BZX584C2V4-BZX584C43
Product specification
BZX584C2V4-BZX584C43
Reference News
FEATURES
Planar Die Construction
150mW Power Dissipation
Zener Voltages from 2.4V - 39V
Ultra-Small Surface Mount Package Power
PACKAGE OUTLINE
Dissipation
PIN CONFIGURATION
SOD-523
Maximum Ratings(Ta=25 ℃ unless otherwise specified)
Characteristic
Symbol
Value
Unit
VF
0.9
V
Power Dissipation
PD
150
mW
Thermal Resistance from Junction to Ambient
Rθ JA
833
℃/W
Junction Temperature
Tj
150
℃
Storage Temperature
Tstg
Forward Voltage
@IF=10mA
Copyright© Msksemi Incorporated
-55~+150
℃
www.msksemi.com
BZX584C2V4-BZX584C43
ELECTRICAL CHARACTERISTICS
T a =25
unless otherwise specified
Maximum Zener Impedance
Zener Voltage Range (Note 2)
Type
Type
Number
Code
VZ@ IZT
Maximum
Typical temperature
Reverse
coefficient
Current
@ IZT
(Note 3)
IZT
Nom(V)
Min(V)
Max(V)
(mA)
ZZT@ IZT
ZZK@ IZK
(Ω)
mV/°C
IR
VR
(mA)
(μA)
(V)
Min
Max
BZX584C2V4
Z11
2.4
2.20
2.60
5
100
600
1.0
50
1.0
-3.5
0
BZX584C2V7
Z12
2.7
2.5
2.9
5
100
600
1.0
20
1.0
-3.5
0
BZX584C3V0
Z13
3.0
2.8
3.2
5
95
600
1.0
10
1.0
-3.5
0
BZX584C3V3
Z14
3.3
3.1
3.5
5
95
600
1.0
5
1.0
-3.5
0
BZX584C3V6
Z15
3.6
3.4
3.8
5
90
600
1.0
5
1.0
-3.5
0
BZX584C3V9
Z16
3.9
3.7
4.1
5
90
600
1.0
3
1.0
-3.5
0
BZX584C4V3
Z17
4.3
4.0
4.6
5
90
600
1.0
3
1.0
-3.5
0
BZX584C4V7
Z1
4.7
4.4
5.0
5
80
500
1.0
3
2.0
-3.5
0.2
BZX584C5V1
Z2
5.1
4.8
5.4
5
60
480
1.0
2
2.0
-2.7
1.2
BZX584C5V6
Z3
5.6
5.2
6.0
5
40
400
1.0
1
2.0
-2.0
2.5
BZX584C6V2
Z4
6.2
5.8
6.6
5
10
150
1.0
3
4.0
0.4
3.7
BZX584C6V8
Z5
6.8
6.4
7.2
5
15
80
1.0
2
4.0
1.2
4.5
BZX584C7V5
Z6
7.5
7.0
7.9
5
15
80
1.0
1
5.0
2.5
5.3
BZX584C8V2
Z7
8.2
7.7
8.7
5
15
80
1.0
0.7
5.0
3.2
6.2
BZX584C9V1
Z8
9.1
8.5
9.6
5
15
100
1.0
0.5
6.0
3.8
7.0
BZX584C10
Z9
10
9.4
10.6
5
20
150
1.0
0.2
7.0
4.5
8.0
BZX584C11
Y1
11
10.4
11.6
5
20
150
1.0
0.1
8.0
5.4
9.0
BZX584C12
Y2
12
11.4
12.7
5
25
150
1.0
0.1
8.0
6.0
10.0
BZX584C13
Y3
13
12.4
14.1
5
30
170
1.0
0.1
8.0
7.0
11.0
BZX584C15
Y4
15
13.8
15.6
5
30
200
1.0
0.1
10.5
9.2
13.0
BZX584C16
Y5
16
15.3
17.1
5
40
200
1.0
0.1
11.2
10.4
14.0
BZX584C18
Y6
18
16.8
19.1
5
45
225
1.0
0.1
12.6
12.4
16.0
BZX584C20
Y7
20
18.8
21.2
5
55
225
1.0
0.1
14.0
14.4
18.0
BZX584C22
Y8
22
20.8
23.3
5
55
250
1.0
0.1
15.4
16.4
20.0
BZX584C24
Y9
24
22.8
25.6
5
70
250
1.0
0.1
16.8
18.4
22.0
BZX584C27
Y10
27
25.1
28.9
2
80
300
0.5
0.1
18.9
21.4
25.3
BZX584C30
Y11
30
28.0
32.0
2
80
300
0.5
0.1
21.0
24.4
29.4
BZX584C33
Y12
33
31.0
35.0
2
80
325
0.5
0.1
23.1
27.4
33.4
BZX584C36
Y13
36
34.0
38.0
2
90
350
0.5
0.1
25.2
30.4
37.4
BZX584C39
Y14
39
37.0
41.0
2
130
350
0.5
0.1
27.3
33.4
41.2
BZX584C43
Y15
43
40.0
46.0
2
100
700
1
0.1
32
10
12
Notes: 1. Valid provided that device terminals are kept at ambient temperature.
2.Tested with pulses, period=5ms,pulse width =300μs.
3. f = 1 kHz.
Copyright© Msksemi Incorporated
www.msksemi.com
BZX584C2V4-BZX584C43
Zener Characteristics(VZ Up to 10 V)
Zener Characteristics(11 V to 43 V)
100
50
43
39
36
33
27
30
10
10
24
9.1
9
1
20
22
8.2
7.5
6.2
6.8
5.1
5.6
4.7
8
PD =150mW
10
11
12
13
IZ, ZENER CURRENT (mA)
Pulsed
10
2.4
IZ, ZENER CURRENT (mA)
Ta =25℃
PD =150mW
Pulsed
15
16
18
Ta =25℃
1
0.5
1
2
3
4
5
6
7
0.1
10
11
15
20
VZ, ZENER VOLTAGE (V)
Temperature Coefficients
45
50
10
25
20
VZ @ IZT
15
10
5
1
0.1
0.01
Ta=100℃
1E-3
0
Ta=25℃
0
4
8
12
16
20
24
32
28
36
40
1E-4
44
0
5
VZ, NOMINAL ZENER VOLTAGE (V)
10
15
20
25
30
40
35
45
VZ, NOMINAL ZENER VOLTAGE (V)
Effect of Zener Voltage on Zener Impedance
Typical Capacitance
1000
1000
Ta=25℃
Ta=25℃
f=1MHz
ZZT, DYNAMIC IMPEDANCE(Ω)
100
1V BIAS
BIAS AT
50% OF VZ NOM
10
1
10
IZ(AC)=0.1IZ(DC)
IZ=1mA
0V BIAS
C, CAPACITANCE (pF)
40
Pulsed
FOR BZX584CXXX SERIES
30
1
35
TYPICAL Ta VALUES
35
-5
30
Typical Leakage Current
100
IR, LEAKAGE CURRENT (uA)
θVZ, TEMPERATURE COEFFICIENT (mV/℃)
40
25
VZ, ZENER VOLTAGE (V)
100
VZ, NOMINAL ZENER VOLTAGE (V)
f=1kHz
100
IZ=5mA
10
1
1
10
100
VZ, NOMINAL ZENER VOLTAGE (V)
Power Derating Curve
150
POWER DISSIPATION
PD
(mW)
200
100
50
0
0
25
50
75
AMBIENT TEMPERATURE
Copyright© Msksemi Incorporated
100
Ta
125
150
(℃ )
www.msksemi.com
BZX584C2V4-BZX584C43
PACKAGE MECHANICAL DATA
Symbol
A
A1
b
c
D
E
E1
E2
L
0
Dimensions In Millimeters
Min
0.510
0.500
0.250
0.080
0.750
1 100
1.500
0.200 REF
0.010
7° REF
Max
0.770
0.700
0.350
0. 150
0.850
1 300
1.700
0.070
Dimensions In Inches
Min
0.020
0.020
0.010
0.003
0.030
0 043
0.059
0.008 REF
0.001
7 ° REF
Max
0.031
0.028
0.014
0.006
0.033
0 051
0.067
0.003
Suggested Pad Layout
Note:
1.Controlling dimension:in millimeters.
2.General tolerance:±0.05mm.
3.The pad layout is for reference purposes only.
REEL SPECIFICATION
P/N
PKG
QTY
BZX584C2V4-BZX584C43
SOD-523
3000
Copyright© Msksemi Incorporated
www.msksemi.com
BZX584C2V4-BZX584C43
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handle applications that require extremely high levels of reliability, such as life-support
have specifications
that can
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your MSKSEMI Semiconductor representative
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or contained herein in such applications.
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at values that
exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in
products specificationsof any andall MSKSEMI Semiconductor products described orcontained herein.
■ Specifications of any and all MSKSEMI Semiconductor products described or contained herein stipulate the
performance, characteristics, and functions of the described products in the independent state, and are not guarantees of the
performance, characteristics, and functions of the described products as mounted in the customer’s products or equipment. To
verify symptoms and states that cannot be evaluated in an independent device, the customer should always evaluate and test
devices mounted in the customer’sproducts orequipment.
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Information (including circuit diagrams and circuit parameters) herein is for example only ; it is not guaranteed for volume
production. MSKSEMI Semiconductor believes information herein is accurate and
reliable, but no guarantees are made or
implied regarding its use or any infringementsof intellectual property rights or other rightsof third parties.
■
Any and all information described or contained herein are subject to change without notice due to
product/technology improvement, etc. Whendesigning equipment, referto the "Delivery Specification" for the MSKSEMI
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Copyright© Msksemi Incorporated
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