QTH-040-05-L-D-DP-A

F-218 (Rev 10OCT17) QTH–090–01–C–D–A ® QTH–030–01–L–D–A QTH–060–07–F–D–A (0.50 mm) .0197" QTH SERIES HIGH-SPEED GROUND PLANE HEADER Board Mates: 10 YEAR MFG WITH 50 µ" GOLD QSH EXTENDED LIFE Cable Mates: PRODUCT HQCD, HQDP HIGH MATING CYCLES (See Also Available Note) Standoffs: SO SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?QTH Insulator Material: Liquid Crystal Polymer Terminal Material: Phosphor Bronze Plating: Au or Sn over 50 µ" (1.27 µm) Ni Current Rating: Contact: 2 A per pin (2 pins powered) Ground Plane: 25 A per ground plane (1 ground plane powered) Operating Temp Range: -55 °C to +125 °C Voltage Rating: 125 VAC (5 mm Stack Height) Max Cycles: 100 RoHS Compliant: Yes Integral metal plane for power or ground Standard Stack Heights from 5 mm to 25 mm POWER/SIGNAL APPLICATION ALSO AVAILABLE (MOQ Required) • 15 mm, 22 mm and 30 mm stack height • 30 µ" (0.76 µm) Gold (Specify -H plating for Data Rate cable mating applications.) • Edge Mount & Guide Posts • 80 (-DP), 120, 150 positions per row • Retention Option Contact Samtec. HIGH-SPEED CHANNEL PERFORMANCE QTH/QSH @ 5 mm Mated Stack Height Rating based on Samtec reference channel. For full SI performance data visit Samtec.com or contact SIG@samtec.com PROCESSING Lead–Free Solderable: Yes SMT Lead Coplanarity: (0.10 mm) .004" max (030-060) (0.15 mm) .006" max (090)* *(.004" stencil solution may be available; contact IPG@samtec.com) Board Stacking: For applications requiring more than two connectors per board contact ipg@samtec.com LEAD STYLE PINS PER ROW NO. OF PAIRS QTH Specify LEAD STYLE from chart –030, –060, –090 (60 total pins per bank = –D) –020, –040, –060 (20 pairs per bank = –D–DP) RECOGNITIONS –D = (No. of Pins per Row/30) x (20.00) .7875 01 FILE NO. E111594 • 100 GbE • Hypertransport™ • XAUI • PCI Express® • SATA • InfiniBand™ –F = Gold Flash on Signal Pins and Ground Plane, Matte Tin on tails 02 (0.50) .0197 (0.20) .008 A A –01 & –02 (0.76) .030 (0.89) .035 DIA = Electro-Polished Selective 50 µ" (1.27 µm) min Au over 150 µ" (3.81 µm) Ni on Signal Pins in contact area, 10 µ" (0.25 µm) min Au over 50 µ" (1.27 µm) Ni on Ground Plane in contact area, Matte Tin over 50 µ" (1.27 µm) min Ni on all solder tails *Note: –C Plating passes 10 year MFG testing –L A TYPE (0.64) .025 = Single-Ended –D–DP = Differential Pair (–01 only) = (7.00 mm) .275" DIA Polyimide film Pick & Place Pad (N/A with -05 & -07 lead style) –TR = Tape & Reel (–090 positions maximum) –L QTH LEAD STYLE –01 –02 –03 –04 –05 –07 –09 A HEIGHT WITH QSH* (4.27) .168 (7.26) .286 (10.27) .404 (15.25) .600 (18.26) .718 (24.24) .954 (13.26) .522 (5.00) .197 (8.00) .315 (11.00) .433 (16.00) .630 (19.00) .748 (25.00) .984 (14.00) .551 *Processing conditions will affect mated height. See SO Series for board space tolerances Due to technical progress, all designs, specifications and components are subject to change without notice. WWW.SAMTEC.COM OTHER OPTION –K –D –C* (7.11) .280 –03 thru –09 Note: Some lengths, styles and options are non-standard, non-returnable. PLATING OPTION = 10 µ" (0.25 µm) Gold on Signal Pins and Ground Plane, Matte Tin on tails –DP = (No. of Pairs per Row/20) x (20.00) .7875 (20.00) .7875 G b p s –L For complete scope of recognitions see www.samtec.com/quality PROTOCOLS 25 Compatible with UMPT/UMPS for flexible two-piece power/signal solutions All parts within this catalog are built to Samtec’s specifications. Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply. = Latching Option (–01 lead style only) (N/A on –060 (–D–DP) & –090)