MEC2-05-01-L-DV

MICRO EDGE CARD SYSTEMS 0.50 mm, 0.635 mm, 0.80 mm, 1.00 mm, 1.27 mm, 2.00 mm PITCH FEATURES & BENEFITS • Up to 56 Gbps PAM4 • PCI Express® 4.0 (MEC5 Series) • Solutions for (1.60 mm) .062" and (2.36 mm) .093" thick cards • Choice of pitch: 0.50 mm, 0.635 mm, 0.80 mm, 1.00 mm, 1.27 mm, 2.00 mm Staggered press-fit tails (MEC8-VP) • Vertical, right-angle and edge mount orientations • Available in surface mount and through-hole Justification beam ensures card and body are flush (MEC5) KEY SPECIFICATIONS SERIES PITCH TOTAL POSITIONS INSULATOR MATERIAL CONTACT MATERIAL OPERATING TEMP RANGE CURRENT RATING VOLTAGE RATING LEAD-FREE SOLDERABLE MEC5 0.50 mm 60-200 Black LCP Phosphor Bronze -55 ℃ to +125 ℃ 1.5 A (2 pins) 125 VAC Yes MEC6 0.635 mm 20-140 Black LCP Phosphor Bronze -55 ℃ to +125 ℃ 2.4 A (2 pins) 185 VAC Yes MEC8 0.80 mm 20-140 Black LCP Phosphor Bronze -55 ℃ to +125 ℃ 2.3 A (2 pins) 180 VAC Yes F-224 MEC1 1.00 mm 20-140 Black LCP Phosphor Bronze -55 ℃ to +125 ℃ 2.2 A (2 pins) 250 VAC Yes MECF 1.27 mm 10-100 Black/Natural LCP BeCu -55 ℃ to +125 ℃ 3.5 A (2 pins) 280 VAC Yes MEC2 2.00 mm 10-100 Black/Natural LCP BeCu -55 ℃ to +125 ℃ 3.5 A (2 pins) 235 VAC Yes samtec.com/EdgeCard Unless otherwise approved in writing by Samtec, all parts and components are designed and built according to Samtec’s specifications which are subject to change without notice. 25 G b p s (1.27 mm) .050" PITCH • MINI EDGE CARD SOCKET MECF - POSITIONS PER ROW - –05, –08, –20, –30, –40, –50 - CARD THICKNESS –01 - PLATING OPTION DV - –L = (1.60 mm) .062" thick card Leave blank for Tube Packaging = Weld Tabs (Standard on –02 card thickness, optional on –01 card thickness) = (2.36 mm) .093" thick card –TR = Tape & Reel –FR –K = Full Reel Tape & Reel (must order max. quantity per reel; contact Samtec for quantity breaks) Polyimide film pick & place pad (–“X”R only) $ MECF POSITIONS PER ROW Card Mates: (1.60 mm) .062" thick card (2.36 mm) .093" thick card  –05, –08, –20, –30, –40, –50 - CARD THICKNESS –01 = (1.60 mm) .062" thick card –02 - - PLATING OPTION –L =10 µ" (0.25 µm) Gold on contact, Matte Tin on tail = (2.36 mm) .093" thick card (-DV option only) Card Mates: (1.60 mm) .062" thick card (2.36 mm) .093" thick card MEC2-TH Card Mates: (1.60 mm) .062" thick card Note: Some sizes, styles and options are non-standard, non-returnable. TAIL OPTION - –DV 3, 4 –20 15, 16 –40 31, 32 41, 42 –50 - OPTION “X”R Leave blank for Tube Packaging –TR = Tape & Reel (05 thru 30 positions only) (Not available with -TH1) –K = Polyimide film pick & place pad (–”X”R & –DV only) –FR         = Full Reel Tape & Reel (must order max. quantity per reel; contact Samtec for quantity breaks) (05 thru 30 positions only) (Not available with -TH1) –TH1 –DV POSITIONS PER ROW 21, 22 –30   % 5, 6 = Weld Tabs (standard on –02 card, optional on –01 card) –TH1  –05 –WT Vertical Surface Mount $   (67.61) 2.662 (65.79) 2.590 –08 G b p s Through-hole MEC2-DV (54.91) 2.162 (53.09) 2.090 –40 –50 14 (2.00 mm) .0787" PITCH • MINI EDGE CARD SOCKET POSITIONS PER ROW (42.21) 1.662 (40.39) 1.590 –30 POSITIONS POLARIZED POSITIONS PER ROW (No Contact) View complete specifications at: samtec.com?MECF-DV - (8.64) .340 (12.45) .490 (29.51) 1.162 (27.69) 1.090 –20 %   B (14.27) .562 –08   A (10.46) .412 –05     MEC2 “X”R –WT =10 µ" (0.25 µm) Gold on contact, Matte Tin on tail –02 - OPTION A B POSITIONS PER ROW POLARIZED POSITIONS (No Contact) 3, 4 –05 (13.40) .528 (11.50) .453 –05 –08 (19.40) .764 (17.50) .689 –08 5, 6 –20 (43.40) 1.709 (41.50) 1.634 –20 15, 16 –30 (63.40) 2.496 (61.50) 2.421 –30 21, 22 –40 (83.40) 3.283 (81.50) 3.209 –40 31, 32 –50 (103.40) 4.071 (101.50) 3.996 –50 41, 42 View complete specifications at: samtec.com?MEC2-DV & samtec.com?MEC2-TH samtec.com/EdgeCard Unless otherwise approved in writing by Samtec, all parts and components are designed and built according to Samtec’s specifications which are subject to change without notice. F-224