LSEM-130-03.0-L-DV-A-N-K-T

F-217 LSEM–120–06.0–F–DV–A–N–K–TR LSEM–150–03.0–F–DV–A–N–K–TR LSEM–120–01–L–DH–A–N–K–TR SYSTEM (0.80 mm) .0315" LSEM SERIES HIGH-SPEED HERMAPHRODITIC STRIP High-speed/High-density SPECIFICATIONS Mates with: LSEM Audible click when properly mated For complete specifications and recommended PCB layouts see www.samtec.com?LSEM Insulator Material: Black Liquid Crystal Polymer Contact Material: Phosphor Bronze Plating: Au or Sn over 50 µ" (1.27 µm) Ni Current Rating: 1.8 A per pin (2 adjacent pins powered) Operating Temp Range: -55 °C to +125 °C RoHS Compliant: Yes PROCESSING Lead-Free Solderable: Yes SMT Lead Coplanarity: (0.10 mm) .004" max Board Stacking: For applications requiring more than two connectors per board, contact ipg@samtec.com RECOGNITIONS • High retention contacts • Shrouded HIGH-SPEED CHANNEL PERFORMANCE LSEM-DV/LSEM-DV @ 10 mm Mated Stack Height Rating based on Samtec reference channel. For full SI performance data visit Samtec.com or contact SIG@samtec.com LSEM 1 NO. PINS PER ROW For complete scope of recognitions see www.samtec.com/quality 20, 30, 40, 50 FILE NO. E111594 Mated height variety/flexibility Low cost Blade & Beam contact • Audible click when mated 26 LEAD STYLE PLATING OPTION Specify LEAD STYLE from chart = Gold flash on contact, Matte Tin on tail –F –L =10 µ" (0.25 µm) Gold on contact, Matte Tin on tail MATED HEIGHT LEAD STYLE A –01 No. of positions x (0.80) .0315 + (4.40) .173 LEAD STYLE MATED HEIGHT* –04.0 –03.0 & –03.0 (6.00) .236 –06.0 –03.0 & –04.0 (7.00) .276 –04.0 & –04.0 (8.00) .315 –03.0 & –06.0 (9.00) .354 –04.0 & –06.0 (10.00) .394 –06.0 & –06.0 (12.00) .472 01 TAIL OPTION A N (0.80) .0315 No. of positions x (0.80) .0315 + (1.70) .067 (1.40) .055 TR –K –DV = (5.50 mm) .217" DIA Polyimide film Pick & Place Pad = Vertical –DH = Right-angle (Lead style –01 only) –TR = Tape & Reel NA NA (1.50) .059 (2.50) .098 (4.50) .177 No. of positions x (0.80) .0315 + (4.40) .173 (0.80) .0315 02 01 (4.98) .196 (7.80) .307 (5.13) .202 02 K B (4.45) .175 (5.45) .215 (7.45) .293 (-DH only) –03.0 *Processing conditions will affect mated height. Slim row-to-row design G b p s APPLICATION LSEM Self-mating system can reduce inventory costs (1.32) .052 DIA B No. of positions x (0.80) .0315 + (1.70) .067 –DH Note: Some lengths, styles and options are non-standard, non-returnable. WWW.SAMTEC.COM Due to technical progress, all designs, specifications and components are subject to change without notice. –DV (0.85) .033 A