SDK-9BNS-K13-GS-TB(LF)(SN)1

Emboss Tape SDK CONNECTOR Specifications ––––––––––––––––––– This connector is designed for SD Card & MMC (Multi media card), complying with the SD Card Association standard, and is with the switch for Write-protection & Carddetection. And due to Push-push mechanism design, its card can be easily ejected by push-push operation. • Space saving design • The amount of card ejection • Outstanding durability • Prevention of reverse card insertion • Current rating: 0.5A AC, DC • Voltage rating: 5V AC, DC • Temperature range: -25˚C to +85˚C (including temperature rise in applying electrical current) • Recommendatory PC board thickness:0.6mm to 1.0mm [When it is mounted on the FPC, recommendable reinforcing layer thickness is 0.6mm min.] • Contact resistance: (Signal part) Initial value/30m Ω max. After environmental testing/60m Ω max. (Switch part) Initial value/100m Ω max. After environmental testing/100m Ω max. • Insulation resistance: 1,000M Ω min. at 500V DC • Withstanding voltage: 500V AC/minute * Compliant with RoHS. * Refer to "General Instruction and Notice when using Terminals and Connectors" at the end of this catalog. * Contact JST for details. 13.195±0.05 11.355±0.05 9.75±0.05 8.05±0.05 1.4±0.05 7.55min Terminal (GND) 0.9±0.05 13.395±0.05 1.2min 0.9±0.05 Shell GND 28.1±0.05 1.2±0.05 (1.45) Note: 1. Tolerances are non-cumulative: ±0.05mm for all centers. Note: 2. The dimensions above should serve as a guideline. Contact JST for details. Shell GND 1.35±0.05 Shell GND Connector outline 2.8±0.05 13.195±0.05 (1.45) 5.6±0.1 ±0.15 2.8 1.8 5.6±0.1 Card center Write protect switch 1.8 23.4±0.05 1.2±0.05 No.1 No.9 No.2 No.3 No.4 No.8 No.7 No.6 Shell GND 8.05min 1±0.05 0.45 7.3 9-1.1±0.05 1.2±0.05 1±0.05 24.35 1.2±0.05 27.15 21.4±0.05 23.4±0.05 9.75±0.05 7.15±0.05 PC board layout (viewed from component side) and Assembly layout No.5 6×P2.5=15±0.05 5.625±0.05 Card detection switch 7.75±0.05 9.85min 1±0.05 27.7 ±0.05 PC board layout (for reference) Pattern prohibition area Connector 27.1 Circuit No.8 12.895 11.355 Circuit No.1 1 Circuit No.2 30 (33.6) when pushing in a card (34.6) when putting in a card (8.4) 2.8 (43) when releasing a card 20.95 24.35 27.15 9.3 6.7 6xP2.5=15 5.625 Circuit No.9 Model No. SDK-9BNS-K13-GS-TB 450 Material and Finish Housing, Guide: Heat resisting resin, UL94V-0 Contact: Copper alloy, nickel-undercoated, selective gold-plated, selective tin-plated (reflow treatment) Terminal: Copper alloy, nickel-undercoated, gold-plated Card detection switch: Copper alloy, nickel-undercoated, gold-plated Write protect switch: Copper alloy, nickel-undercoated, selective gold-plated, selective tin-plated (reflow treatment) Card lock: Copper alloy, tin-plated Joint rod, Spring: SUS Shell: SUS, Solder tail/ selective nickel-undercoated, tin-plated (reflow treatment) RoHS compliance This product displays (LF)(SN) on a label. Note: This products listed above are supplied on embossed-tape. Card centor Q'ty / reel