MIT-057-05-L-D-K

F-224 SUPPLEMENT MIT–019–01–F–D MIT–038–01–F–D ® MIT–057–01–L–D MIT SERIES (0.635 mm) .025" MIXED TECHNOLOGY HEADER SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?MIT Insulator Material: Liquid Crystal Polymer Contact Material: Phosphor Bronze Plating: Au or Sn over 50 µ" (1.27 µm) Ni Operating Temp Range: -55 °C to +125 °C Voltage Rating: 275 VAC Max Cycles: 100 RoHS Compliant: Yes Board Mates: MIS Standoffs: SO Integral metal plane for power or ground 76 signal lines per linear inch Choice of mated heights PROCESSING Lead–Free Solderable: Yes SMT Lead Coplanarity: (0.10 mm) .004" max (019-057) Board Stacking: For applications requiring more than two connectors per board contact ipg@samtec.com Polarized MIT RECOGNITIONS For complete scope of recognitions see www.samtec.com/quality —019, —038, —057 (38 total positions per bank) FILE NO. E111594 ALSO AVAILABLE LEAD STYLE POSITIONS PER ROW Specify LEAD STYLE FROM chart PLATING OPTION –F = Gold Flash on Signal Pins and Ground Plane, Matte Tin on tails –L • 11 mm, 16 mm, 18.75 mm and 22 mm stack height • 30 µ" (0.76 µm) Gold • Differential Pair and “Partitionable” (combine differential & single-ended banks in same connector) available. • 76, 95, 114 and 133 positions per row MATED HEIGHT* –01 MIT LEAD STYLE –01 (5.00) .197 –02 (8.00) .315 *Processing conditions will affect mated height. See SO Series for board space tolerances. PACKAGING –K Leave blank for tray packaging = (7.00 mm) .275" DIA Polyimide film Pick & Place Pad –TR =Tape & Reel –FR = Full Reel Tape & Reel (must order max. quantity per reel; contact Samtec for quantity breaks) –C* = Electro-Polished Selective 50 µ" (1.27 µm) min Au over 150 µ" (3.81 µm) Ni on Signal Pins in contact area, 10 µ" (0.25 µm) min Au over 50 µ" (1.27 µm) Ni on Ground Plane in contact area, Matte Tin over 50 µ" (1.27 µm) min Ni on all solder tails *Note: –C Plating passes 10 year MFG testing (No. of Positions/19) x (12.70) .500 + (11.43) .450 (12.70) .500 02 (5.97) .235 (7.11) .280 (0.635) .025 (0.20) .008 01 LEAD STYLE (7.11) .280 (1.40) .055 A (0.58) .023 x (0.38) .015 Note: Some lengths, styles and options are non-standard, non-returnable. OPTION = 10 µ" (0.25 µm) Gold on Signal Pins and Ground Plane, Matte Tin on tails (MOQ Required) MIS LEAD STYLE D (0.38) .015 –01 –02 A (4.27) .168 (7.26) .286 Note: Rugged through-hole ground plane soldered to board (requires paste-over-hole, not press-fit) for added retention to PCB. WWW.SAMTEC.COM Unless otherwise approved in writing by Samtec, all parts and components are designed and built according to Samtec’s specifications which are subject to change without notice.