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HSP45314VI

HSP45314VI

  • 厂商:

    ROCHESTER(罗切斯特)

  • 封装:

  • 描述:

    DIRECT DIGITAL SYNTHESIZER

  • 数据手册
  • 价格&库存
HSP45314VI 数据手册
TM HSP45314 File Number 4820.3 CommLinkTM Direct Digital Synthesizer Features The 14-bit HSP45314 provides a complete Direct Digital Synthesizer (DDS) system in a single 48-pin LQFP package. A 48-bit Programmable Carrier NCO (numerically controlled oscillator) and a high speed 14-bit DAC (digital to analog converter) are integrated into a stand alone DDS. • 125MSPS Output Sample Rate with 5V Digital Supply The DDS accepts 48-bit center and offset frequency control information via a parallel processor interface. Modulation control is provided by 3 external pins. The PH0 and PH1 pins select phase offsets of 0, 90, 180 and 270 degrees, while the ENOFR pin enables or zeros the offset frequency word to the phase accumulator. The parallel processor interface has an 8-bit write-only data input C(7:0), a 4-bit address A(3:0) bus, a Write Strobe (WR), and a Write Enable (WE). The processor can update all registers simultaneously by loading a set of master registers, then transfer all master registers to the slave registers by asserting the UPDATE pin. Block Diagram • 100MSPS Output Sample Rate with 3.3V Digital Supply • 14-bit DAC with Internal Reference • Parallel Control Interface for Fast Tuning (50MSPS Control Register Write Rate) • 48-bit Programmable Frequency Control • Small 48-pin LQFP package Applications • Programmable Local Oscillator • FSK Modulation • Direct Digital Synthesis • Clock Generation Ordering Information PART NUMBER TEMP. RANGE (oC) PHASE ACCUM. 48 LQFP PKG. NO. Q48.7X7A Pinout + 48-PIN LQFP (Q48.7X7A TOP VIEW ININ+ ∑ UPDATE MODULATION CONTROL ENOFR PH(1:0) -40 to 85 PACKAGE C3 C4 C5 C6 C7 DVDD WR DGND WE NC A0 A1 WR WE SLAVE C(7:0) A(3:0) COMPOUT HSP45314VI MASTER COMP1 COMP2 SINE WAVE ROM RESET CLK 14 BIT DAC IOUTA IOUTB INT REF REFIO REFLO C2 C1 C0 ENOFR DGND CLK DVDD RESET UPDATE COMPOUT REFLO REFIO 48 47 46 45 44 43 42 41 40 39 38 37 36 35 2 34 3 33 4 32 5 31 6 HSP45314 30 7 29 8 28 9 27 10 26 11 25 12 13 14 15 16 17 18 19 20 21 22 23 24 1 A2 A3 PH0 PH1 DGND DVDD DGND DGND DGND DGND DVDD DGND FSADJ COMP1 AGND AGND IOUTB IOUTA COMP2 AVDD AGND IN+ INAGND [ /Title (HSP4 5314) /Subject (CommLink Direct Digital Synthesizer) /Autho r () /Keywords (Intersil Corporation, semiconductor, DDS, Direct Digital Synthesis, Direct Digital NS ESIG D W R NE UCT D FO E PROD E D MEN ITUT COM SUBST 5314 E R January 2001 NOTData IBLE See ISL SSheet POS 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Intersil and Design is a trademark of Intersil Corporation. | Copyright © Intersil Corporation 2000 CommLink™ is a trademark of Intersil Corporation. HSP45314 Typical Application Circuit (Sinewave Generation) WRITE CLOCK WRITE ENABLE PH1:PH0 BUS µPROCESSOR/ A3:A0 BUS C7:C0 BUS C3 C4 C5 C6 C7 DVDD WR DGND WE NC A0 A1 FPGA/CPLD DVPP 0.1µF DVPP 0.1µF DVPP 0.1µF FSADJ COMP1 AGND AGND IOUTB IOUTA COMP2 AVDD AGND IN+ INAGND 0.1µF AVPP 0.1µF 0.1µF RSET AVPP 2kΩ 0.1µF 50Ω 50Ω (IOUTA) ANALOG OUTPUT FERRITE BEAD DVPP (DIGITAL POWER PLANE) + 10µH 10µF 0.1µF 1µF +5V POWER SOURCE FERRITE BEAD AVPP (ANALOG POWER PLANE) + 10µF 2 10µH 0.1µF 1µF 3 CLOCK SOURCE A2 A3 PH0 PH1 DGND DVDD DGND DGND DGND DGND DVDD DGND SIGNAL PROCESSING 48 47 46 45 44 43 42 41 40 39 38 37 36 35 2 34 3 33 4 32 5 31 6 HSP45314 30 7 29 8 28 9 27 10 26 11 25 12 13 14 15 16 17 18 19 20 21 22 23 24 1 C2 C1 C0 ENOFR DGND CLK DVDD RESET UPDATE COMPOUT REFLO REFIO HSP45314 Functional Description Parallel Interface The HSP45314 is an NCO with an integrated 14-bit DAC designed to run in excess of 125MSPS. The NCO is a 16-bit output design, which is rounded to 14 bits for input to the DAC. The frequency control is the sum of a 48-bit center frequency word and a 48-bit offset frequency word. The two components are added modulo 48 bits with the alignment shown in Table 1. Each of the two terms can be zeroed independently (via the microprocessor interface for the center frequency and via the ENOFR pin for the offset frequency term). The processor interface is an 8-bit parallel write only interface. The interface consists of 8 data bits (C7:C0), four address pins (A3:A0), a Write Strobe (WR), and a Write Enable (WE). The interface is a master/slave type. The processor interface loads a set of master registers. The contents of the master set of registers is then transferred to a slave set of registers by asserting a pin (UPDATE). This allows all of the bits of the frequency control to be updated simultaneously. Frequency Generation The output frequency of the part is determined by the summation of two registers: fOUT = fCLK x ( (CF + OF) mod (248))/ (248), where CF is the Center Frequency register and OF is the Offset Frequency register. With a 125MSPS clock rate, the center frequency can be programmed to (125 x 106)/(248) = 0.4 µHz resolution. The addition of the frequency control words can be interpreted as two’s complement if convenient. For example, if the center frequency is set to 4000...00h and the offset frequency set to C000..00h, the programmed center frequency would be fCLK/4 and the programmed offset frequency -fCLK/4. The sum would be 10000..00h, but because only the lower 48 bits are retained, the effective frequency would be 0. In reality, frequencies above 8000...00h alias below fCLK/2 (the output of the part is real), so the MSB is only provided as a convenience for two’s complement calculations. The frequency control of the NCO is the change in phase per clock period or dφ/dt. This is integrated by the phase accumulator to obtain frequency. The most significant 24 bits of phase are then mapped to 16 bits of amplitude in a sine look-up table function. The range of dφ/dt is 0 to 1 with 1 equaling 360 degrees or (2 x pi) per clock period. The phase accumulator output is also 0 to 1 with 1 equaling 360 degrees. The operations are modulo 48 bits because the MSB (bit 47) aligns with the most significant address bit of the sine ROM and the ROM contains one cycle of a sinusoid. The MSB is weighted at 180 degrees. Full scale is 360 degrees minus 1 LSB and the phase then rolls over to 0 degrees for the next cycle of the sinusoid. The rate which the user writes (WR) to these registers does not have to be the same rate as the DDS clock rate (the rate of the NCO and DAC; pin CLK). It is expected that most applications will have a slower register write rate than the DDS clock rate. It takes 6 WR cycles at the write rate plus another 11 CLK cycles at the DDS rate to write and obtain a new frequency, assuming that all registers are rewritten and the UPDATE pin is always active. If the UPDATE pin is not active until after the new word has been written, it takes 14 CLK cycles, rather than 11. For cases which require the output to be updated with all of the new frequency information present, it is necessary that the UPDATE be inactive until after all of the new frequency word has been written to the device. See the Timing Diagrams for more information. The parallel registers can be written to again immediately after the 11th or 14th CLK cycle, again depending the state of UPDATE. If the application does not need 48 bits (all 6 registers) of frequency information, then the output frequency can be changed more quickly. For example, if only 32 bits of frequency information are needed and it is desired that the output be updated all at once, then it takes 4 WR cycles, then the assertion low of the UPDATE pin, plus another 14 CLK cycles at the DDS rate to write and update a new frequency. The timing is the same whether writing to the center or offset frequency registers. For faster frequency update, consider the ENOFR (Enable Offset Frequency Register) option. Once the values have been written to the center and offset frequency registers, the user can enable and disable the offset frequency register, which is added to the center frequency value when enabled. The ENOFR pin has a latency of 14 CLK cycles, but simplifies the interface because the only pin that has to be toggled is the ENOFR pin. TABLE 1. FREQUENCY CONTROL BIT ALIGNMENTS Bits 4444 4444 3333 3333 3322 2222 2222 1111 1111 1100 0000 0000 Individual Bit Alignment 7654 3210 9876 5432 1098 7654 3210 9876 5432 1098 7654 3210 Phase Accumulator xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx Center Frequency xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx Offset Frequency xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx 3 HSP45314 There are three control pins provided for phase and frequency control. The PH0 and PH1 pins select phase offsets of 0, 90, 180, and 270 degrees and can be used for low speed, unfiltered BPSK or QPSK modulation. These pins can also be used for providing sine/cosine when using two HSP45314s together as quadrature local oscillators. The ENOFR pin enables or zeros the offset frequency word to the phase accumulator and can be used for FSK or MSK modulation. These control pins and the UPDATE pin are passed through special cells to minimize the probability of meta-stability. If the internal reference is used, VFSADJ will equal approximately 1.2V (pin 13). If an external reference is used, VFSADJ will equal the external reference. The calculation for IOUT (Full Scale) is: IOUT(Full Scale) = (VFSADJ/RSET) X 32. Analog Output Comparator VOUT = IOUT X RLOAD. Reset A comparator is provided for square wave output generation. The user can take the DDS analog output, filter it, and then send it back into the comparator. A square wave will be generated at the comparator output (COMPOUT pin) at an amplitude level that is dependent on the digital power supply used (DVDD). The comparator was designed to operate at speeds comparable to the DDS output frequency range (approximately 0-50MHz). It is not intended for low jitter applications. The comparator has a sleep mode that is activated by connecting both inputs (IN- and IN+) to the analog power supply plane. This will save approximately 4mA of current (as shown in the Typical Application Circuit). If the comparator is not used, leave the COMPOUT pin floating. DAC Voltage Reference The internal voltage reference for the DAC has a nominal value of +1.2V with a ±60ppm/ oC drift coefficient over the full temperature range of the converter. It is recommended that a 0.1µF capacitor be placed as close as possible to the REFIO pin, connected to the analog ground. The REFLO pin (11) selects the reference. The internal reference can be selected if pin 11 is tied low (ground). If an external reference is desired, then pin 11 should be tied high (the analog supply voltage) and the external reference driven into REFIO, pin 12. The full scale output current of the converter is a function of the voltage reference used and the value of RSET. IOUT should be within the 2mA to 20mA range, though operation below 2mA is possible, with performance degradation. 4 3 A RESET pin is available which resets all registers to their defaults. In order to reset the part, the user must take the RESET pin low, allow at least one CLK rising edge, and then take the RESET pin high again. The latency from the RESET pin going high until the output reflects the reset is 11 CLK cycles. See the register description table in the back of the datasheet for the default states of all bits in all addresses. After RESET goes high, one rising edge of CLK is required before the control registers can be written to again. IOUTA and IOUTB are complementary current outputs. They are generated by a 14-bit digital-to-analog converter (DAC) that is capable of running at the full 125MSPS rate. The DDS clock also clocks the DAC. The sum of the two output currents is always equal to the full scale output current minus one LSB. If single ended use is desired, a load resistor can be used to convert the output current to a voltage. It is recommended that the unused output be either grounded or equally terminated. The voltage developed at the output must not violate the output voltage compliance range of -1.0V to 1.25V. RLOAD (the impedance loading each current output) should be chosen so that the desired output voltage is produced in conjunction with the output full scale current. If a known line impedance is to be driven, then the output load resistor should be chosen to match this impedance. The output voltage equation is: These outputs can be used in a differential-to-single-ended arrangement. This is typically done to achieve better harmonic rejection. Because of a mismatch in IOUTA and IOUTB, the transformer does not improve the harmonic rejection. However, it can provide voltage gain without adding distortion. The SFDR measurements in this data sheet were performed with a 1:1 transformer on the output of the DDS (see Figure 1). With the center tap grounded, the output swing of pins 17 and 18 will be biased at zero volts. The loading as shown in Figure 1 will result in a 500mVP-P signal at the output of the transformer if the full scale output current of the DAC is set to 20mA. R EQ IS THE IMPEDANCE LOADING EACH OUTPUT 50Ω PIN 17 IOUTB 100Ω PIN 18 HSP45314 VOUT = (2 x IOUT x REQ)VPP 50Ω IOUTA 50Ω 50Ω REPRESENTS THE SPECTRUM ANALYZER FIGURE 1. VOUT = 2 x IOUT x REQ, where REQ is ~12.5Ω. Allowing the center tap to float will result in identical transformer output, however the output pins of the DAC will have positive DC offset, which could limit the voltage swing available due to the output voltage compliance range. The 50Ω load on the output of the transformer represents the load at the end of a SIGNAL PROCESSING Control Pins HSP45314 ‘transmission line’, typically a spectrum analyzer, oscilloscope, or the next function in the signal chain. The necessity to have a 50Ω impedance looking back into the transformer is negated if the DDS is only driving a short trace. The output voltage compliance range does limit the impedance that is loading the DDS output. Ground Plane Considerations Separate digital and analog ground planes should be used. All of the digital functions of the device and their corresponding components should be located over the digital ground plane and terminated to the digital ground plane. The same is true for the analog components and the analog ground plane. Pins 11 through 24 are analog pins, while all of the others are digital. Noise Reduction Considerations To minimize power supply noise, 0.1µF capacitors should be placed as close as possible to the power supply pins, AVDD and DVDD. Also, the layout should be designed using separate digital and analog ground planes and these capacitors should be terminated to the digital ground for DVDD and to the analog ground for AVDD. Additional filtering of the power supplies on the board is recommended. Power Supplies The DDS will provide the best SFDR (Spurious Free Dynamic Range) when using +5V analog and +5V digital power supply. The analog supply must be +5V (±10%). The digital supply can be either a +3.3V (±10%) or a +5V (±10%) supply, or anything in between. The DDS is rated to 125MSPS when using a +5V digital supply. The maximum clock is 100MSPS when using a +3.3V digital supply. 5 Improving SFDR As was previously noted, using +5V power supplies provides the best SFDR. Under some clock and output frequency combinations, particularly when the fCLK/fOUT ratio is less than 4, the user can improve SFDR even further by connecting the COMP2 pin (19) of the DDS to the analog power supply. The digital supply must be +5V if this option is explored. Improvements as much as 6dBc in the SFDR-toNyquist measurement were seen in the lab. FSK Modulation BFSK (Binary Frequency Shift Keying) can be done by enabling and disabling the offset frequency (ENOFR pin). Once the offset frequency has been written once, it can be toggled with a latency of 14 CLK cycles. M-ary FSK or GFSK can be done by continuously loading in new frequency words. Quadrature Local Oscillators Two HSP45314s can be used as sine/cosine generators for quadrature local oscillator applications. It is important to note that the Phase Accumulator feedback needs to be zeroed in both devices if it is desired that both DDSs restart with a known phase, which is determined by the use of the phase control pins, PH1 and PH0. To zero the phase accumulator, pull bit 5 of address 13 low and then high again at the same time in both devices. HSP45314 Absolute Maximum Ratings Thermal Information Digital Supply Voltage DVDD to DGND . . . . . . . . . . . . . . . . . . +5.5V Analog Supply Voltage AVDD to AGND . . . . . . . . . . . . . . . . . . +5.5V Grounds, AGND To DGND. . . . . . . . . . . . . . . . . . . . . -0.3V To +0.3V Digital Input Voltages . . . . . . . . . . . . . . . . . . . . . . . . . DVDD + 0.3V Reference Input Voltage Range . . . . . . . . . . . . . . . . . . AVDD + 0.3V Analog Output Current (IOUT) . . . . . . . . . . . . . . . . . . . . . . . . . 24mA Thermal Resistance (Typical, Note 1) θJA(oC/W) LQFP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . .150oC Maximum Storage Temperature Range . . . . . . . . . . -65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . .300oC Operating Conditions Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 85oC CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 1. θJA is measured with the component mounted on an evaluation PC board in free air. Electrical Specifications AVDD = DVDD = +5V (unless otherwise noted), VREF = Internal 1.2V, IOUTFS = 20mA, TA = 25oC for All Typical Values HSP45314 TA = -40oC TO 85oC PARAMETER TEST CONDITIONS MIN TYP MAX UNITS 14 - - Bits DAC CHARACTERISTICS DAC Resolution Integral Linearity Error, INL “Best Fit” Straight Line (Note 7) -5 +2.5 +6 LSB Differential Linearity Error, DNL (Note 7) -2 +1.5 +4 LSB Offset Error, IOS (Note 7) -0.025 +0.025 % FSR Offset Drift Coefficient (Note 7) - 0.1 - ppm FSR/oC Full Scale Gain Error With Internal Reference (Notes 2, 7) -10 ±1 +10 % FSR Full Scale Gain Drift With Internal Reference (Note 7) - ±50 - ppm FSR/oC Full Scale Output Current (Note 3) 2 - 20 mA Output Voltage Compliance Range (Note 3, 7) -1.0 - 1.25 V Maximum Clock Rate, fCLK +5V DVDD , +5V AVDD (Note 3) 125 - - MSPS Maximum Clock Rate, fCLK +3.3V DVDD , +5V AVDD (Note 3) 100 - - MSPS Output Settling Time, (tSETT) ±0.05% (±8 LSB) (Note 7) - 35 - ns Output Rise Time Full Scale Step - 2.5 - ns Output Fall Time Full Scale Step - 2.5 - ns - 25 - pF IOUTFS = 20mA - 50 - pA/√Hz IOUTFS = 2mA - 30 - pA/√Hz DAC DYNAMIC CHARACTERISTICS Output Capacitance Output Noise 6 HSP45314 Electrical Specifications AVDD = DVDD = +5V (unless otherwise noted), VREF = Internal 1.2V, IOUTFS = 20mA, TA = 25oC for All Typical Values (Continued) HSP45314 TA = -40oC TO 85oC MIN TYP MAX UNITS fCLK = 100MSPS, fOUT = 20MHz, 5MHz Span - 93 - dBc fCLK = 100MSPS, fOUT = 5MHz, 8MHz Span - 93 - dBc fCLK = 50MSPS, fOUT = 5MHz, 8MHz Span - 93 - dBc fCLK = 125MSPS, fOUT = 40.4MHz - 40 - dBc fCLK = 125MSPS, fOUT = 10.1MHz 57 63 - dBc fCLK = 125MSPS, fOUT = 5.02MHz - 72 - dBc fCLK = 100MSPS, fOUT = 40.4MHz - 40 - dBc fCLK = 100MSPS, fOUT = 20.2MHz - 49 - dBc fCLK = 100MSPS, fOUT = 5.04MHz - 72 - dBc fCLK = 100MSPS, fOUT = 2.51MHz - 73 - dBc fCLK = 50MSPS, fOUT = 20.2MHz - 45 - dBc fCLK = 50MSPS, fOUT = 5.02MHz - 68 - dBc fCLK = 50MSPS, fOUT = 2.51MHz - 72 - dBc fCLK = 50MSPS, fOUT = 1.00MHz - 71 - dBc fCLK = 25MSPS, fOUT = 1.0MHz - 72 - dBc 1.13 1.2 1.28 V Internal Reference Voltage Drift - ±60 - ppm/oC Internal Reference Output Current Sink/Source Capability - ±0.1 - µA Reference Input Impedance - 1 - MΩ Reference Input Multiplying Bandwidth (Note 7) - 1.4 - MHz PARAMETER TEST CONDITIONS AC CHARACTERISTICS Spurious Free Dynamic Range, SFDR Within a Window (Notes 4, 7) Spurious Free Dynamic Range, SFDR to Nyquist (fCLK/2) (Notes 4, 7) DAC REFERENCE VOLTAGE Internal Reference Voltage, VFSADJ Pin 13 Voltage with Internal Reference DIGITAL INPUTS Input Logic High Voltage with 5V Digital Supply, VIH (Note 3) 3.5 5 - V Input Logic High Voltage with 3V Digital Supply, VIH (Note 3) 2.0 3 - V Input Logic Low Voltage with 5V Digital Supply, VIL (Note 3) - 0 1.3 V Input Logic Low Voltage with 3V Digital Supply, VIL (Note 3) - 0 0.8 V Input Logic Current, IIH -10 - +10 µA Input Logic Current, IIL -10 - +10 µA - 4 - pF Digital Input Capacitance, CIN 7 HSP45314 Electrical Specifications AVDD = DVDD = +5V (unless otherwise noted), VREF = Internal 1.2V, IOUTFS = 20mA, TA = 25oC for All Typical Values (Continued) HSP45314 TA = -40oC TO 85oC PARAMETER TEST CONDITIONS MIN TYP MAX UNITS TIMING CHARACTERISTICS Maximum Clock Rate, fCLK +5V DVDD , +5V AVDD (Note 3) 125 - - MSPS Maximum Clock Rate, fCLK +3.3V DVDD , +5V AVDD (Note 3) 100 - - MSPS CLK Pulse Width, tCW CLK (Note 3) 5 - - ns Maximum Parallel Write Rate Rate of WR 50 - - MSPS WR Pulse Width, tWW (Note 3) 5 - - ns Data Setup Time, tDS Between DATA and WR (Note 3) 10 - - ns Data Hold Time, tDH Between DATA and WR (Note 3) 0 - - ns Address Setup Time, tAS Between ADDR and WR (Note 3) 12 - - ns Address Hold Time, tAH Between ADDR and WR (Note 3) 0 - - ns UPDATE Pulse Width, tUW (Note 3) 5 - - ns UPDATE Setup Time, tUS Between UPDATE and CLK (Note 3) 2 - - ns UPDATE Hold Time, tUH Between UPDATE and CLK (Note 3) 4 - - ns UPDATE Latency, tUL After UPDATE, before analog output change, if asserted after writing to the control registers - 14 - Clock Cycles UPDATE Latency, tUL After UPDATE, before analog output change, if asserted before writing to the control registers - 11 - Clock Cycles Phase Pulse Width, tPW PH(1:0) (Note 3) 5 - - ns Phase Setup Time, tPS Between PH(1:0) change and CLK (Note 3) 2 - - ns Phase Hold Time, tPH Between PH(1:0) change and CLK (Note 3) 4 - - ns Phase Latency, tPL Between PH(1:0) change and analog output change - 12 - Clock Cycles ENOFR Pulse Width, tEW ENOFR (Note 3) 5 - - ns ENOFR Setup Time, tES Between ENOFR and CLK (Note 3) 2 - - ns ENOFR Hold Time, tEH Between ENOFR and CLK (Note 3) 4 - - ns ENOFR Latency, tEL After ENOFR, before analog output change - 14 - Clock Cycles Write Enable Pulse Width, tWR WE (Note 3) 5 - - ns Write Enable Setup Time, tWS Between WE and WR (Note 3) 2 - - ns Write Enable Hold Time, tWH Between WE and WR (Note 3) 4 - - ns RESET Pulse Width, tRW RESET (Note 3) 5 - - ns RESET Setup Time, tRS Between RESET and CLK - 2 - ns RESET Latency to Output, tRL After RESET, before analog output reflects reset values - 11 - Clock Cycles RESET Latency to Write, tRE After RESET, before the control registers can be written to - 1 - Clock Cycles 8 HSP45314 Electrical Specifications AVDD = DVDD = +5V (unless otherwise noted), VREF = Internal 1.2V, IOUTFS = 20mA, TA = 25oC for All Typical Values (Continued) HSP45314 TA = -40oC TO 85oC MIN TYP MAX UNITS Input Capacitance - 4 - pF Input Resistance - >1 - MΩ Input Current - 1 - µA - 4.0 3.75 V Minimum Input Voltage, Peak-to-Peak (Dependent on noise) - 0.1 - Vpp Propagation Delay, High to Low (Note 8) - 6 - ns Propagation Delay, Low to High (Note 8) - 5 - ns Output Rise Time (Note 8) - 1.5 - ns Output Fall Time (Note 8) - 1.3 - ns Output High Voltage, VOH IOH = -4mA 2.6 - - V Output Low Voltage, VOL IOL = +4mA - - 0.4 V Maximum Output Toggle Rate High Z Load (~1MΩ) - 100 - MHz AVDD (Analog) Power Supply 4.5 5.0 5.5 V DVDD (Digital) Power Supply 3.0 3.3 5.5 V 5V, IOUTFS = 20mA (Note 10) - 25 30 mA 5V, IOUTFS = 2mA - 7 - mA 5V (Notes 5, 10) - 90 100 mA 3.3V (Notes 6, 9) - 50 55 mA AVDD = 5V, DVDD = 3.3V, IOUTFS = 20mA (Notes 6, 9) - 290 363 mW AVDD = 5V, DVDD = 5V, IOUTFS = 20mA (Notes 5, 10) - 625 715 mW -0.2 - +0.2 % FSR/V PARAMETER TEST CONDITIONS COMPARATOR CHARACTERISTICS Maximum Input Voltage Allowed (Excluding comparator sleep mode) POWER SUPPLY CHARACTERISTICS Analog Supply Current (IAVDD) Digital Supply Current (IDVDD) Power Dissipation Power Supply Rejection Single 5V Supply (Note 7) NOTES: 2. Gain Error for the DAC is measured as the error in the ratio between the full scale output current and the current through RSET (typically 625µA); ideally the ratio should be 32. 3. Parameter guaranteed by design or characterization and not production tested. 4. Spectral measurements made with differential transformer coupled output and no external filtering. 5. Measured with the clock at 125MSPS and the output frequency at 10MHz. 6. Measured with the clock at 100MSPS and the output frequency at 10MHz. 7. See “Definition of Specifications”. 8. 50MHz, High Z Load (~1MΩ), 15pF capacitance, (IN- = 0.5Vpp), (IN+ = 0.25VDC). 9. For maximum value, 5.5V AVDD and 3.6V DVDD are used. 10. For maximum value, 5.5V AVDD and 5.5V DVDD are used. 9 HSP45314 Definition of Specifications Differential Non-Linearity, DNL, is the measure of the step size output deviation from code to code. Ideally the step size should be 1LSB. A DNL specification of 1LSB or less guarantees monotonicity. Integral Non-Linearity, INL, is the measure of the worst case point that deviates from a best fit straight line of data values along the transfer curve. Full Scale Gain Drift, is measured by setting the DAC inputs to be all logic high (all 1s) and measuring the output voltage through a known resistance as the temperature is varied from TMIN to TMAX . It is defined as the maximum deviation from the value measured at room temperature to the value measured at either TMIN or TMAX . The units are ppm of FSR (Full Scale Range) per oC. Full Scale Gain Error, is the error from an ideal ratio of 32 between the DAC output current and the full scale adjust current (through RSET). Internal Reference Voltage Drift, is defined as the maximum deviation from the value measured at room temperature to the value measured at either TMIN or TMAX . The units are ppm per oC. Offset Drift, is measured by setting the DAC inputs to all logic low (all 0s) and measuring the output voltage through a known resistance as the temperature is varied from TMIN to TMAX . It is defined as the maximum deviation from the value measured at room temperature to the value measured at either TMIN or TMAX . The units are ppm of FSR (Full Scale Range) per degree oC. 10 Offset Error, is measured by setting the DAC inputs to all logic low (all 0s) and measuring the output voltage through a known resistance. Offset error is defined as the maximum deviation of the output current from a value of 0mA. Output Settling Time, is the time required for the output voltage to settle to within a specified error band measured from the beginning of the output transition. The measurement is done by switching quarter scale. Termination impedance was 25Ω due to the parallel resistance of the 50Ω loading on the output and the oscilloscope’s 50Ω input. This also aids the ability to resolve the specified error band without overdriving the oscilloscope. Output Voltage Compliance Range, is the voltage limit imposed on the output. The output impedance should be chosen such that the voltage developed at either IOUTA or IOUTB does not violate the compliance range. Power Supply Rejection, is measured using a single power supply. The supply’s nominal +5V is varied ±10% and the change in the DAC full scale output current is noted. Reference Input Multiplying Bandwidth, is defined as the 3dB bandwidth of the voltage reference input. It is measured by using a sinusoidal waveform as the external reference with the digital inputs to the DAC set to all 1s. The frequency is increased until the amplitude of the output waveform is 0.707 (-3dB) of its original value. Spurious Free Dynamic Range, SFDR, is the amplitude difference from the fundamental signal to the largest harmonically or non-harmonically related spur within the specified frequency window. HSP45314 Timing Diagrams tWS WE tAS tWH tAH ADDR A0 A1 A2 A3 A4 A5 DON’T CARE DATA W0 W1 W2 W3 W4 W5 DON’T CARE tDS tDH WRITE DON’T CARE 6 WRITE CYCLES MAX, 1 FOR EVERY 8 BIT WORD CLK DON’T CARE tUS UPDATE tUL = 14 CLK RISING EDGES tUD ANALOG OUT OLD FREQ NEW FREQ FIGURE 2. PARALLEL-LOAD METHOD 1, UPDATE ACTIVE AFTER LOADING REGISTERS (RESET = HIGH) tWH tWS WE tAS tAH ADDR A0 A1 A2 A3 A4 A5 DON’T CARE DATA W0 W1 W2 W3 W4 W5 DON’T CARE tDS tDH WRITE DON’T CARE t = 6 WRITE CYCLES MAX, 1 FOR EVERY 8 BIT WORD CLK DON’T CARE tUL= 11 CLK RISING EDGES UPDATE PREVIOUS FREQ ANALOG OUT ENTIRE NEW FREQ PARTIAL UPDATES FIGURE 3. PARALLEL-LOAD METHOD 2, UPDATE ACTIVE WHILE LOADING REGISTERS (RESET = HIGH) 11 HSP45314 Timing Diagrams (Continued) ONE CLK RISING EDGE REQUIRED WHILE RESET LOW CLK tRS RESET tRL = 11 CLK RISING EDGES PREVIOUS REGISTER VALUES ANALOG OUT RESET REGISTER VALUES FIGURE 4. RESET TIMING AND LATENCY CLK tEH ENOFR tES CENTER FREQUENCY ONLY ANALOG OUT CENTER + OFFSET CENTER ONLY CENTER + OFFSET tEL = 14 CLK RISING EDGES FIGURE 5. ENOFR (ENABLE OFFSET FREQUENCY REGISTER) TIMING AND LATENCY (RESET = HIGH) Pin Descriptions PIN NO. PIN NAME TYPE PIN DESCRIPTION 44-48, 1-3 C(7:0) Input 8-bit Processor Input Data Bus. C7 is the MSB. Data is written to the control register selected on A(3:0) on the rising edge of WR when WE is active. 42 WR Input Write Clock For The Processor Interface. Parallel data is clocked into the chip on the rising edge of WR. 40 WE Input Write Enable. Active low. WE must be active when writing data to the chip. 35-38 A(3:0) Input Processor Interface Address Bus. These pins select the destination register for data on the C(7:0) bus. A3 is the MSB. 6 CLK Clock NCO and DAC Clock. The phase accumulator and DAC output update on the rising edge of this clock. CLK can be asynchronous to the WR clock. 8 RESET Input Reset. Active Low. Resets control registers to their default states (see register description table) and zeroes the feedback in the phase accumulator. UPDATE must be low for Reset to occur. 30 DGND (Input) Connect to DGND. Future serial clock input. 27 DGND (Input) Connect to DGND. Future serial data input. 32 DGND (Input) Connect to DGND. Future serial sync input. 9 UPDATE Input 12 Active Low. Updates the active control registers only. It has no effect on the ENOFR or PH(1:0) pins. This pin is provided for updating an entire frequency word at once rather than byte by byte. HSP45314 Pin Descriptions (Continued) PIN NO. PIN NAME TYPE PIN DESCRIPTION 33, 34 PH(1:0) Input Phase Offset Bits. The phase of the output is shifted. If not used, these pins should be grounded. 00 – 0 degrees reference 01 – 90 degrees shift 10 – 180 degrees shift 11 – 270 degrees shift 4 ENOFR Input Enable Offset Frequency. Active High. When high, the offset frequency bus is enabled to the phase accumulator. When low, the offset frequency bus is zeroed. This pin does not affect the contents of the offset frequency registers. If not used, the pin should be grounded. 10 COMPOUT Output 11 REFLO Input Connect to analog ground to enable the DAC’s internal 1.2V reference or connect to AVDD to disable the internal reference. 12 REFIO Input Reference voltage input for the DAC if internal reference is disabled. Recommend the use of a 0.1µF cap to ground from the REFIO pin when a DC reference voltage is used. 13 FSADJ Full Scale Current Adjust for the DAC. Use a resistor to ground (RSET) to adjust the full scale output current. Full Scale Output Current = 32 x VFSADJ/RSET, where VFSADJ equals the reference voltage. 14 COMP1 Noise reduction for the DAC. Connect a 0.1µF cap to AVDD plane. 19 COMP2 Noise reduction for the DAC. Connect a 0.1µF cap to AGND plane. 18 IOUTA Output DAC Current Output. 17 IOUTB Output DAC Complementary Current Output. 20 AVDD Power Analog Supply Voltage. 15, 16, 21, 24 AGND Gnd 7, 26, 31, 43 DVDD Power 5, 25, 28, 29, 41 DGND Gnd Digital Ground. 22, 23 IN+, IN- Input Comparator Inputs. To power down the comparator, connect both of these pins to the analog power supply. This will conserve ~4mA of current. 39 NC NC Comparator Output. Analog Ground. Digital Supply Voltage. No Connect. Control Register Descriptions DESCRIPTION RESET STATE ADDRESS BITS 0 7:0 Center frequency bits CF(7:0) (Least Significant Byte). 00 h 1 7:0 Center frequency bits CF(15:8). 00 h 2 7:0 Center frequency bits CF(23:16). 00 h 3 7:0 Center frequency bits CF(31:24). 00 h 4 7:0 Center frequency bits CF(39:32). 00 h 5 7:0 Center frequency bits CF(47:40) (MSByte). (Reset gives fCLK/4 output). 40 h 6 7:0 Offset frequency bits OF(7:0) (LSByte). 00 h 7 7:0 Offset frequency bits OF(15:8). 00 h 8 7:0 Offset frequency bits OF(23:16). 00 h 9 7:0 Offset frequency bits OF(31:24). 00 h 10 7:0 Offset frequency bits OF(39:32). 00 h 11 7:0 Offset frequency bits OF(47:40) (MSByte). 00 h 13 HSP45314 Control Register Descriptions ADDRESS BITS 12 7:1 0 13 14 7:0 (Continued) RESET STATE DESCRIPTION Bits 7 through 1 are Intersil reserved for future serial input control. Do Not Change. 00 h Center Frequency Enable. 1 = enable, 0 = center frequency disabled. This bit can be used to zero the center frequency (CF(47:0)) to the phase accumulator. This does not zero the processor interface registers - just the data path from the registers to the phase accumulator. 1b NCO control word. F8 h 7 Intersil reserved. Do Not Change. 1b 6 Intersil Reserved. Do Not Change. Future Serial output frequency register enable. 1b 5 Phase accumulator feedback. 0 = accumulator feedback disabled, 1 = accumulator enabled. 1b 4:0 Intersil reserved. Do Not Change. 11000 b 7:0 User should write 30 h to address 14 after RESET. 10 h 5:4 NCO-to-DAC setup and hold time control. Set to 11b. 01 b All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification. Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see web site www.intersil.com Sales Office Headquarters NORTH AMERICA Intersil Corporation P. O. Box 883, Mail Stop 53-204 Melbourne, FL 32902 TEL: (321) 724-7000 FAX: (321) 724-7240 14 EUROPE Intersil SA Mercure Center 100, Rue de la Fusee 1130 Brussels, Belgium TEL: (32) 2.724.2111 FAX: (32) 2.724.22.05 ASIA Intersil (Taiwan) Ltd. 7F-6, No. 101 Fu Hsing North Road Taipei, Taiwan Republic of China TEL: (886) 2 2716 9310 FAX: (886) 2 2715 3029
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