瓷片电容器产品承认书
APPROVAL SPECIFICATIONS FOR
DISC CERAMIC CAPACITORS
客户
CUSTOMER
立创商城
客户料号
CUSTOMER P/N
C3148281
产品编码
PART NUMBER
1H223ZC1S-3F-ZNR
规格描述
DESCRIPTION
50V/223/Z/F5.08/L25/Y5V(Ⅲ)/ZNR
日期
DATE
文件编号
DOC. NO.
2022-07-05
德尔创承认栏
APPROVED BY DERSONIC
DEC-WD-WI001(C)
客户承认栏
APPROVED BY CUSTOMER
批 准
APPROVED BY
审核
CHECK BY
制订
FORMULATE BY
彭少雄
吴成爱
陈冬花
批 准
APPROVED BY
审核
CHECK BY
東莞市德尔创电子有限公司
DONGGUAN CITY DERSONIC ELECTRONICS CO., LTD.
广東省東莞市长安镇锦厦河南工业区锦平路 5 号
NO.5, JINGPING ROAD, JINXIA HENAN INDUSTRIAL ZONE, CHANGAN TOWN DONGGUAN CITY, PRC
TEL:86-769-8155 5686
FAX:86-0769-8155 5989
WEBSITE: HTTP://WWW.DERSONIC.COM
E-MAIL:SALES@DERSONIC.COM
瓷片电容器
DISC CERAMIC CAPACITORS
目录
CONTENTS
数据表
DATA SHEET
3
温度补偿型陶瓷电容器
TC TYPE CERAMIC CAPACITORS
4
高介电常数型陶瓷电容器
HI-K TYPE CERAMIC CAPACITORS
6
半导体型陶瓷电容器
SEMICONDUCTOR TYPE CERAMIC CAPACITORS
8
低损耗型陶瓷电容器
LOW LOSS TYPE CERAMIC CAPACITORS
9
标准与试验方法
SPECIFICATIONS AND TESTING METHODS
10
包装
PACKAGING
12
请确保我们的产品安装到您的产品上前,已根据您的需求进行了评估。
Please make sure that your product has been evaluated in view of your
specifications with our product being mounted to your product.
请您在使用我们的产品时,不要偏离此标准。
You are requested not to use our product deviating from this specification.
2
瓷片电容器
DISC CERAMIC CAPACITORS
数据表
DATA SHEET
产品编码
Part number
1H223ZC1S-3F-ZNR
规格描述
Description
50V/223/Z/F5.08/L25/Y5V(Ⅲ)/ZNR
客户料号
Customer P/N
介质类别
Dielectric class
Class 3 (Surface insulation type)
额定电压
Rated voltage
50VDC
电容量
Capacitance
损耗角正切
Tangent of loss angle
耐电压
Testing voltage
尺寸
DIMENSIONS
0.022uF+80%/-20%
@ 1kHz 0.1Vrms 25ºC
0.05 max @1kHz 0.1Vrms 25ºC
75VDC (Charge/discharge current 2mA max) 3s PASS
绝缘电阻
Insulation resistance
1000MΩ min @ 50V 60s, RH25MΩμF
表1
Table 1
类别 Type
Class 1
Class 2 / Low-DF
Class 3
频率
Frequency
1MHz(100KHz)
1kHz
1kHz
电压
Voltage
1.0Vrms
1.0Vrms
0.1Vrms
在室温下,两导线间施加额定电压(额定电压大于500V时使用500V)进行测量,
时间不超过1分钟。
The insulation resistance should be measured with a DC voltage not exceeding the rated
voltage (above 500V rated voltage tested by 500V) at room condition and less than 1 min.
of charging.
在电容器两导线间施加表2测试电压1到5s后不被破坏(充/放电流不大于50mA)
The capacitor should not be damaged when test voltages of the table 2 are applied between
the lead wires for 1 to 5 sec (Charge/Discharge current ≤50mA).
6
耐电压
Testing voltage
(TV)
温度特性
Temperature
characteristic
7
表2
Table 2
没有不合格
No failure.
类别 Type
Class 1 / Class 2 / Low-DF
Class 3
额定电压(UR)
Rated Voltage (UR)
≤500V
>500V
All
测试电压
Testing Voltage
2.5UR
1.5UR+500V
1.5UR
电容器必须按照表3中的步骤进行测量。
在误差范围内(见表A)
The capacitance measurement should be made at each step specified in the table 3.
在误差范围内(见表B)
无偏置 Within the specified
Within the specified tolerance (see Table B) 表3
No bias tolerance (see Table A).
步骤
5
1
3
4
2
Table 3
Step
容量
漂移
Cap.
drift
温度
Temperature
(±1°C)
α>-150,
≤18pF, ±0.05pF
>18pF, ±0.3%
α≤-150 & SL: ±1.0%
20°C
-25°C
(X7*: -55°C;
Z5*: +10°C)
20°C
+85°C
(X7*: +125°C)
20°C
*为2、3类瓷温度特性的前两码
*: The first two codes of the temperature characteristics of class 2, 3 ceramic dielectric
8
导线抗张强度
Terminal tensile
strength
引线不应断开,电容器不应破裂。
Lead wire should not be cut off capacitor should not be broken.
固定住电容器,在引线上逐步施加径向拉力直至10N,并保持10±1秒钟。
Fix the body of the capacitor and apply a tensile weight gradually to each lead wire in the
radial direction of the capacitor up to 10N and keep it for 10±1 sec.
9
导线抗折强度
Terminal bending
strength
引线不应断开,电容器不应破裂。
Lead wire should not be cut off capacitor should not be broken.
在引线出口处沿一个方向施加5N、90°的弯曲压力,然后恢复至原始状态。之
后,在2至3秒内再以相反方向施加一次90°的弯曲压力。
Each lead wire should be subjected to 5N of weight and bent 90° at the point of egress, in
one direction, then returned to its original position and bent 90° in the opposite direction at
the rate of one bent in 2 to 3 sec.
10
11
可焊性
Solderability of leads
焊锡
耐热性
Soldering
effect
电容器的导线必须浸入焊料中3±0.5秒钟,浸入深度离导线根部1.5-2.0mm。
The lead wire of a capacitor should be dipped into molten solder for 3±0.5 sec. The depth
导线必须有3/4以上的面积均匀附着焊锡
of immersion is up to about 1.5 to 2.0mm from the root of lead wires.
Lead wire should be soldered with uniform coating on the axial direction 焊锡温度: 无铅焊(Sn-3Ag-0.5Cu) 245±5°C
over 3/4 of the circumferential direction.
Temp. of solder: Lead Free Solder (Sn-3Ag-0.5Cu) 245±5°C
易溶解的H63号锡235±5°C
H63 Eutectic Solder 235±5°C
APP
没有可见损伤
No marked defect
ΔC/C
α≥-750:
≤100pF, ±0.5pF
>100pF, ±0.5%
α100pF, ±1.0%
Y5P: ±10%
X7R, Y5R: ±15%
Y5U, Z5U: ±20%
Y5V, Z5V: ±20%
IR
大于初始测量标准的50%
More than 50% Initial specified value.
TV
如第6节进行试验,没有不合格
Per Item 6.
DONGGUAN CITY DERSONIC ELECTRONIC CO., LTD.
导线浸入离导线根部1.5-2.0mm处、锡温为260±10°C中3.5±0.5秒。
The lead wires should be immersed in solder of 260±5°C up to 1.5 to 2.0mm from the root
of terminal for 3.5±0.5 sec.
预处理:
Pre-treatment:
Y5P: ±15%
电容器必须先贮存在125±2°C条件下1小时,然后在室温下存放24±2小时,
Y5U, Y5V: ±30%
再进行初始测量。
Capacitor should be stored at 125±2°C for 1 hr., and then placed at room condition for
24±2 hrs. before initial measurements.
试验后处理:
Post-treatment:
电容必须存放在室温下12小时(1类瓷:1~2小时)。
Capacitor should be stored for 12 hrs. (Class 1 type: 1~2 hrs.) at room condition.
10
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圆板陶瓷电容器试验方法
TESTING METHODS FOR DISC CERAMIC CAPACITORS
■适用于WC1、WWC2、WC3和WCL
标准与试验方法
SPECIFICATIONS AND TESTING METHODS
序
No.
标准 Specifications
试验项目
Item
13
14
15
振动
Vibration
resistance
耐湿负荷
Humidity
loading
高温负荷
High
temperature
load
温度循环
Temperature
and
immersion
cycle
Class 2 / Low-DF
Class 1
APP
12
Suitable for WC1, WWC2, WC3 and WCL
没有可见损伤
No marked defect
将电容器导线焊稳和调整振动频率范围为10-55Hz、总振幅为1.5mm,振动从
10Hz到55Hz,然后再回到10Hz,大约一分钟。
The capacitor should be firmly soldered to the supporting lead wire and vibrated at a
frequency range of 10 to 55Hz, 1.5mm in total amplitude, with about a 1 minute rate of
vibration change from 10Hz to 55Hz and back to 10Hz.
总时间六个小时,每两小时在相互垂直方向来回三次。
Apply for a total of 6 hrs., 2 hrs. each in 3 mutually perpendicular directions.
CR
如第3节进行试验,没有不合格
Per Item 3.
tanδ
(Q)
如第4节进行试验,没有不合格
Per Item 4.
APP
没有可见损伤
No marked defect
ΔC/C
≤33pF, ±1.0pF
>33pF, ±3.0%
Y5P: ±10%
X7R, Y5R: ±15%
Y5U, Z5U: ±20%
Y5V, Z5V: ±20%
tanδ
(Q)
大于初始标准的50%
More than 50% initial
specified value
小于2倍的初始标准值
Less than 200% Initial specified value.
IR
大于初始测量标准的25%
More than 25% Initial specified value.
TV
如第6节进行试验,没有不合格
Per Item 6.
APP
没有可见损伤
No marked defect
ΔC/C
≤20pF, ±1.0pF
>20pF, ±5.0%
tanδ
(Q)
大于初始标准的50%
More than 50% initial
specified value
Y5P: ±10%
X7R, Y5R: ±15%
Y5U, Z5U: ±20%
Y5V, Z5V: ±30%
施加额定电压的电容保持在温度为40±2°C、相对湿度为90-95%条件下
Y5P: ±15%
Y5U, Y5V: ±30% 500±12小时。
Apply the rated voltage for 500±12 hrs. at 40±2°C in 90 to 95% relative humidity.
Y5P: ±15%
Y5U, Y5V: ±30%
大于初始测量标准的25%
More than 25% Initial specified value.
TV
如第6节进行试验,没有不合格
Per Item 6.
APP
没有可见损伤
No marked defect
ΔC/C
α≥-750:
≤100pF, ±0.5pF
>100pF, ±0.5%
α100pF, ±1.0%
大于初始标准的50%
More than 50% initial
specified value
Y5P: ±10%
X7R, Y5R: ±15%
Y5U, Z5U: ±20%
Y5V, Z5V: ±20%
预处理
Pre-treatment:
电容器应储存在125°C条件下1小时,然后在室温下存放24小时,再进行初
始测量。
Perform a heat treatment at 125°C for one hour and then set for 24 hours at room
condition, perform the initial measurement.
试验后处理
Post-treatment:
电容必须贮存在室温条件下24小时。
Capacitor should be stored for 24 hrs. at room condition.
表4
Table 4
Y5P: ±15%
Y5U, Y5V: ±30%
大于初始测量标准的50%
More than 50% Initial specified value.
TV
如第6节进行试验,没有不合格
Per Item 6.
1
2
3
4
温度
Tempature
5~35°C
-25±2°C
(X7R: -55±2°C)
5~35°C
85±2°C
(X7R: 125±2°C)
时间
Time
5±2min
30±2min
5±2min
30±2min
■表B — 2、3类瓷及低损耗类产品容量变化率表
Table B — Capacitance change of Class 2, Class 3 and Low-DF type products
相对20°C时的容量变化率
Capacitance change from 20°C (%)
-55°C
步骤
Step
预处理
Pre-treatment:
电容器必须先贮存在125°C条件下1小时,然后在室温下存放24小时,再进
行初始测量。
Perform a heat treatment at 125°C for one hour and then set for 24 hours at room
condition, perform the initial measurement
试验后处理
Post-treatment:
电容必须贮存在室温条件下24小时。
Capacitor should be stored for 24 hrs. at room condition.
小于2倍的初始标准值
Less than 200% Initial specified value.
IR
标称值
Nominal
value
(10-6/K)
在85±2°C(X7R: 125±2°C)、相对温度不大于50%条件下施加1.5倍(3类瓷为1.2
倍)额定电压1000+48/-0小时(充/放电流小于50mA)
Apply a DC voltage of 150% (Class 3 type: 120%) of the rated voltage for 1000+48/-0
hours at 85±2°C (X7R: 125±2°C) with a relative humidity of 50% max. (Charge/discharge
current ≤50mA)
电容器应表4规定的步骤与条件承受五次温度循环。
The capacitor should be subjected to 5 temperature cycles according to the step and
conditions in the table 4.
■表A — 1类瓷产品容量变化率表
Table A — Capacitance change of Class 1 type products
温度系数
Temperature
coefficient
(α)
试验后处理:
Post-treatment:
电容必须贮存在室温条件下12小时(1类瓷:1~2小时)。
Capacitor should be stored for 12 hrs. (Class 1 type: 1~2 hrs.) at room condition.
小于2倍的初始标准值
Less than 200% Initial specified value.
IR
tanδ
(Q)
试验方法
Testing methods
Class 3
-25°C
+85°C
+125°C
温度特性
Temperature
characteristic
(TC)
-0.39~0.39
-0.63~0.63
Y5P
下限类别温度
Lower category
temperature
(LCT)
上限类别温度
Upper category
temperature
(UCT)
容量变化率
Capacitance
change
(ΔC/C)
NP0
0±60
-0.45~0.819
-0.27~0.491
N80
-75±30
0.338~1.23
0.203~0.738 -0.683~-0.293 -1.10~-0.473
Y5R
±10%
N150
-150±60
0.675~2.19
0.405~1.31 -1.37~-0.585 -2.21~-0.945
Y5U
+22%/-56%
N220
-220±60
1.20~2.83
1.70~0.72
-1.82~-1.04
-2.94~-1.68
Y5V
+22%/-82%
N330
-330±60
2.03~3.84
1.22~2.30
-2.54~-1.76
-4.10~-2.84
Z5U
N470
-470±60
3.08~5.12
1.85~3.07
-3.45~-2.67
-5.57~-4.31
Z5V
N750
-750±120
4.73~8.23
2.84~4.94
-5.66~-4.10
-9.14~-6.62
X7R
±15%
-25°C
+22%/-56%
+10°C
DONGGUAN CITY DERSONIC ELECTRONIC CO., LTD.
11
+85°C
+85°C
+22%/-82%
-55°C
+125°C
±15%
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陶瓷电容器
CERAMIC CAPACITORS
包装
PACKAGING
■ 散件包装
Bulk packing
散件包装最小包装为PE袋,其包装数量如下表所示;一定数量的最小包装装入内盒中,最后4个小盒或10个小盒,
装入大箱中,具体由产品规格确定。
The minimum packing of bulk packaging is PE bag, the packing quantity is shown in the following table; a certain number of minimum
packaging into the inner box, the last 4 inner boxes or 10 inner boxes, loaded into the outer box, specifically determined by the product
specifications.
额定电压
Rated voltage
脚长
Lead length
产品直径
Body diameter
最小包装数量
Minimum packaging quantity
≤16mm
All
1 000
≤8.5mm
1 000
>8.5mm
500
All
500
≤8.5mm
1 000
>8.5mm
500
All
500
≤8.5mm
1 000
>8.5mm
500
16mm
≤16mm
4kVdc
(Y2)
>16mm
≤16mm
>4kVdc
(Y1)
>16mm
■ 编带包装
Taping packing
编带尺寸规格见下一页,其包装盒或卷盘尺寸,及最小包装数量如下表所示
The taping specifications are shown on the next page, the dimensions of the ammo or reel, and minimum packaging quantity are shown in
the following table
包装方式
Packaging format
折叠包装
Ammo packaging
30±1mm
尺寸(mm)与图示
Dimensions (mm)
and drawing
83±3mm
360mm max
卷盘包装
Reel packaging
B
A
C
A
43±2mm
C
B
256±5mm 335±5mm
60mm max
包装数量(pcs)
Quantity (pcs)
500~2 500 per reel
500~2000 per ammo
卷盘包装一盘装四盒,每盒二盘;折叠包装一盒装十盒。
Reel packaging 4 boxes per carton, 2 reels per boxed; Ammo packaging 10 boxes per carton.
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陶瓷电容器
CERAMIC CAPACITORS
编带规格
TAPING SPECIFICATIONS
方式1
Method 1
孔距(P0)与元件间距离(P)均为12.7mm
或者,孔距(P0)与元件间距离(P)均为15.0mm
12.7mm by feed hole pitch (P0) and components pitch (P)
or, 15.0mm by feed hole pitch (P0) and components pitch (P)
如下图所示:
As shown in the following figure:
直脚
Straight lead
P
ΔS
外弯脚
Outside kink lead
内弯脚
Inside kink lead
平行脚
Vertical kink lead
ΔH
P2
C
K
H1
ød
W2
H
W1
K
H0
D0
H0
H0
L
W0
W
载体纸带
Carrier tape
胶带
Hold-down tape
P1
t2
t1
F
P0
孔距(P0)为12.7mm,元件间距离(P)为24.4mm
Feed hole pitch (P0) with 12.7mm and components pitch (P) with 25.4mm
方式2
Method 2
如下图所示:
As shown in the following figure:
外弯脚
Outside kink lead
P
ΔS
C
内弯脚
Inside kink lead
ød
K
W2
H
W1
ΔH
直脚
Straight lead
K
H1
平行脚
Vertical kink lead
H0
L
D0
H0
H0
W0
W
载体纸带
Carrier tape
胶带
Hold-down tape
F
P1
t2
t1
P0
尺寸规格(mm)
Dimensions (mm)
Lead wire diameter
F
P
P0
P1
P2
5.0
12.7
12.7
3.85
6.35
7.5
15.0
15.0
3.75
7.5
7.5
25.4
12.7
8.95
10.0
25.4
12.7
7.7
±0.8
±1.0
±0.3
±0.7
±1.3
导
线
直
径
ød
ΔS
Δh
W
W0
W1
W2
H
H0
H1
D0
t1
t2
L
C
K
0.55
1.3
2.0
18.0
7.0
9.0
3.0
18.0
16.0
40.0*
4.0
0.9
1.5
11.0
3.0**
5.0
±0.1
max
max
+1.0
-0.5
min
+0.75
-0.5
max
+2.0
-0
±0.5
max
±0.3
max
max
max
max
max
*: 根据产品直径大小会所变化。
It varies according to the diameter of the product.
**:酚醛包封产品其最大值为1.5mm,CC、CY等环氧包封产品其最大值为2.0mm。
Phenolic coating product are 1.5mm max., epoxy coating product of CC, CY type are 2.0mm max.
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