ZJY270-2864ASYDF06

Product Specification Part Name : OEL Display Module Customer Part ID : Zhongjingyuan Part ID : ZJY270-2864ASYDF06 Doc No. : SAS1-090GK-A Customer: Approved by From: Zhongjingyuan Electronic Technology Co. LTD Approved by Notes: 1. Please contact Zhongjingyuan Semiconductor Inc. beforesigning as your product based on this module specification 2. The information contained herein is presented merely to indicate the characteristics and performance of our products. No responsibility is assumed by WiseChip Semiconductor Inc. for any intellectual property claims or other problems that may result from application based on the module described herein. Revised History Part Number Revision ZJY270-2864ASYDF06 A Revision Content New Revised on November 23, 2017 i Contents Revision History ................................................................................................................................i Contents ...........................................................................................................................................ii 1. Basic Specifications ................................................................................................................ 1~5 1.1 Display Specifications ....................................................................................................................1 1.2 Mechanical Specifications...............................................................................................................1 1.3 Active Area / Memory Mapping & Pixel Construction ........................................................................1 1.4 Mechanical Drawing.......................................................................................................................2 1.5 Pin Definition ................................................................................................................................3 2. Absolute Maximum Ratings ........................................................................................................5 3. Optics & Electrical Characteristics ....................................................................................... 6~10 3.1 Optics Characteristics ....................................................................................................................6 3.2 DC Characteristics .........................................................................................................................6 3.3 AC Characteristics .........................................................................................................................7 4. Functional Specification ..................................................................................................... 10~15 4.1 Commands ................................................................................................................................. 10 4.2 Power down and Power up Sequence ........................................................................................... 10 4.2.1 Power up Sequence........................................................................................................... 10 4.2.2 Power down Sequence ...................................................................................................... 10 4.3 Reset Circuit ............................................................................................................................... 10 4.4 Application Circuit ....................................................................................................................... 11 4.5 Actual Application Example .......................................................................................................... 14 5. Reliability ..................................................................................................................................16 5.1 Contents of Reliability Tests ......................................................................................................... 16 5.2 Failure Check Standard ................................................................................................................ 16 6. Outgoing Quality Control Specifications ............................................................................ 17~20 6.1 Environment Required ................................................................................................................. 17 6.2 Sampling Plan ............................................................................................................................. 17 6.3 Criteria & Acceptable Quality Level ............................................................................................... 17 6.3.1 Cosmetic Check (Display Off) in Non-Active Area................................................................. 17 6.3.2 Cosmetic Check (Display Off) in Active Area........................................................................ 19 6.3.3 Pattern Check (Display On) in Active Area........................................................................... 20 7. Package Specifications..............................................................................................................21 8. Precautions When Using These OEL Display Modules ....................................................... 22~23 8.1 Handling Precautions ................................................................................................................... 22 8.2 Storage Precautions..................................................................................................................... 22 8.3 Designing Precautions ................................................................................................................. 23 8.4 Precautions when disposing of the OEL display modules ................................................................ 23 8.5 Other Precautions........................................................................................................................ 23 Warranty ........................................................................................................................................24 Notice .............................................................................................................................................24 ii 1. Basic Specifications 1.1 Display Specifications 1) 2) 3) Display Mode Display Color Drive Duty : Passive Matrix : Monochrome (Yellow / 16 Gray Scales) : 1/64 Duty 1.2 Mechanical Specifications 1) 2) 3) 4) 5) 6) 7) 8) Outline Drawing Number of Pixels Module Size Panel Size Active Area Pixel Pitch Pixel Size Weight : : : : : : : : According to the annexed outline drawing 128 × 64 73.00 × 67.87 × 2.675 (mm) 73.00 × 41.86 × 2.00 (mm) including “Anti-Glare polarizer” 61.41 × 30.69 (mm) 0.48 × 0.48 (mm) 0.45 × 0.45 (mm) T.B.D. (g) ± 10% 1.3 Active Area / Memory Mapping & Pixel Construction P0.48 x128-0.03=61.41 (0,0) (0,5) 0.48 0.45 P0.48 x 64-0.03=30.69 0.48 0.45 Segment 0 ( Column 1 ) Common 12 ( Row 64 ) Common 74 ( Row 2 ) 127 Driver IC Memory Mapping Segment ( Column 128 ) (128 x 64 in 128 x 80) Common 13 ( Row 63 ) (127,68) Detail "A" Scale (5:1) (127,79) Common 75 ( Row 1 ) 1 1.4 Mechanical Drawing 2 1.5 Pin Definition Pin Number Symbol I/O 21 VDD P 29 VSS P 2 VCC P 4 IREF I 3 VCOMH P 30 VSL O Function Power Supply Power Supply for Logic This is a voltage supply pin. It must be connected to external source. Ground of OEL System This is a ground pin. It also acts as a reference for the logic pins, the OEL driving voltages, and the analog circuits. It must be connected to external ground. Power Supply for OEL Panel This is the most positive voltage supply pin of the chip. A stabilization capacitor should be connected between this pin and VSS when the converter is used. It must be connected to external source and shouldn’t be generated internally by using internal DC/DC voltage converter. Driver Current Reference for Brightness Adjustment This pin is segment current reference pin. A resistor should be connected between this pin and VSS. Set the current at 10µA maximum. Voltage Output High Level for COM Signal This pin is the voltage output high level for COM signals. A capacitor should be connected between this pin and VSS No external power supply is allowed to connect to this pin. Voltage Output Low Level for SEG Signal This pin is the output pin for the voltage output low level for SEG signals. This pin can be kept NC or connected with a capacitor to VSS for stability. Refer to command BFh for VSL pin connection details. DC/DC Converter(Insufficient) Power Supply for DC/DC Converter Circuit This is the power supply pin for the internal buffer of the DC/DC voltage converter. It must be connected to external source when the converter is used. It should be connected to VDD when the converter is not used. Output for Connected External NMOS This output pin drives the gate of the external NMOS of the booster circuit. Input for Connected External NMOS This pin connects to the source current pin of the external NMOS of the booster circuit. Voltage Reference for DC/DC Converter Circuit This pin is the internal voltage reference of booster circuit. A stabilization capacitor, typ. 1uF, should be connected to VSS. Feedback Input for DC/DC Converter Circuit This pin is the feedback resistor input of the booster circuit. It is used to adjust the booster output voltage level (VCC). 27 VDDB P 28 GDR O 25 RESE I 24 VBREF I 26 FB I RES# I Power Reset for Controller and Driver This pin is reset signal input. When the pin is low, initialization of the chip is executed. Communicating Protocol Select These pins are MCU interface selection input. See the following table: BS2 BS1 Interface mode 0 0 Serial 1 0 68XX-parallel 1 1 80XX-parallel Interface 16 19 20 BS2 BS1 I 17 CS# I 15 D/C# I Chip Select This pin is the chip select input. The chip is enabled for MCU communication only when CS# is pulled low. Data/Command Control This pin is Data/Command control pin. When the pin is pulled high, the input at D7~D0 is treated as display data. When the pin is pulled low, the input at D7~D0 will be transferred to the command register. For detail relationship to MCU interface signals, please refer to the Timing Characteristics Diagrams. When the pin is pulled high and serial interface mode is selected, the data at SDIN is treated as data. When it is pulled low, the data at SDIN will be transferred to the command register. 3 Pin Number Symbol I/O Function Interface(Continued) 13 E/RD# I 14 R/W# I 5~12 D7~D0 I/O 18,22,23 N.C. - 1 N.C. (GND) - Read/Write Enable or Read This pin is MCU interface input. When interfacing to a 68XX-series microprocessor, this pin will be used as the Enable (E) signal. Read/write operation is initiated when this pin is pulled high and the CS# is pulled low. When connecting to an 80XX-microprocessor, this pin receives the Read (RD#) signal. Data read operation is initiated when this pin is pulled low and CS# is pulled low. Read/Write Select or Write This pin is MCU interface input. When interfacing to a 68XX-series microprocessor, this pin will be used as Read/Write (R/W#) selection input. Pull this pin to “High” for read mode and pull it to “Low” for write mode. When 80XX interface mode is selected, this pin will be the Write (WR#) input. Data write operation is initiated when this pin is pulled low and the CS# is pulled low. Host Data Input/Output Bus These pins are 8-bit bi-directional data bus to be connected to the microprocessor’s data bus. When serial mode is selected, D1 will be the serial data input SDIN and D0 will be the serial clock input SCLK. Reserve Reserved Pin The N.C. pin between function pins are reserved for compatible and flexible design. It must be kept float. Reserved Pin (Supporting Pin) The supporting pin can reduce the influences from stresses on the function pins. This pin must be connected to external ground. 4 2. Absolute Maximum Ratings Parameter Symbol Min Max Unit Notes Supply Voltage for Logic VDD -0.3 4 V 1, 2 Supply Voltage for Display VCC 0 16 V 1, 2 Operating Temperature TOP -40 85 °C 3 Storage Temperature TSTG -40 90 °C 3 100,000 - hour 4 Life Time (80 cd/m ) 150,000 - hour Life Time (60 cd/m2) 200,000 - hour Life Time (100 cd/m2) 2 Note 1: All the above voltages are on the basis of “VSS = 0V”. Note 2: When this module is used beyond the above absolute maximum ratings, permanent breakage of the module may occur. Also, for normal operations, it is desirable to use this module under the conditions according to Section 3. “Optics & Electrical Characteristics”. If this module is used beyond these conditions, malfunctioning of the module can occur and the reliability of the module may deteriorate. Note 3: The define temperature ranges do not include the polarizer. The maximum withstood temperature of the polarizer should be 80°C. Note 4: VCC = 15.0V, Ta = 25°C, 50% Checkerboard. Software configuration follows Section 4.5 Initialization.End of lifetime is specified as 50% of initial brightness reached. The average operating lifetime at room temperature is estimated by the accelerated operation at high temperature conditions. 5 3. Optics & Electrical Characteristics 3.1 Optics Characteristics Characteristics Symbol Conditions Min Typ Max Unit Brightness Lbr Note 4 70 100 - cd/m2 C.I.E. (Yellow) (x) (y) C.I.E. 1931 0.46 0.45 0.50 0.49 0.54 0.53 Dark Room Contrast CR - >10,000:1 - - Free - degree Min Typ Max Unit 2.4 2.8 3.5 V 14.25 15 15.75 V Viewing Angle * Optical measurement taken at VDD = 2.8V, VCC = 15.0V. Software configuration follows Section 4.5 Initialization. 3.2 DC Characteristics Characteristics Symbol Supply Voltage for Logic VDD Supply Voltage for Display (Supplied Externally) VCC High Level Input VIH 0.8×VDD - VDD V Low Level Input VIL 0 - 0.2×VDD V High Level Output VOH IOUT = 100µA, 3.3MHz 0.9×VDD - VDD V Low Level Output VOL IOUT = 100µA, 3.3MHz 0 - 0.1×VDD V Operating Current for VDD IDD - 250 400 µA Note 6 - 23.2 29 mA Note 7 - 31 39 mA Note 8 - 53 66 mA Operating Current for VCC (VCC Supplied Externally) ICC Conditions Note 5 Sleep Mode Current for VDD IDD, SLEEP - 1 5 µA Sleep Mode Current for VCC ICC, SLEEP - 1 5 µA Note 5: Brightness (Lbr) and Supply Voltage for Display (VCC) are subject to the change of the panel characteristics and the customer’s request. Note 6: VDD = 2.8V, VCC = 15V, 30% Display Area Turn on. Note 7: VDD = 2.8V, VCC = 15V, 50% Display Area Turn on. Note 8: VDD = 2.8V, VCC = 15V, 100% Display Area Turn on. * Software configuration follows Section 4.5 Initialization. 6 3.3 AC Characteristics 3.3.1 68XX-Series MPU Parallel Interface Timing Characteristics: Symbol Description Min Max Unit tcycle System Cycle Time 300 - ns tAS Address Setup Time 0 - ns tAH Address Hold Time 0 - ns tDSW Write Data Setup Time 40 - ns tDHW Write Data Hold Time 15 - ns tDHR Read Data Hold Time 20 - ns tOH Output Disable Time - 70 ns tACC Access Time - 140 ns - ns - ns PWCSL PWCSH * Chip Select Low Pulse Width (Read) 120 Chip Select Low Pulse width (Write) 60 Chip Select High Pulse Width (Read) 60 Chip Select High Pulse Width (Write) 60 tR Rise Time - 15 ns tF Fall Time - 15 ns (VDD - VSS = 2.4V to 3.5V, Ta = 25°C) 7 3.3.2 80XX-Series MPU Parallel Interface Timing Characteristics: Symbol * Description Min Max Unit tcycle System Cycle Time 300 - ns tAS Address Setup Time 10 - ns tAH Address Hold Time 0 - ns tDSW Write Data Setup Time 40 - ns tDHW Write Data Hold Time 15 - ns tDHR Read Data Hold Time 20 - ns tOH Output Disable Time - 70 ns tACC Access Time - 140 ns tPWLR Low Pulse Width (Read) 120 tPWLW Low Pulse width (Write) 60 - ns tPWHR High Pulse Width (Read) 60 tPWHW High Pulse Width (Write) 60 - ns tR Rise Time - 15 ns tF Fall Time - 15 ns tCS Chip select setup time 0 ns tCSH Chip select hold time to read signal 0 ns tCSF Chip select hold time 20 ns (VDD - VSS = 2.4V to 3.5V, Ta = 25°C) 8 3.3.3 Serial Interface Timing Characteristics: Symbol Description Min Max Unit Clock Cycle Time 250 - ns tAS Address Setup Time 150 - ns tAH Address Hold Time 150 - ns tCSS Chip Select Setup Time 120 - ns tCSH Chip Select Hold Time 60 - ns tDSW Write Data Setup Time 100 - ns tDHW Write Data Hold Time 100 - ns tCLKL Serial Clock Low Time 100 - ns tCLKH Serial Clock High Time 100 - ns tcycle * tR Rise Time - 15 ns tF Fall Time - 15 ns (VDD - VSS = 2.4V to 3.5V, Ta = 25°C) 9 4. Functional Specification 4.1 Commands Refer to the Technical Manual for the SSD1325 4.2 Power down and Power up Sequence To protect OEL panel and extend the panel life time, the driver IC power up/down routine should include a delay period between high voltage and low voltage power sources during turn on/off. It gives the OEL panel enough time to complete the action of charge and discharge before/after the operation. 4.2.1 Power up Sequence: 1. 2. 3. 4. 5. 6. Power up VDD Send Display off command Initialization Clear Screen Power up VCC Delay 100ms (When VCC is stable) 7. Send Display on command V DD / V DDB on B B B B V CC on B B Display on V CC B V DD/V DDB B B V SS /Ground B B Display off 4.2.2 Power down Sequence: 1. Send Display off command 2. Power down VCC 3. Delay 100ms (When VCC is reach 0 and panel is completely discharges) 4. Power down VDD V CC / V DDB off B B B B V DD off B B V CC/V DDB B B V DD B V SS /Ground B B Note 9: 1) Since an ESD protection circuit is connected between VDD and VCC inside the driver IC, VCC becomes lower than VDD whenever VDD is ON and VCC is OFF. 2) VCC should be kept float (disable) when it is OFF. 3) Power Pins (VDD, VCC) can never be pulled to ground under any circumstance. 4) VDD should not be power down before VCC power down. 4.3 Reset Circuit When RES# input is low, the chip is initialized with the following status: 1. Display is OFF 2. 128×80 Display Mode 3. Normal segment and display data column and row address mapping (SEG0 mapped to column address 00h and COM0 mapped to row address 00h) 4. Shift register data clear in serial interface 5. Display start line is set at display RAM address 0 6. Column address counter is set at 0 7. Normal scan direction of the COM outputs 8. Contrast control register is set at 40h 9. Normal display mode (Equivalent to A4h command) 10 4.4 Application Circuit 4.4.1 68xx-Series MPU Parallel Interface 11 4.4.2 80xx-Series MPU Parallel Interface 12 4.4.3 4-wire SPI Interface 13 4.5 Actual Application Example Command usage and explanation of an actual example VCC Supplied Externally VDD/VCC off State Power up VDD (RES# as Low State) Set Display Offset 0xA2, 0x4C Set Pre-Charge Voltage 0xBC, 0x10 Power Stabilized (Delay Recommended) Set Display Start Line 0xA1, 0x00 Set Pre-Charge Compensation Level Set RES# as High (3μs Delay Minimum) Set Master Configuration 0xAD, 0x02 Set Pre-Charge Compensation Enable Initialized State (Parameters as Default) Set Re-Map 0xA0, 0x50 Set VCOMH Voltage 0xBE, 0x1C Set Display Off 0xAE Set Current Range 0x86 0xDA, 0x02 Set VSL 0xBF, 0x0D Initial Settings Configuration Set Contrast Control 0x81, 0x7F Set Display Mode 0xA4 0xB3, 0x91 Set Phase Length 0xB1, 0x55 Clear Screen Set Multiplex Ratio 0xA8, 0x3F Set Row Period 0xB2, 0x51 Set Display On 0xAF Set Display Clock Divide Ratio/Oscillator Frequency 0xB4, 0x02 0xB0, 0x28 Display Data Sent If the noise is accidentally occurred at the displaying window during the operation, please reset the display in order to recover the display function. 14  Normal Operation Power down V CC (100ms Delay Recommended) Set Display Off 0xAE Power down VDD B B VDD/VCC off State Normal Operation Power down VCC Set Display Off 0xAE Sleep Mode Sleep Mode Set Display On 0xAF Power up VCC (100ms Delay Recommended) Normal Operation 15 5. Reliability 5.1 Contents of Reliability Tests Item Conditions High Temperature Operation 85°C, 500 hrs Low Temperature Operation -40°C, 500 hrs High Temperature Storage 90°C, 500 hrs Low Temperature Storage -40°C, 500 hrs High Temperature/Humidity Operation 60°C, 90% RH, 240 hrs Thermal Shock -40°C ⇔ 85°C, 100 cycles 30 mins dwell Criteria The operational functions work. * The samples used for the above tests do not include polarizer. * No moisture condensation is observed during tests. 5.2 Failure Check Standard After the completion of the described reliability test, the samples were left at room temperature for 2 hrs prior to conducting the failure test at 23±5°C; 55±15% RH. 16 6. Outgoing Quality Control Specifications 6.1 Environment Required Customer’s test & measurement are required to be conducted under the following conditions: Temperature: 23 ± 5°C Humidity: 55 ± 15% RH Fluorescent Lamp: 30W Distance between the Panel & Lamp: ≥ 50cm Distance between the Panel & Eyes of the Inspector: ≥ 30cm Finger glove (or finger cover) must be worn by the inspector. Inspection table or jig must be anti-electrostatic. 6.2 Sampling Plan Level II, Normal Inspection, Single Sampling, MIL-STD-105E 6.3 Criteria & Acceptable Quality Level Partition AQL Definition Major 0.65 Defects in Pattern Check (Display On) Minor 1.0 Defects in Cosmetic Check (Display Off) 6.3.1 Cosmetic Check (Display Off) in Non-Active Area Check Item Classification Criteria X > 6 mm (Along with Edge) Y > 1 mm (Perpendicular to edge) X Panel General Chipping Y Minor X Y 17 6.3.1 Cosmetic Check (Display Off) in Non-Active Area (Continued) Check Item Classification Criteria Any crack is not allowable. Panel Crack Minor Copper Exposed (Even Pin or Film) Minor Film or Trace Damage Minor Terminal Lead Prober Mark Acceptable Glue or Contamination on Pin (Couldn’t Be Removed by Alcohol) Minor Ink Marking on Back Side of panel (Exclude on Film) Acceptable Not Allowable by Naked Eye Inspection Ignore for Any 18 6.3.2 Cosmetic Check (Display Off) in Active Area It is recommended to execute in clear room environment (class 10k) if actual in necessary. Check Item Classification Criteria Any Dirt & Scratch on Polarizer’s Protective Film Acceptable Ignore for not Affect the Polarizer Scratches, Fiber, Line-Shape Defect (On Polarizer) Minor Dirt, Black Spot, Foreign Material (On Polarizer) Minor Dent, Bubbles, White spot (Any Transparent Spot on Polarizer) Minor Fingerprint, Flow Mark (On Polarizer) Minor W ≤ 0.1 Ignore W > 0.1, L ≤ 2 n≤1 L>2 n=0 Φ ≤ 0.1 Ignore 0.1 < Φ ≤ 0.25 n≤1 0.25 < Φ n=0 Φ ≤ 0.5
Ignore if no Influence on Display 0.5 < Φ n=0 Not Allowable * Protective film should not be tear off when cosmetic check. ** Definition of W & L & Φ (Unit: mm): Φ = (a + b) / 2 L b: Minor Axis W a: Major Axis 19 6.3.3 Pattern Check (Display On) in Active Area Check Item Classification No Display Major Missing Line Major Pixel Short Major Darker Pixel Major Wrong Display Major Un-uniform Major Criteria 20 7. Package Speci x 1 pcs (Empty) B pcs Tray with Vacuum Packing Module Sponge Protective x A pcs Staggered Stacking Tray (420mm x 285mm) C Set Primary Box Wrapped with Adhesive Tape x B pcs Vacuum Packing Bag Sponge Protective (370mm x 280mm x 20mm) Carton Box Primary Box (L450mm x W296mm x H110mm, B wave) x C Set Label (Major / Maximum) Carton Box (Major / Maximum: L464mm x W313mm x H472mm, AB wave) Item Quantity Module 240 per Primary Box Holding Trays (A) 20 per Primary Box Total Trays (B) 21 per Primary Box (Including 1 Empty Tray) Primary Box (C) 1~4 per Carton (4 as Major / Maximum) 21 8. Precautions When Using These OEL Display Modules 8.1 Handling Precautions 1) 2) 3) 4) 5) 6) Since the display panel is being made of glass, do not apply mechanical impacts such us dropping from a high position. If the display panel is broken by some accident and the internal organic substance leaks out, be careful not to inhale nor lick the organic substance. If pressure is applied to the display surface or its neighborhood of the OEL display module, the cell structure may be damaged and be careful not to apply pressure to these sections. The polarizer covering the surface of the OEL display module is soft and easily scratched. Please be careful when handling the OEL display module. When the surface of the polarizer of the OEL display module has soil, clean the surface. It takes advantage of by using following adhesion tape. * Scotch Mending Tape No. 810 or an equivalent Never try to breathe upon the soiled surface nor wipe the surface using cloth containing solvent such as ethyl alcohol, since the surface of the polarizer will become cloudy. Also, pay attention that the following liquid and solvent may spoil the polarizer: * Water * Ketone * Aromatic Solvents Hold OEL display module very carefully when placing OEL display module into the system housing. Do not apply excessive stress or pressure to OEL display module. And, do not over bend the film with electrode pattern layouts. These stresses will influence the display performance. Also, secure sufficient rigidity for the outer cases. 7) 8) 9) 10) Do not apply stress to the driver IC and the surrounding molded sections. Do not disassemble nor modify the OEL display module. Do not apply input signals while the logic power is off. Pay sufficient attention to the working environments when handing OEL display modules to prevent occurrence of element breakage accidents by static electricity. * Be sure to make human body grounding when handling OEL display modules. * Be sure to ground tools to use or assembly such as soldering irons. * To suppress generation of static electricity, avoid carrying out assembly work under dry environments. * Protective film is being applied to the surface of the display panel of the OEL display module. Be careful since static electricity may be generated when exfoliating the protective film. 11) Protection film is being applied to the surface of the display panel and removes the protection film before assembling it. At this time, if the OEL display module has been stored for a long period of time, residue adhesive material of the protection film may remain on the surface of the display panel after removed of the film. In such case, remove the residue material by the method introduced in the above Section 5). 12) If electric current is applied when the OEL display module is being dewed or when it is placed under high humidity environments, the electrodes may be corroded and be careful to avoid the above. 8.2 Storage Precautions 1) When storing OEL display modules, put them in static electricity preventive bags avoiding exposure to direct sun light nor to lights of fluorescent lamps. and, also, avoiding high temperature and high 22 2) humidity environment or low temperature (less than 0°C) environments. (We recommend you to store these modules in the packaged state when they were shipped from WiseChip Semiconductor Inc.) At that time, be careful not to let water drops adhere to the packages or bags nor let dewing occur with them. If electric current is applied when water drops are adhering to the surface of the OEL display module, when the OEL display module is being dewed or when it is placed under high humidity environments, the electrodes may be corroded and be careful about the above. 8.3 Designing Precautions 1) 2) 3) 4) 5) 6) 7) 8) The absolute maximum ratings are the ratings which cannot be exceeded for OEL display module, and if these values are exceeded, panel damage may be happen. To prevent occurrence of malfunctioning by noise, pay attention to satisfy the VIL and VIH specifications and, at the same time, to make the signal line cable as short as possible. We recommend you to install excess current preventive unit (fuses, etc.) to the power circuit (VDD). (Recommend value: 0.5A) Pay sufficient attention to avoid occurrence of mutual noise interference with the neighboring devices. As for EMI, take necessary measures on the equipment side basically. When fastening the OEL display module, fasten the external plastic housing section. If power supply to the OEL display module is forcibly shut down by such errors as taking out the main battery while the OEL display panel is in operation, we cannot guarantee the quality of this OEL display module. The electric potential to be connected to the rear face of the IC chip should be as follows: SSD1325 * Connection (contact) to any other potential than the above may lead to rupture of the IC. 8.4 Precautions when disposing of the OEL display modules 1) Request the qualified companies to handle industrial wastes when disposing of the OEL display modules. Or, when burning them, be sure to observe the environmental and hygienic laws and regulations. 8.5 Other Precautions 1) 2) 3) 4) 5) When an OEL display module is operated for a long of time with fixed pattern may remain as an after image or slight contrast deviation may occur. Nonetheless, if the operation is interrupted and left unused for a while, normal state can be restored. Also, there will be no problem in the reliability of the module. To protect OEL display modules from performance drops by static electricity rapture, etc., do not touch the following sections whenever possible while handling the OEL display modules. * Pins and electrodes * Pattern layouts such as the FPC With this OEL display module, the OEL driver is being exposed. Generally speaking, semiconductor elements change their characteristics when light is radiated according to the principle of the solar battery. Consequently, if this OEL driver is exposed to light, malfunctioning may occur. * Design the product and installation method so that the OEL driver may be shielded from light in actual usage. * Design the product and installation method so that the OEL driver may be shielded from light during the inspection processes. Although this OEL display module stores the operation state data by the commands and the indication data, when excessive external noise, etc. enters into the module, the internal status may be changed. It therefore is necessary to take appropriate measures to suppress noise generation or to protect from influences of noise on the system design. We recommend you to construct its software to make periodical refreshment of the operation 23 statuses (re-setting of the commands and re-transference of the display data) to cope with catastrophic noise. Warranty: The warranty period shall last twelve (12) months from the date of delivery. Buyer shall be completed to assemble all the processes within the effective twelve (12) months. WiseChip Semiconductor Inc. shall be liable for replacing any products which contain defective material or process which do not conform to the product specification, applicable drawings and specifications during the warranty period. All products must be preserved, handled and appearance to permit efficient handling during warranty period. The warranty coverage would be exclusive while the returned goods are out of the terms above. Notice: No part of this material may be reproduces or duplicated in any form or by any means without the written permission of WiseChip Semiconductor Inc. WiseChip Semiconductor Inc. reserves the right to make changes to this material without notice. WiseChip Semiconductor Inc. does not assume any liability of any kind arising out of any inaccuracies contained in this material or due to its application or use in any product or circuit and, further, there is no representation that this material is applicable to products requiring high level reliability, such as, medical products. Moreover, no license to any intellectual property rights is granted by implication or otherwise, and there is no representation or warranty that anything made in accordance with this material will be free from any patent or copyright infringement of a third party. This material or portions thereof may contain technology or the subject relating to strategic products under the control of Foreign Exchange and Foreign Trade Law of Taiwan and may require an export license from the Ministry of International Trade and Industry or other approval from another government agency. © WiseChip Semiconductor Inc. 2017, All rights reserved. All other product names mentioned herein are trademarks and/or registered trademarks of their respective companies. 24