HSL3P20
P-Ch 200V Fast Switching MOSFETs
Description
Product Summary
The HSL3P20 is the high cell density trenched
P-ch MOSFETs, which provides excellent
RDSON and efficiency for most of the small
power switching and load switch applications.
The HSL3P20 meets the RoHS and Green
Product requirement with full function reliability
approved.
VDS
-200 V
RDS(ON),Max
2.4
Ω
ID
-3
A
SOT223 Pin Configuration
Super Low Gate Charge
Excellent Cdv/dt effect decline
Green Device Available
Advanced high cell density Trench
technology
Absolute Maximum Ratings
Symbol
Parameter
Rating
Units
VDS
Drain-Source Voltage
-200
V
VGS
Gate-Source Voltage
±20
V
ID@TC=25℃
Continuous Drain Current, VGS @ -10V
-3
A
ID@TC=70℃
Continuous Drain Current, VGS @ -10V
-2
A
ID@TA=25℃
Continuous Drain Current, VGS @ -10V
-0.9
A
ID@TA=70℃
Continuous Drain Current, VGS @ -10V
-0.68
A
IDM
Pulsed Drain Current
-3.5
A
PD@TA=25℃
Total Power Dissipation
1.5
W
TSTG
Storage Temperature Range
-55 to 150
℃
TJ
Operating Junction Temperature Range
-55 to 150
℃
1
1
1
1
2
3
Thermal Data
Symbol
Parameter
Typ.
RθJA
Thermal Resistance Junction-ambient
RθJC
Thermal Resistance Junction-Case
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1
Ver 2.0
1
Max.
Unit
---
85
℃/W
---
36
℃/W
1
HSL3P20
P-Ch 200V Fast Switching MOSFETs
Electrical Characteristics (TJ=25 ℃, unless otherwise noted)
Symbol
Parameter
BVDSS
Drain-Source Breakdown Voltage
RDS(ON)
Static Drain-Source On-Resistance
VGS(th)
Gate Threshold Voltage
Conditions
2
Min.
Typ.
Max.
Unit
VGS=0V , ID=-250uA
-200
---
---
V
VGS=-10V , ID=-0.5A
---
1.9
2.4
VGS=VDS , ID =-250uA
-4.0
V
-2.0
-3.0
VDS=-160V , VGS=0V , TJ=25℃
---
---
1
VDS=-160V , VGS=0V , TJ=55℃
---
---
10
VGS=±20V , VDS=0V
---
---
±100
nA
---
0.5
---
S
---
8.5
---
---
1.5
---
IDSS
Drain-Source Leakage Current
IGSS
Gate-Source Leakage Current
gfs
Forward Transconductance
Qg
Total Gate Charge
Qgs
Gate-Source Charge
Qgd
Gate-Drain Charge
---
1.8
---
Turn-On Delay Time
---
1.9
---
Td(on)
Tr
Td(off)
Tf
VDS=-5V , ID=-0.8A
VDS=-100V , VGS=-4.5V , ID=-0.5A
Rise Time
VDD=-100V , VGS=-10V , RG=6
---
1.2
---
Turn-Off Delay Time
ID=-0.5A
---
22
---
uA
nC
ns
Fall Time
---
11
---
Ciss
Input Capacitance
---
500
---
Coss
Output Capacitance
---
39
---
Crss
Reverse Transfer Capacitance
---
20
---
Min.
Typ.
Max.
Unit
---
---
-1.2
A
---
---
-3.5
A
---
---
-1.3
V
VDS=-100V , VGS=0V , f=1MHz
pF
Diode Characteristics
Symbol
Parameter
IS
Continuous Source Current1,4
ISM
Pulsed Source Current2,4
VSD
Diode Forward Voltage
2
Conditions
VG=VD=0V , Force Current
VGS=0V , IS=-1A , TJ=25℃
Note :
1.The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper.
2.The data tested by pulsed , pulse width ≦ 300us , duty cycle ≦ 2%
3.The power dissipation is limited by 150℃ junction temperature
4.The data is theoretically the same as ID and IDM , in real applications , should be limited by total power dissipation.
www.hs-semi.cn
Ver 2.0
2
HSL3P20
P-Ch 200V Fast Switching MOSFETs
Typical Characteristics
www.hs-semi.cn
Ver 2.0
3
HSL3P20
P-Ch 200V Fast Switching MOSFETs
www.hs-semi.cn
Ver 2.0
4
HSL3P20
P-Ch 200V Fast Switching MOSFETs
www.hs-semi.cn
Ver 2.0
5
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