QTE-020-02-L-D-A-K-TR

F-215 (Rev 13JUL15) QTE–014–01–F–D–DP–A ® QTE–040–01–L–D–A QTE–060–01–L–D–A (0.80 mm) .0315" QTE SERIES HIGH SPEED GROUND PLANE HEADER SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?QTE Insulator Material: Liquid Crystal Polymer Terminal Material: Phosphor Bronze Plating: Au or Sn over 50µ" (1.27 µm) Ni Current Rating: Contact: 2 A per pin (1 pin powered per row) Ground Plane: 23 A per ground plane (1 ground plane powered) Operating Temp Range: -55°C to +125°C Voltage Rating: 225 VAC mated with QSE & 5 mm Stack Height Max Cycles: 100 RoHS Compliant: Yes Processing: Lead–Free Solderable: Yes SMT Lead Coplanarity: (0.10 mm) .004" max (020-060) Board Stacking: For applications requiring more than two connectors per board contact ipg@samtec.com Integral metal plane for power or ground Board Mates: QSE Standard stack heights from 5 mm to 25 mm 100 GbE XAUI ® PCI Express SATA t I/O) MGT (Rocke ™ d an iB fin In notes at Download app ppnote om/a c.c te m sa w. ww @ samtec.com Contact SIG on protocols ns for questio Rated @ 3dB Insertion Loss with PCB effects* w/o PCB effects** Single-Ended Signaling –D 9 GHz / 18 Gbps 9 GHz / 18 Gbps Differential Pair Signaling –D 8 GHz / 16 Gbps 14 GHz / 28 Gbps Differential Pair Signaling –DP 8.5 GHz / 17 Gbps 13.5 GHz / 27 Gbps *Performance data includes effects of a non-optimized PCB. **Test board losses de-embedded from performance data. Performance data for other stack heights and complete test data available at www.samtec.com?QTE or contact sig@samtec.com QTE/QSE 5 mm Stack Height Type PINS PER ROW NO. OF PAIRS QTE RECOGNITIONS –020, –040, –060 For complete scope of recognitions see www.samtec.com/quality (40 total pins per bank = –D) –014, –028, –042 LEAD STYLE PLATING OPTION Specify LEAD STYLE from chart –F –D = Gold Flash on Signal Pins and Ground Plane, Matte Tin on tails = Single-Ended (14 pairs per bank = –D–DP) –L ALSO AVAILABLE = 10µ" (0.25 µm) Gold on Signal Pins and Ground Plane, Matte Tin on tails –D–DP = (No. of Positions per Row/14) x (20.00) .7875 (MOQ Required) 01 –D = (No. of Positions per Row/20) x (20.00) .7875 (20.00) .7875 (5.97) .235 02 (0.80) .0315 (0.20) .008 A –C* = Electro-Polished Selective (7.11) 50µ" (1.27 µm) min .280 Au over 150µ" (3.81 µm) Ni on Signal Pins in contact area, 10µ" (0.25 µm) min Au over 50µ" (1.27 µm) Ni on Ground Plane in contact area, Matte Tin over 50µ" (1.27 µm) min Ni on all solder tails (0.76) .030 (0.89) .035 DIA –D–DP = Differential Pair (–01 only) QTE LEAD STYLE –01 –02 –03 –04 –05 –07 –L OTHER OPTION –09 = (7.00 mm) .275" DIA Polyimide Film Pick & Place Pad –TR = Tape & Reel Packaging HEIGHT WITH (N/A –05 & –07 lead style) QSE* A (4.27) .168 (7.26) .286 (10.27) .404 (15.25) .600 (18.26) .718 (24.24) .954 (13.26) .522 (5.00) .197 (8.00) .315 (11.00) .433 (16.00) .630 (19.00) .748 (25.00) .984 (14.00) .551 –L = Latching Option (N/A on –042 & –060 positions) *Processing conditions will affect mated height. *Note: –C Plating passes 10 year MFG testing (0.64) .025 A TYPE –K FILE NO: 090871_0_000 • 15 mm, 22 mm and 30 mm stack height (Caution: Some automatic placement/inspection machines may have component height restrictions. Please consult machinery specifications.) • 30µ" (0.76 µm) Gold (Specify -H plating for Data Rate cable mating applications.) • Edge Mount • 56 (-DP), 80, 100 positions per row • Guide Posts, Screw Down & Friction Lock • Retention Option Contact Samtec. s ocol Prot orted Supp Cable Mates: EQCD, EQDP, EQRF (See Also Available note) Note: Some lengths, styles and options are non-standard, non-returnable. WWW.SAMTEC.COM Due to technical progress, all designs, specifications and components are subject to change without notice. OTHER SOLUTIONS • Board Spacing Standoffs. See SO Series