QTH-020-03-L-D-DP-A-K

F-214 QTH–090–01–C–D–A ® QTH–030–01–L–D–A QTH–060–07–F–D–A (0,50 mm) .0197" QTH SERIES HIGH SPEED GROUND PLANE HEADER SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?QTH Insulator Material: Liquid Crystal Polymer Terminal Material: Phosphor Bronze Plating: Au or Sn over 50µ" (1,27 µm) Ni Current Rating: Contact: 2 A per pin (1 pin powered per row) Ground Plane: 25 A per ground plane (1 ground plane powered) Operating Temp Range: -55°C to +125°C Voltage Rating: 125 VAC (5 mm Stack Height) Max Cycles: 100 RoHS Compliant: Yes Processing: Lead–Free Solderable: Yes SMT Lead Coplanarity: (0,10 mm) .004" max (030-060) (0,15 mm) .006" max (090) Board Stacking: For applications requiring more than two connectors per board contact ipg@samtec.com Integral metal plane for power or ground Board Mates: QSH Standard Stack Heights from 5 mm to 25 mm Cable Mates: HQCD, HQDP (See Also Available note) 100 GbE ™ transport er yp H XAUI ® s PCI Expres SATA ™ InfiniBand notes at Download app ppnote /a om c.c te m www.sa @ samtec.com Contact SIG on protocols for questions Rated @ 3dB Insertion Loss with PCB effects* w/o PCB effects** Single-Ended Signaling –D 9 GHz / 18 Gbps 9.5 GHz / 19 Gbps Differential Pair Signaling –D 8 GHz / 16 Gbps 10.5 GHz / 21 Gbps Differential Pair Signaling –DP 9.5 GHz / 19 Gbps 16.5 GHz / 33 Gbps *Performance data includes effects of a non-optimized PCB. **Test board losses de-embedded from performance data. Performance data for other stack heights and complete test data available at www.samtec.com?QTH or contact sig@samtec.com QTH/QSH 5 mm Stack Height Type LEAD STYLE PINS PER ROW NO. OF PAIRS QTH Specify LEAD STYLE from chart RECOGNITIONS –030, –060, –090 For complete scope of recognitions see www.samtec.com/quality (60 total pins per bank = –D) –020, –040, –060 (20 pairs per bank = –D–DP) PLATING OPTION ALSO AVAILABLE –D = Gold Flash on Signal Pins and Ground Plane, Matte Tin on tails = Single-Ended = 10µ" (0,25 µm) Gold on Signal Pins and Ground Plane, Matte Tin on tails –DP = (No. of Pairs per Row/20) x (20,00) .7875 (20,00) .7875 (MOQ Required) 01 (7,11) .280 02 (0,50) .0197 (0,20) .008 A A –01 & –02 –03 thru –07 (0,76) .030 (0,89) .035 DIA (0,64) .025 –L WWW.SAMTEC.COM OTHER OPTION –K –F –D–DP = Differential Pair (–01 only) –L –D = (No. of Pins per Row/30) x (20,00) .7875 A TYPE FILE NO: 090871_0_000 • 14 mm, 15 mm, 22 mm and 30 mm stack height (Caution: Some automatic placement/inspection machines may have component height restrictions. Please consult machinery specifications.) • 30µ" (0,76 µm) Gold (Specify -H plating for Data Rate cable mating applications.) • Edge Mount & Guide Posts • 80 (-DP), 120, 150 positions per row • Retention Option Contact Samtec. s ocol Prot orted Supp QTH LEAD STYLE –C* –01 = Electro-Polished Selective 50µ" (1,27 µm) min Au over 150µ" (3,81 µm) Ni on Signal Pins in contact area, 10µ" (0,25 µm) min Au over 50µ" (1,27 µm) Ni on Ground Plane in contact area, Matte Tin over 50µ" (1,27 µm) min Ni on all solder tails –02 –03 –04 –05 –07 = (7,00 mm) .275" DIA Polyimide film Pick & Place Pad (N/A with -05 & -07 lead style) –TR A (4,27) .168 (7,26) .286 (10,27) .404 (15,25) .600 (18,26) .718 (24,24) .954 HEIGHT = Tape & Reel WITH (–090 positions QSH* maximum) (5,00) .197 (8,00) .315 (11,00) .433 (16,00) .630 (19,00) .748 (25,00) .984 –L = Latching Option (–01 lead style only) (N/A on –060 (–D–DP) & –090) *Processing conditions will affect mated height. *Note: –C Plating passes 10 year MFG testing Note: Some lengths, styles and options are non-standard, non-returnable. OTHER SOLUTIONS • Board Spacing Standoffs. See SO Series.