QTH-090-01-L-D-EM2

F-217 QTH–090–01–C–D–A ® QTH–030–01–L–D–A QTH–060–07–F–D–A (0.50 mm) .0197" QTH SERIES HIGH-SPEED GROUND PLANE HEADER SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?QTH Insulator Material: Liquid Crystal Polymer Terminal Material: Phosphor Bronze Plating: Au or Sn over 50 µ" (1.27 µm) Ni Current Rating: Contact: 2 A per pin (1 pin powered per row) Ground Plane: 25 A per ground plane (1 ground plane powered) Operating Temp Range: -55 °C to +125 °C Voltage Rating: 125 VAC (5 mm Stack Height) Max Cycles: 100 RoHS Compliant: Yes Integral metal plane for power or ground Board Mates: QSH Cable Mates: HQCD, HQDP (See Also Available Note) Standard Stack Heights from 5 mm to 25 mm Standoffs: SO HIGH-SPEED CHANNEL PERFORMANCE 25 QTH/QSH @ 5 mm Mated Stack Height Rating based on Samtec reference channel. For full SI performance data visit Samtec.com or contact SIG@samtec.com 10 YEAR MFG WITH 50 µ" GOLD EXTENDED LIFE PRODUCT HIGH MATING CYCLES G b p s PROCESSING Lead–Free Solderable: Yes SMT Lead Coplanarity: (0.10 mm) .004" max (030-060) (0.15 mm) .006" max (090) Board Stacking: For applications requiring more than two connectors per board contact ipg@samtec.com RECOGNITIONS LEAD STYLE PINS PER ROW NO. OF PAIRS QTH Specify LEAD STYLE from chart –030, –060, –090 (60 total pins per bank = –D) For complete scope of recognitions see www.samtec.com/quality –020, –040, –060 (20 pairs per bank = –D–DP) FILE NO. E111594 • 100 GbE • Hypertransport™ • XAUI • PCI Express® • SATA • InfiniBand™ ALSO AVAILABLE (MOQ Required) • 15 mm, 22 mm and 30 mm stack height • 30 µ" (0.76 µm) Gold (Specify -H plating for Data Rate cable mating applications.) • Edge Mount & Guide Posts • 80 (-DP), 120, 150 positions per row • Retention Option Contact Samtec. –D = (No. of Pins per Row/30) x (20.00) .7875 –DP = (No. of Pairs per Row/20) x (20.00) .7875 (20.00) .7875 01 (7.11) .280 –F = Single-Ended –D–DP = Differential Pair (–01 only) 02 (0.50) .0197 (0.20) .008 A A –01 & –02 –03 thru –09 (0.76) .030 (0.89) .035 DIA = 10 µ" (0.25 µm) Gold on Signal Pins and Ground Plane, Matte Tin on tails QTH LEAD STYLE –C* –01 *Note: –C Plating passes 10 year MFG testing –L (0.64) .025 –02 –03 –04 –05 –07 –09 WWW.SAMTEC.COM Due to technical progress, all designs, specifications and components are subject to change without notice. = (7.00 mm) .275" DIA Polyimide film Pick & Place Pad (N/A with -05 & -07 lead style) –TR A (4.27) .168 (7.26) .286 (10.27) .404 (15.25) .600 (18.26) .718 (24.24) .954 (13.26) .522 HEIGHT = Tape & Reel WITH (–090 positions QSH* maximum) (5.00) .197 (8.00) .315 (11.00) .433 (16.00) .630 (19.00) .748 (25.00) .984 (14.00) .551 *Processing conditions will affect mated height. See SO Series for board space tolerances Note: Some lengths, styles and options are non-standard, non-returnable. OTHER OPTION –K –D = Gold Flash on Signal Pins and Ground Plane, Matte Tin on tails = Electro-Polished Selective 50 µ" (1.27 µm) min Au over 150 µ" (3.81 µm) Ni on Signal Pins in contact area, 10 µ" (0.25 µm) min Au over 50 µ" (1.27 µm) Ni on Ground Plane in contact area, Matte Tin over 50 µ" (1.27 µm) min Ni on all solder tails A TYPE –L FILE NO: 090871_0_000 PROTOCOLS PLATING OPTION –L = Latching Option (–01 lead style only) (N/A on –060 (–D–DP) & –090)