PCIE-G4-16-01-S-DV-A-K

PCI EXPRESS® EDGE CARD SOCKETS (1.00 mm) .0394" PITCH FEATURES & BENEFITS • 1.00 mm pitch • Supports 1, 4, 8 and 16 PCI Express® links • PCIE® 3.0 Solution (PCIE) 11 mm 8 mm • PCIE® 4.0 Solution with low-profile design for space savings (PCIE-LP) • PCIE® 4.0 with slim body design (PCIE-G4) • PCIE® 5.0 Solution with differential pair signaling (PCIE-G5) • Vertical, right-angle and edge mount PCIE • Mates with .062" (1.60 mm) thick cards PCIE -LP PCIE® 3.0 & 4.0 Edge Card connectors • Alignment pin and weld tab options PCIE® 4.0 slim body socket with Edge Rate® contacts (PCIE-G4) KEY SPECIFICATIONS SERIES TOTAL PINS (LANES) INSULATOR MATERIAL CONTACT MATERIAL OPERATING TEMP RANGE CURRENT RATING VOLTAGE RATING PCIE® COMPATIBILITY PCIE 36 (x1), 64 (x4), 98 (x8), 164 (x16) -TH = Black Nylon -EMS2 & -TH = LCP Phosphor Bronze -55 °C to +125 °C 2.4 A (2 pins) 215 VAC 3.0 PCIE-LP 36 (x1), 64 (x4), 98 (x8), 164 (x16) LCP Phosphor Bronze -55 °C to +125 °C 2.1 A (2 pins) 215 VAC 4.0 PCIE-G4 36 (x1), 64 (x4), 98 (x8), 164 (x16) LCP Copper Alloy -55 °C to +125 °C 2.2 A (2 pins) 300 VAC 4.0 PCIE-G5 36 (x1), 64 (x4), 98 (x8), 164 (x16) LCP Copper Alloy -55 °C to +125 °C 3.2 A (2 pins) 235 VAC 5.0 F-221 (Rev 30MAR22) samtec.com/EdgeCard Unless otherwise approved in writing by Samtec, all parts and components are designed and built according to Samtec’s specifications which are subject to change without notice. 4.0 & 5.0 SOLUTIONS (1.00 mm) .0394" PITCH • PCI EXPRESS ® 4.0 SOCKET PCIE - G4 - - NUMBER OF LANES 01 - –01, –04, –08, –16 PLATING OPTION - DV - –F - OPTION 1 OPTION 2 –A = Gold flash on contact, Matte Tin on tail –K = Alignment Pin (Not available with -WT) –S = Weld Tab (Not available with -A) –TR = Tape & Reel (“X”R required with –01, –04, –08 lanes) –FR = Full Reel Tape & Reel (must order max. quantity per reel; contact Samtec for quantity breaks) (“X”R required with –01, –04, –08 lanes) (5.60) .220 PCIE-G4 Card Mates: (1.60 mm) .062" card PACKAGING (For -16 lanes only leave blank for Tray Packaging) = (7.00 mm) .275" DIA Polyimide Pick & Place Pad –WT = 30 µ" (0.76 µm) Gold on contact, Matte Tin on tail - A (7.98) .314 NUMBER OF LANES A –01 (24.80) .976 –04 (38.80) 1.528 –08 (55.80) 2.197 –16 (88.80) 3.496 View complete specifications at: samtec.com?PCIE-G4 (1.00 mm) .0394" PITCH • PCI EXPRESS ® 5.0 SOCKET PCIE - G5 - - NUMBER OF LANES 01 - –01, –04, –08, –16 PLATING OPTION - DP - A - –F OPTION –WT = Gold flash on contact, Matte Tin on tail = Weld Tab (For -16 lanes only leave blank for Tray Packaging) = Tape & Reel (“X”R required with –01, –04, –08 lanes) –FR (5.60) .220 Card Mates: (1.60 mm) .062" card PACKAGING –TR –S = 30 µ” (0.76 µm) Gold on contact, Matte Tin on tail PCIE-G5 - A (10.00) .394 (10.20) .402 = Full Reel Tape & Reel (must order max. quantity per reel; contact Samtec for quantity breaks) (“X”R required with –01, –04, –08 lanes) PCIE-G5-04-01-X-DP-A SHOWN NUMBER OF LANES PCI-SIG®, PCI Express® and the PCIe® design marks are registered trademarks and/or service marks of PCI-SIG. Note: Some lengths, styles and options are non-standard, non-returnable. A B (with –WT) –01 (24.40) .961 (26.70) 1.051 –04 (38.40) 1.512 (40.70) 1.602 –08 (55.40) 2.181 (57.70) 2.272 –16 (88.40) 3.480 (90.70) 3.571 View complete specifications at: samtec.com?PCIE-G5 samtec.com/EdgeCard B PCIE-G5-04-01-X-DP-A-WT SHOWN F-221 (Rev 30MAR22) Unless otherwise approved in writing by Samtec, all parts and components are designed and built according to Samtec’s specifications which are subject to change without notice.