1SS389
Product specification
1SS389
FEATURES
High Speed
Small Package
High Reliability
Low Forward Voltage
Reference News
PACKAGE OUTLINE
PIN CONFIGURATION
Marking
S4
SOD-523
MAXIMUM RATINGS ( Ta=25℃ unless otherwise noted )
Symbol
Parameter
Value
Unit
VR
DC Blocking Voltage
10
V
IO
Continuous Forward Current
100
mA
IFM
Peak Forward Current
200
mA
IFSM
Non-repetitive Peak Forward Surge Current @t=8.3ms
1
A
PD
Power Dissipation
150
mW
Thermal Resistance From Junction To Ambient
667
℃/W
Operating Junction Temperature Range
-40~+125
℃
Storage Temperature Range
-55~+150
℃
RθJA
Tj
Tstg
ELECTRICAL CHARACTERISTICS(Ta=25℃ unless otherwise specified)
Parameter
Symbol
Test conditions
Min
Reverse voltage
V(BR)
Reverse current
IR
Max
Unit
20
μA
IF=5mA
0.3
V
IF=100mA
0.5
VR=0V,f=1MHz
40
IR=100μA
Total capacitance
Copyright© Msksemi Incorporated
VF
Ctot
Typ
VR=10V
IF=1mA
Forward voltage
10
V
0.18
pF
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1SS389
Forward Characteristics
Reverse Characteristics
1000
100
Pulsed
(uA)
REVERSE CURRENT IR
a =1
T=
a 2
5℃
00
℃
10
T
FORWARD CURRENT
IF
(mA)
Pulsed
1
0.1
0.0
0.1
0.2
0.3
FORWARD VOLTAGE
VF
0.4
Ta=100℃
100
10
1
0.1
0.5
Ta=25℃
0
2
Capacitance Characteristics
6
VR
8
10
100
125
(V)
Power Derating Curve
200
50
Ta=25℃
f=1MHz
40
POWER DISSIPATION
PD (mW)
CAPACITANCE BETWEEN TERMINALS
CT (pF)
4
REVERSE VOLTAGE
(V)
30
20
150
100
50
10
0
0
2
4
6
REVERSE VOLTAGE VR (V)
Copyright© Msksemi Incorporated
8
10
0
0
25
50
75
AMBIENT TEMPERATURE
Ta
(℃)
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1SS389
PACKAGE MECHANICAL DATA
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0.500
0.700
0.250
0.350
0.080
0.150
0.750
0.850
1.100
1.300
1.500
1.700
0.200 REF
0.010
0.070
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0.020
0.031
0.020
0.028
0.010
0.014
0.003
0.006
0.030
0.033
0.043
0.051
0.059
0.067
0.008 REF
0.001
0.003
7° REF
Note:
1.Controlling dimension:in millimeters.
2.General tolerance:±0.05mm.
3.The pad layout is for reference purposes only.
REEL SPECIFICATION
P/N
1SS389
Copyright© Msksemi Incorporated
PKG
QTY
SOD-523
3000
www.msksemi.com
1SS389
Attention
■ Any and all MSKSEMI Semiconductor products described or contained herein do not
handle applications that require extremely high levels of reliability, such as life-support
have specifications
that can
systems, aircraft's control systems, or
other applications whose failure can be reasonably expected to result in serious physical and/or material damage. Consult with
your MSKSEMI Semiconductor representative
nearest
you before using any MSKSEMI Semiconductor products described
or contained herein in such applications.
■ MSKSEMI Semiconductor assumes no responsibility for equipment failures that result from using products
at values that
exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in
products specificationsof any andall MSKSEMI Semiconductor products described orcontained herein.
■ Specifications of any and all MSKSEMI Semiconductor products described or contained herein stipulate the
performance, characteristics, and functions of the described products in the independent state, and are not guarantees of the
performance, characteristics, and functions of the described products as mounted in the customer’s products or equipment. To
verify symptoms and states that cannot be evaluated in an independent device, the customer should always evaluate and test
devices mounted in the customer’sproducts orequipment.
■ MSKSEMI Semiconductor. strives to supply high-quality high-reliability products. However, any and all semiconductor
products fail with someprobability. It is possiblethat these probabilistic failures could give rise to accidents or events that could
endanger human lives, that could give rise to smoke or fire, or that could cause damage to other property. When designing
equipment, adopt safety measures so that these kinds of accidents
or events cannot occur. Such measures include but are
not limited to protective circuits anderror prevention circuitsfor safedesign, redundant design, and structural design.
■ In the event that any or all MSKSEMI Semiconductor products(including technical data, services) described
or contained
herein are controlled under any of applicable local export control laws and regulations, such products must not be exported
without obtaining the export license from theauthorities
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■ No part of this publication may be reproduced or transmitted in any form or by any means, electronic or
mechanical, including photocopying and recording, or any information storage or retrieval system, or otherwise, without the prior
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■
Information (including circuit diagrams and circuit parameters) herein is for example only ; it is not guaranteed for volume
production. MSKSEMI Semiconductor believes information herein is accurate and
reliable, but no guarantees are made or
implied regarding its use or any infringementsof intellectual property rights or other rightsof third parties.
■
Any and all information described or contained herein are subject to change without notice due to
product/technology improvement, etc. Whendesigning equipment, referto the "Delivery Specification" for the MSKSEMI
Semiconductor productthat you intend to use.
Copyright© Msksemi Incorporated
www.msksemi.com
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