15x13 23x13 —FR 44 60 92 No. of Pins Per Row x (2.00) .0787 + (11.55) .455 ALSO AVAILABLE (MOQ Required) • Tin-Lead Solder Charge • Other platings 1A —TR = Full Reel Tape & Reel (must order max. quantity per reel; contact Samtec for quantity breaks) PAIR COUNT* *2:1 S:G Ratio Leave blank for tray packaging =Tape & Reel (22.50) .886 ARRAY PACKAGING LEAD STYLE No. of Pins Per Row x (2.00) .0787 + (17.92) .706 —08.0 —18.0 A (10.51) .414 (20.51) .807 1M (2.00) .0787 Notes: HD Mezz is a trademark of Molex Incorporated (1.20) .0472 A Some lengths, styles and options are non-standard, non-returnable. WWW.SAMTEC.COM Unless otherwise approved in writing by Samtec, all parts and components are designed and built according to Samtec’s specifications which are subject to change without notice.