F-219 (Rev 12MAY20)
MLE–120–01–G–DV
MLE–150–01–G–DV
10 YEAR MFG
WITH 30 µ" GOLD
EXTENDED LIFE
PRODUCT
CLM–126–02–F–D
CLM–111–02–L–D
HIGH MATING
CYCLES
(1.00 mm) .0394"
CLM, MLE SERIES
RUGGED RELIABLE MICRO SOCKETS
SPECIFICATIONS
CLM
For complete specifications and
recommended PCB layouts
see www.samtec.com?CLM
or www.samtec.com?MLE
Insulator Material:
Black LCP
Contact Material:
CLM: Phosphor Bronze
MLE: BeCu
Plating:
CLM: Au or Sn
over 50 µ" (1.27 µm) Ni
MLE: Au over 10 µ"
(0.25 µm) Ni
Current Rating (CLM/FTM):
2.8 A per pin
(2 pins powered)
Current Rating (MLE/FTM):
2.9 A per pin
(2 pins powered)
Operating Temp Range:
-55 °C to +125 °C
Max Cycles:
CLM: 100 with 10 µ" (0.25 µm) Au
Voltage Rating:
MLE: 310 VAC
Insertion Depth:
CLM: Top Entry = (1.40 mm)
.055" min., Bottom Entry =
(2.41 mm) .095" min.
(Add board thickness for
correct post OAL)
MLE: (1.63 mm) .064" to
(3.18 mm) .125" with
(0.38 mm) .015" wipe,
pass-through, or
(2.44 mm) .096" minimum
for bottom entry
Normal Force:
CLM: 40 grams (0.39 N) average
RoHS Compliant:
Yes
Lead-Free Solderable:
Yes
SMT Lead Coplanarity:
(0.10 mm) .004" max (02-25)
(0.15 mm) .006" max (26-50)*
*(.004" stencil solution
may be available; contact
IPG@samtec.com)
RECOGNITIONS
NO. PINS
PER ROW
1
PLATING
OPTION
02
Mates with:
FTM, FTMH, MW
–F
= Bottom Entry
(Required for bottom entry)
–L
(1.00)
.03937
No. of positions x (1.00) .03937
+ (0.318) .0125
100
02
–P
A
04-15
(3.56)
.140
(7.11)
.280
16-50
–P
01
(0.28)
.011
(1.00)
.03937
= (3.50 mm) .138" DIA
Polyimide film Pick & Place Pad
(7 positions minimum)
PIN/ROW
(2.41)
.095
(2.54)
.100
–K
= 10 µ" (0.25 µm)
Gold on contact,
Matte Tin on tail
(5.72)
.225
x
(3.57)
.140
= Pick & Place Pad
(7 positions minimum)
–PA
= Pick & Place Pad with
integral Alignment Pin
(8.26) .325
by A
(3.81)
.150
(2.26)
.089
(2.12)
.084
(1.36)
.054
(3.00)
.118
–TR
= Tape & Reel Packaging
(0.89) .035
DIA
(7.00)
.275
APPLICATION
OPTIONS
–BE
= Gold flash on
contact,
Matte Tin on tail
02 thru 50
–FR
= Full Reel Tape & Reel
(must order max. quantity per
reel; contact Samtec for
quantity breaks)
–PA
ALSO AVAILABLE
(MOQ Required)
• Alignment pin
• Other Gold plating options
Pass-Thru
MLE
1
NO. PINS
PER ROW
01
Mates with:
FTM, FTMH, MW
FILE NO. E111594
100
No. of positions
x (1.00) .03937 + (0.20) .008
(1.00)
.03937
01
(4.32)
.170
(3.12)
.123
DV
(0.64)
.025
DIA
= Alignment Pin
(3 positions minimum)
Metal or plastic at Samtec
discretion
–K
= (4.00 mm) .1575" DIA
Polyimide film Pick & Place Pad
(5 positions minimum)
–A
–P
(6.35)
.250
x
(3.18)
.125
(3.30)
.130
= Metal Pick & Place Pad
(5 positions minimum)
(3.50)
.138
–TR
= Tape & Reel Packaging
–P
Due to technical progress, all designs, specifications and components are subject to change without notice.
WWW.SAMTEC.COM
OPTIONS
–A
(0.71)
.028
(1.00)
02 .03937
(3.07)
.121
(0.30)
.012
PLATING
OPTION
–G
= 10 µ"
(0.25 µm)
Gold
02 thru 50
For complete scope of
recognitions see
www.samtec.com/quality
Note:
Some lengths, styles and
options are non-standard,
non-returnable.
D
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
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