SHV2920P500-30-AA

POLYTRONICS TECHNOLOGY CORP. 24-1,Industry E.4th Rd. Science Park, Hsinchu, Taiwan, R.O.C. TEL: +886-3-5643931 FAX: +886-3-5644624 EVERFUSE Product: SHV2920P500/30-AA Revision: C Date: 25 October,2016 Page: 1 of 1 TM Polymeric PTC Fuse Device Specification(preliminary) Electrical Rating Pol ytr o Voltage: 30V Current: 30A Marking : Figure Recommended Pad Layout (mm) P(Polytronics / Polystar Logo) 6.70 Max Min 8.60 Electrical Characteristics Part Number SHV2920P500/30-AA Note: Ihold 5.00 5.3 cn D m. C E Max Min Max Min Max Min Max 5.70 2.00 3.20 2.30 4.90 5.30 Ihold (A) Itrip (A) Vmax (V) Imax (A) Pd typ (W) 5.0 12.5 30 30 3.5 1.00 Maximum Time-to-Trip (A) (Sec) 25.0 10.0 = Hold current: maximum current device will pass without tripping in 25℃ still air. ee Min sC o nf ide B m@ at SHV2920P500/30-AA A ee Part Number ni c 2.0 2.0 at Physical Dimensions (mm) 4.6 Marking Marking nti Itrip = Trip Current: minimum current at which the device will trip in 25℃ still air. Vmax = Maximum voltage device can withstand without damage at rated current (Imax) Imax = Maximum fault current device can withstand without damage at rated voltage (Vmax) Pd = Power dissipated from device when in the tripped state at 25℃ still air. Rmin = Minimum resistance of device in initial (un-soldered) state. Resistance (Ω ) Rmin 0.003 al R1max = Maximum resistance of device reflow soldering of 260°C for 20 sec. *Value specified were determined using the PWB with 0.150”*1.5oz copper traces. Caution :Operation beyond the specified rating may result in damage and possible arcing and flame. ◎ Specifications are subject to change without notice. R1max 0.020 POLYTRONICS TECHNOLOGY CORP. 24-1,Industry E.4th Rd. Science Park, Hsinchu, Taiwan, R.O.C. TEL: +886-3-5643931 FAX: +886-3-5644624 EVERFUSE TM Polymeric PTC Fuse Product: SHV2920P500/30-AA Revision: C Date: 25 October,2016 Page: 1 of 1 Preheat -Temperature Min (Tsmin) -Temperature Max (Tsmax) -Time (Tsmin to Tsmax) Time maintained above: -Temperature (TL) -Time (tL) Peak Temperature (TP) Time within 5ºC of actual Peak Temperature (tP) Ramp-Down Rate Time 25ºC to Peak Temperature Storage Condition m. Pb-Free Assembly m@ at Profile Feature Average Ramp-Up Rate (Tsmax to TP) ee sC o nf ide 3ºC/second max. 150ºC 200ºC 60-180 seconds 217ºC 60-150 seconds 260ºC 20-40 seconds 6 ºC /second max. 8 minutes max. 0ºC ~35ºC, ≦70%RH ee ni c at Pol ytr o cn Soldering Parameters nti al  Recommended reflow methods: IR, vapor phase oven, hot air oven, N2 environment for lead-free  Recommended maximum paste thickness is 0.25mm (0.010 inch)  Devices can be cleaned using standard industry methods and solvents. Note 1: All temperature refer to topside of the package, measured on the package body surface. Note 2: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.