QSE-040-01-F-D

F-217 QSE–028–01–F–D–DP–A ® QSE–060–01–F–D–A QSE–020–01–L–D–A (0.80 mm) .0315" QSE SERIES HIGH-SPEED GROUND PLANE SOCKET SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?QSE Insulator Material: Liquid Crystal Polymer Terminal Material: Phosphor Bronze Plating: Au or Sn over 50 µ" (1.27 µm) Ni Current Rating: Contacts: 2 A per pin (1 pin powered per row) Ground Plane: 23 A per ground plane (1 ground plane powered) Operating Temp Range: -55 °C to +125 °C Voltage Rating: 225 VAC (5 mm Stack Height) Max Cycles: 100 RoHS Compliant: Yes Board Mates: QTE Cable Mates: EQCD, EQDP (See Also Available Note) Blade & Beam Design Integral metal plane for power or ground Standoffs: SO HIGH-SPEED CHANNEL PERFORMANCE QSE-DP/QTE-DP @ 5 mm Mated Stack Height Rating based on Samtec reference channel. For full SI performance data visit Samtec.com or contact SIG@samtec.com 28 10 YEAR MFG WITH 50 µ" GOLD EXTENDED LIFE PRODUCT HIGH MATING CYCLES G b p s PROCESSING Lead–Free Solderable: Yes SMT Lead Coplanarity: (0.10 mm) .004" max (020-060) Board Stacking: For applications requiring more than two connectors per board contact ipg@samtec.com PINS PER ROW NO. OF PAIRS QSE 01 = Gold Flash on Signal Pins and Ground Plane, Matte Tin on tails –020, –040, –060 (40 total pins per bank = –D) –014, –028, –042 –L (14 pairs per bank = –D–DP) FILE NO. E111594 FILE NO: 090871_0_000 PROTOCOLS • 100 GbE • XAUI • PCI Express® • SATA • MGT (Rocket I/O) • InfiniBand™ ALSO AVAILABLE 02 = Electro-Polished Selective 50 µ" (1.27 µm) min Au over 150 µ" (7.49) .295 (3.81 µm) Ni on Signal Pins in contact area, 10 µ" (0.25 µm) min Au over 50 µ" (1.27 µm) Ni on Ground Plane in contact area, Matte Tin over 50 µ" (3.25) (1.27 µm) min Ni on .128 all solder tails (20.00) .7875 (7.24) .285 01 (3.05) .120 (0.80) .0315 (0.15) .006 *Note: –C Plating passes 10 year MFG testing (0.76) .030 (0.89) .035 DIA –D = SingleEnded –D–DP = Differential Pair (–01 only) (0.64) .025 Note: Some lengths, styles and options are non-standard, non-returnable. –L WWW.SAMTEC.COM Due to technical progress, all designs, specifications and components are subject to change without notice. OTHER OPTION –GP = Guide Post (–020 only) –K = (8.25 mm) .325" DIA Polyimide Film Pick & Place Pad –TR –C* –D = (No. of Positions per Row/20) x (20.00) .7875 + (1.27) .050 (MOQ Required) • 15 mm, 22 mm and 30 mm stack height • 30 µ" (0.76 µm) Gold (Specify -H plating for Data Rate cable mating applications.) • Edge Mount • 56 (-DP), 80, 100 positions per row • Retention, Guide Posts and Friction Lock options. Contact Samtec. = 10 µ" (0.25 µm) Gold on Signal Pins and Ground Plane, Matte Tin on tails –D–DP = (No. of Positions per Row/14) x (20.00) .7875 + (1.27) .050 A TYPE –F RECOGNITIONS For complete scope of recognitions see www.samtec.com/quality PLATING OPTION = Tape & Reel Packaging –L = Latching Option (N/A on –042 & –060 positions) QTE MATED HEIGHT LEAD STYLE WITH QSE* –01 –02 –03 –04 –05 –07 –09 (5.00) .197 (8.00) .315 (11.00) .433 (16.00) .630 (19.00) .748 (25.00) .984 (14.00) .551 *Processing conditions will affect mated height. See SO Series for board space tolerances