FQT3P20TF
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P-Channel 200 V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
RDS(on) ()
- 200
ID (A)
1.0 at VGS = - 10 V
- 2.0
1.1 at VGS = - 6.0 V
- 1.8
Qg (Typ.)
8.0
• Halogen-free According to IEC 61249-2-21
Available
• TrenchFET® Power MOSFET
• Ultra Low On-Resistance
• Small Size
APPLICATIONS
• Active Clamp Circuits in DC/DC Power Supplies
S
SOT-223
G
D
G
D
S
D
P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted
Parameter
Drain-Source Voltage
Symbol
VDS
Gate-Source Voltage
VGS
Continuous Drain Current (TJ = 150 °C)a, b
TA = 25 °C
TA = 70 °C
Steady State
- 200
IS
Conduction)a, b
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
Maximum Power Dissipationa, b
L = 1.0 mH
TA = 25 °C
TA = 70 °C
- 2.0
- 1.68
- 1.8
- 1.56
- 5.8
- 0.6
IAS
4.0
1.2
mJ
1.45
0.95
0.8
0.48
TJ, Tstg
Operating Junction and Storage Temperature Range
A
- 1.0
EAS
PD
Unit
V
± 20
IDM
Pulsed Drain Current
Continuous Source Current (Diode
ID
5s
- 55 to 150
W
°C
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Maximum Junction-to-Ambienta
t5s
Steady State
RthJA
Maximum Junction-to-Foot (Drain)
Steady State
RthJF
Typical
75
120
Maximum
100
166
40
50
Unit
°C/W
Notes:
a. Surface Mounted on 1" x 1" FR4 board.
b. Pulse width limited by maximum junction temperature.
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SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter
Symbol
Test Conditions
Min.
V(BR)DSS
VGS = 0 V, ID = - 250 µA
- 200
VGS(th)
VDS = VGS, ID = - 250 µA
- 2.5
Gate-Body Leakage
IGSS
VDS = 0 V, VGS = ± 20 V
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currenta
ID(on)
Limits
Typ.
Max.
Unit
Static
Drain-Source Breakdown Voltage
Gate-Threshold Voltage
Drain-Source On-Resistancea
RDS(on)
- 4.5
± 100
VDS = - 200 V, VGS = 0 V
-1
VDS = - 200 V, VGS = 0 V, TJ = 55 °C
- 10
VDS - 15 V, VGS = 10 V
- 1.0
V
nA
µA
A
VGS - 10 V, ID = - 0.5 A
0.80
1.00
VGS = - 6.0 V, ID = - 0.5 A
0.90
1.10
Forward Transconductancea
gfs
VDS = - 15 V, ID = - 0.5 A
1.8
Diode Forward Voltage
VSD
IS = - 1.0 A, VGS = 0 V
- 0.85
- 1.2
8.0
12
S
V
Dynamicb
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
Gate Resistance
Rg
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
VDS = - 100 V, VGS = 10 V
ID - 0.5 A
1.3
nC
2.5
f = 1.0 MHz
370
VDS = - 25 V, VGS = 0 V, f = 1 MHz
8.0
510
28
pF
16
Switchingc
Turn-On Time
Turn-Off Time
Body Diode Reverse Recovery Charge
td(on)
tr
td(off)
VDD = - 100 V, RL = 100
ID - 1.0 A, VGEN = - 10 V
Rg = 6
tf
Qrr
IF = 0.5 A, dI/dt = 100 A/µs
8
12
11
17
16
25
11
17
140
200
ns
nC
Notes:
a. Pulse test: PW 300 µs duty cycle 2 %.
b. For DESIGN AID ONLY, not subject to production testing.
c. Switching time is essentially independent of operating temperature.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
2.5
1.0
VGS = 10 thru 5 V
0.8
I D - Drain Current (A)
I D - Drain Current (A)
2.0
1.5
1.0
0.6
0.4
TC = 125 °C
4V
0.5
0.2
25 °C
- 55 °C
0.0
0.0
0
2
4
6
8
10
0
1
2
3
4
VDS - Drain-to-Source Voltage (V)
VGS - Gate-to-Source Voltage (V)
Output Characteristics
Transfer Characteristics
1.6
5
500
400
1.2
C - Capacitance (pF)
R DS(on) - On-Resistance ()
1.4
VGS = 6 V
1.0
VGS = 10 V
0.8
0.6
Ciss
300
200
0.4
100
Crss
0.2
Coss
0.0
0.0
0
0.2
0.4
0.6
0.8
1.0
0
60
90
120
ID - Drain Current (A)
VDS - Drain-to-Source Voltage (V)
On-Resistance vs. Drain Current
Capacitance
10
150
2.2
VDS = 10 V
ID = 0.5 A
1.9
8
6
4
2
VGS = 10 V
ID = 0.5 A
1.6
(Normalized)
RDS(on) - On-Resistance
VGS - Gate-to-Source Voltage (V)
30
1.3
1.0
0.7
0
0
1
2
3
4
5
6
Qg - Total Gate Charge (nC)
Gate Charge
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7
8
0.4
- 50
- 25
0
25
50
75
100
125
150
TJ - Junction Temperature (°C)
On-Resistance vs. Junction Temperature
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TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
6
3
ID = 0.5 A
TJ = 150 °C
5
RDS(on) - On-Resistance ()
I S - Source Current (A)
1
TJ = 25 °C
0.1
4
3
2
1
0
0.01
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
0
2
6
8
10
VGS - Gate-to-Source Voltage (V)
VSD - Source-to-Drain Voltage (V)
Source-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
1.0
12
ID = 250 µA
10
0.7
8
0.4
Power (W)
VGS(th) Variance (V)
4
0.1
6
4
TA = 25 °C
- 0.2
2
- 0.5
- 50
0
- 25
0
25
50
75
100
125 150
0.01
0.1
1
10
TJ - Temperature (°C)
Time (s)
Threshold Voltage
Single Pulse Power
100
600
10
IDM Limited
I D - Drain Current (A)
1
10 µs
100 µs
Limited by RDS(on)*
1 ms
0.1
10 ms
100 ms
0.01
TA = 25 °C
Single Pulse
10 s, 1 s
DC, 100 s
BVDSS Limited
0.001
0.1
1
10
100
1000
VDS - Drain-to-Source Voltage (V)
* VGS > minimum VGS at which RDS(on) is specified
Safe Operating Area
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TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
2
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
t1
0.05
t2
1. Duty Cycle, D =
t1
t2
2. Per Unit Base = RthJA = 120 °C/W
0.02
3. TJM - TA = PDMZthJA(t)
4. Surface Mounted
Single Pulse
0.01
10-4
10-3
10-2
10-1
1
10
100
600
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Ambient
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