MEC1-130-02-F-D-EM2

F-215 MEC1–130–02–L–D–EM2 MEC1–120–02–F–D–EM2 MEC1–120–02–L–D–RA1–SL (1,00 mm) .0394" MEC1-RA, MEC1-EM SERIES RIGHT ANGLE/EDGE MOUNT SOCKETS SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?MEC1-RA Insulator Material: Black LCP Contact Material: Phosphor Bronze Plating: Au or Sn over 50µ" (1,27 µm) Ni Current Rating: 1.6 A per pin (2 adjacent pins powered) Operating Temp Range: -55°C to +125°C Insertion Depth: (5,84 mm) .230" to (8,13 mm) .320" RoHS Compliant: Yes MEC1 Mates with: (1,60 mm) .062" card CARD SLOT POSITIONS PER ROW PLATING OPTION –F –02 05, 08, 20, 30, 40, 50, 60, 70 D (No. of Positions + 2) x (1,00) .03937 + (2,54) .100 (0,36) .014 02 Lead–Free Solderable: Yes SMT Lead Coplanarity: (0,10 mm) .004" max (05-40) (0,15 mm) .006" max (50-70) = 10µ" (0,25 µm) Gold on contact, Matte Tin on tail (11,68) (11,94) .460 .470 (8,89) .350 (8,13) .320 (6,81) .268 RECOGNITIONS (1,00) .03937 (No. of Positions + 2) x (1,00) .03937 01 (1,24) .049 (1,78) .070 DIA Note: Some sizes, styles and options are non-standard, non-returnable. RA1 NP POSITIONS POLARIZED PER ROW POSITIONS 3, 4 05 5, 6 08 15, 16 20 21, 22 30 31, 32 40 41, 42 50 31, 32, 63 & 64 60 53, 54, 115 & 116 70 = Gold flash on contact, Matte Tin on tail = (1,60 mm) .062" thick card –L Processing: For complete scope of recognitions see www.samtec.com/quality 1 SL –NP = No Polarization (8 positions only) Leave Blank for polarization ALSO AVAILABLE (MOQ Required) Note: While optimized for 50Ω • Elevated body applications, this connector height with alternative signal/ground patterns may also perform well in • Other platings certain 75Ω applications. Contact Contact Samtec. Samtec for further information. (0,64) MEC1-RA Rated @ 3dB Insertion Loss* .025 6,81 mm Stack Height Single-Ended Signaling 4.5 GHz / 9 Gbps Differential Pair Signaling 5.5 GHz / 11 Gbps *Performance data includes effects of a non-optimized PCB. Complete test data available at www.samtec.com?MEC1-RA or contact sig@samtec.com (2,51) (1,27) .050 .099 (3,12) .123 APPLICATION Samtec recommends that pads on the mating board be Gold plated. SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?MEC1-EM Insulator Material: Mates with: Black LCP (1,60 mm) Contact Material: Phosphor Bronze .062" card Plating: Au or Sn over 50µ" (1,27 µm) Ni ALSO Current Rating: 1.8 A per pin AVAILABLE (2 adjacent pins powered) (MOQ Required) Operating Temp Range: • Edge mount leads -55°C to +125°C for (0,80 mm) .031" Insertion Depth: thick board (5,84 mm) .230" to (8,13 mm) .320" • Other platings RoHS Compliant: Contact Samtec. Yes Lead–Free Solderable: Yes POSITIONS PER ROW 1 MEC1 PLATING OPTION 02 05, 08, 20, 30, 40, 50, 60, 70 02 (6,81) .268 (No. of Positions + 2) x (1,00) .03937 RECOGNITIONS –NP = No Polarization (8 positions only) –L Leave Blank for polarization (8,13) .320 (8,89) .350 For complete scope of recognitions see www.samtec.com/quality (4,70) .185 (4,57) .180 (3,15) .124 (1,00) .03937 (0,36) .014 NP –F Note: While optimized for 50Ω applications, this connector with alternative signal/ground patterns may also perform well in certain 75Ω applications. Contact Samtec for further information. 01 EM2 = Gold flash on contact, Matte Tin on tail = 10µ" (0,25 µm) Gold on contact, Matte Tin on tail (No. of Positions + 2) x (1,00) .03937 + (12,45) .490 Note: Some sizes, styles and options are non-standard, non-returnable. D (5,21) .205 (1,19) ± (0,38) .047 .015 WWW.SAMTEC.COM Due to technical progress, all designs, specifications and components are subject to change without notice. POSITIONS POLARIZED PER ROW POSITIONS 3, 4 05 5, 6 08 15, 16 20 21, 22 30 31, 32 40 41, 42 50 31, 32, 63 60 & 64 53, 54, 115 70 & 116