MIS-019-01-L-D

F-215 MIS–019–01–F–D ® MIS–057–01–L–D MIS–038–01–F–D (0,635 mm) .025" MIS SERIES MIXED TECHNOLOGY SOCKET SPECIFICATIONS Board Mates: MIT For complete specifications and recommended PCB layouts see www.samtec.com?MIS Cable Mates: MICD Insulator Material: Liquid Crystal Polymer Contact Material: Phosphor Bronze Plating: Au or Sn over 50µ" (1,27 µm) Ni Operating Temp Range: -55°C to +125°C Voltage Rating: 275 VAC Max Cycles: 100 RoHS Compliant: Yes Processing: Lead–Free Solderable: Yes SMT Lead Coplanarity: (0,10 mm) .004" max (019-057) Board Stacking: For applications requiring more than two connectors per board contact ipg@samtec.com RECOGNITIONS Integral metal plane for power or ground Polarized • Mixed technology footprint MIT/MIS Type Rated @ 3dB Insertion Loss* 5 mm Stack Height Single-Ended Signaling –D 8.5 GHz / 17 Gbps Differential Pair Signaling –D 8.5 GHz / 17 Gbps Differential Pair Signaling –DP 9.5 GHz / 19 Gbps *Performance data includes effects of a non-optimized PCB. Performance data for other stack heights and complete test data available at www.samtec.com?MIS or contact sig@samtec.com MIS 76 signal lines per linear inch OTHER SOLUTIONS • Board Spacing Standoffs. See SO Series. NO. OF POSITIONS PER ROW 01 PLATING OPTION D For complete scope of recognitions see www.samtec.com/quality –K –F –019, –038, –057 = Gold Flash on Signal Pins and Ground Plane, Matte Tin on tails (38 total positions per bank) ALSO AVAILABLE –L (MOQ Required) • 11 mm, 16 mm, 18,75 mm and 22 mm stack height • 30µ" (0,76 µm) Gold • Differential Pair and “Partitionable” (combine differential & single-ended banks in same connector) available. • 76, 95, 114 and 133 positions per row • Edge Mount = 10µ" (0,25 µm) Gold on Signal Pins and Ground Plane, Matte Tin on tails –C* = Electro-Polished Selective 50µ" (1,27 µm) min Au over 150µ" (3,81 µm) Ni on Signal Pins in contact area, 10µ" (0,25 µm) min Au over 50µ" (1,27 µm) Ni on Ground Plane in contact area, Matte Tin over 50µ" (1,27 µm) min Ni on all solder tails (No. of Positions/19) x (12,70) .500 + (12,70) .500 (12,70) .500 01 (6,22) .245 Contact Samtec. (0,635) .025 02 (0,15) .006 (1,32) .052 (3,43) .135 (0,69) .027 (3,63) .143 (7,49) .295 (0,18) .007 *Note: –C Plating passes 10 year MFG testing Note: Some lengths, styles and options are non-standard, non-returnable. OTHER OPTION Note: Rugged through-hole ground plane soldered to board (requires paste-over-hole, not press fit) for added retention to PCB. WWW.SAMTEC.COM Due to technical progress, all designs, specifications and components are subject to change without notice. = (7,00 mm) .275" DIA Polyimide film Pick & Place Pad –TR = Tape & Reel