QMS-048-05.75-L-D-DP-A

F-214 (Rev 15MAY14) QMS–032–06.75–L–D–DP–A TM QMS–026–06.75–L–D–A (0,635 mm) .025" QMS SERIES RUGGED GROUND PLANE HEADER SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?QMS Insulator Material: Liquid Crystal Polymer Terminal & Ground Plane Material: Phosphor Bronze Plating: Au over 50µ" (1,27 µm) Ni (Tin on Ground Plane Tail) Current Rating: Contact: 2.6 A per pin (1 pin powered per row) Ground Plane: 15.7 A per ground plane (1 ground plane powered) Voltage Rating: 300 VAC mated with QFS Operating Temp: -55°C to +125°C RoHS Compliant: Yes Processing: Lead–Free Solderable: Yes SMT Lead Coplanarity: (0,10 mm) .004" max (026-052) (0,15 mm) .006" max (078) Board Stacking: For applications requiring more than two connectors per board, contact ipg@samtec.com Integral metal plane for power or ground Board Mates: QFS Cable Mates: 6QCD (MOQ Required) Type PINS PER ROW NO. OF PAIRS QMS –026, –052, –078 (52 total pins per bank = –D) LEAD STYLE PLATING OPTION Specify LEAD STYLE from chart –L (16 pairs per bank = –D–DP) TM SUMIT TM 4-Express 10 I/ PC s ocol Prot orted Supp 100 GbE nel Fibre Chan XAUI ® s PCI Expres SATA notes at Download app ppnote /a om c.c te m www.sa @ samtec.com Contact SIG on protocols for questions Note: Some lengths, styles and options are non-standard, non-returnable. • Other platings • Guide Posts • Without PCB Alignment Pins (05.75 and 06.75 only) • Hot Pluggable • 64 (-DP) and 104 positions per row Contact Samtec. Rated @ 3dB Insertion Loss with PCB effects* w/o PCB effects** Single-Ended Signaling –D 9 GHz / 18 Gbps 8 GHz / 16 Gbps Differential Pair Signaling –D 8 GHz / 16 Gbps 8.5 GHz / 17 Gbps Differential Pair Signaling –DP 7.5 GHz / 15 Gbps 9 GHz / 18 Gbps *Performance data includes effects of a non-optimized PCB. **Test board losses de-embedded from performance data. Performance data for other stack heights and complete test data available at www.samtec.com?QMS or contact sig@samtec.com QMS/QFS 10 mm Stack Height –016, –032, –048 stry Indu ards d Stan ALSO AVAILABLE (1,60 mm) .063" NOMINAL WIPE RECOGNITIONS For complete scope of recognitions see www.samtec.com/quality Increased insertion depth for rugged applications (–05.75 and –06.75 lead style only) = 10µ" (0,25 µm) Gold on Signal Pins and Ground Plane (Tin on Signal Pin tails, and Ground Plane tails) –SL A –05.75 –06.75 –09.75 (–09.75 lead style only) = 10µ" (0,25 µm) Gold on Signal Pins and Ground Plane (Tin on Signal Pin tails, and Ground Plane tails) QFS LEAD STYLE –04.25 –06.25 (5,38) .212 10 mm 12 mm (6,35) .250 11 mm 13 mm (9,35) .368 14 mm 16 mm *Processing conditions will affect mated height. (6,35) .250 (0,635) .025 (0,23) .009 INDUSTRY STANDARD 02 A –D = Single-Ended –D–DP = Differential Pair APPLICATION WWW.SAMTEC.COM (0,44) .017 INTERCONNECTS TERMINAL SOCKET SUMIT™ ASP-129637-01 ASP-129646-01 PCI/104-Express™ ASP-129637-03 ASP-129646-03 PCI/104-Express™ ASP-142781-02 ASP-129646-02 PCI/104-Express™ ASP-142781-03 ASP-129646-03 –D–DP = (5,50 mm) .217" DIA Polyimide film Pick & Place Pad Requires Standoff SO-1524-03-01-01-L for 15,24 mm or SO-2215-02-01-01-L for 22 mm board spacing. Connectors designed to not fully seat when mated. (7,52) .296 (7,26) .286 –D STACK HEIGHT (0,25) .010 (No. of Banks) x (21,34) .840 - (0,51) .020 (21,34) .840 01 (2,29) .090 OTHER OPTION –K MATED HEIGHT* LEAD STYLE A TYPE STACK BANKS HEIGHT 1 3 2 3 15,24 mm 15,24 mm 22 mm 22 mm