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EDM1070BR-01

EDM1070BR-01

  • 厂商:

    IMBEST(英蓓特)

  • 封装:

  • 描述:

  • 数据手册
  • 价格&库存
EDM1070BR-01 数据手册
EDM1070XX Embedded Display Module Order#: EDM1070AR-01 / EDM1070BR-01 (T6010261 / T6010262) Figure-1 Product features  Based on 32-bitARMCortex-M4/M0 Dual Core MicrocontrollerLPC4357FET256,running at frequencies of up to 204MHz  CPU Internal 1024Kbytes of Flash, 136 Kbytes of SRAM and 16 Kbytes of EEPROM  On board 128MB Nand Flash、32MB SDRAM,4MB SPI Flash(reserved)、2Kb EEPROM  7inch (Resolution:800×480) TFT LCD touch screen  Follow EMC、FCC、3C design standard,performance and index meet related standards  Fruitful expansion communication interfaces: o 3 x 3 line serial port ,RS232 voltage o One USB2.0 HS Deriver port ,one USB2.0 FS Host port o One Micro SD card interface o One 10/100Mbps Ethernet port o One RS485 port,two CAN 2.0B ports,one SPI bus,1 I2C bus  Four input and four output I/O interfaces implemented with isolated by optocouplers  Support FatFs_vR0.08a file system(for SD card)  Support uC/OS-II_v2.91 OS & emWin5.18 graphical interfaces  Support LwIP_v1.4.0 protocol stack  Support SPI to serial port module( up to 4 serial ports)  Support 1.3 mega pixel OV9655 Camera module(SGPIO interface) Hardware Processor  NXP LPC4357FET256/LPC1857FET256  Integrating hardware a floating-point unit  Integrating a 1024KB Flash, a136 KB SRAM and a 16KB EEPROM  Integrating a LCD controller with support of 24bpp true-color mode and a resolution of up to 1024×768  An USB 2.0 high-speed Host/Device/OTG interface with on-chip PHY and support of DMA transmission  An USB 2.0 high-speed Host/Device interface with on-chip PHY and ULPI which support external high-speed PHY  A 10/100 Mbits Ethernet MAC MII/RMII interface  A four-wire SPI flash interface (SPIFI) with data transfer rate of up to 40Mbps per channel  Two CAN 2.0B, four UART, two I2S, two I2C, two SSP, one SPI buses  Four 32-bit general purpose timer, two standard PWM, one motor control PWM with Quadrature encoder interface  400KHz的Two 10-bit ADCs operating at up to 400KHz, one 10-bit DAC operating at up to 400KHz  Serial GPIO interface (SGPIO)  164 general-purpose I/O interfaces  Two watchdog timers On-Board Memories  128MB NandFlash  32MB SDRAM  2Kb EEPROM  4Mb SPI Flash (spare solder pads) Communication Interface  Three serial interface implemented with phoenix connectors  UART0: 3-wire serial interface, RS232 level  UART2: 3-wire serial interface, RS232 level  UART3: 3-wire serial interface, RS232 level  One RS485 interface implemented with phoenix connectors  Two CAN2.0B interfaces implemented with phoenix connectors  Two USB interfaces  USB2.0 Device×1, High-speed, 480Mbps  USB2.0 Host×1, Full-speed, 12Mbps  One 10/100Mbps Ethernet interface  One TF card slot  One 20-pin standard JTAG debug interface  Four input and four output I/O interfaces implemented with phoenix connectors and isolated by optocouplers  One 8-channel ADC interface  One DAC interface  One SPIFI interface  One IIC interface  One I2S interface  One high-precision RTC (no battery by default)  Spare interface for external hardware watchdog Others  7-inch (800*480) TFT LCD, 16bit RGB565 mode, supporting 4-wire resistive touch-screen  One ISP button  One buzzer  One 5V power output interface Electrical Features  Operating Temperature: 0 ℃ ~ 70 ℃  Storage Temperature: -40 ℃ ~ 85 ℃  Operating Humidity: 0% ~ 90% (Non-condensing)  Power Supply: DC 9~24V, 150~400mA@12V  Electrical Standards: CE, FCC and CCC  PCB Layers: 6-layer PCB On-Board Interfaces Figure-2 On-board interfaces System Block Diagram Figure-3 System block diagram Table 1 Legend of Block Diagram Legends Descriptions Interface modules of CPU Chips or spare solder pads on the board Interfaces on the board Hardware Dimensions (mm) Hardware dimensions System Features  Supporting uC/OS-II_v2.91 operating system  Supporting emWin5.18 graphic interface  Supporting FatFs_vR0.08afilesystem  Supporting LWIP _v1.4.0 protocol stack Development Environments  IAR EWARM Integrated Development Environment o  All the drivers can work with IAR EWARM V6.40 or higher; Keil MDK-ARM Integrated Development Environment o All the drivers and applications can work with Keil MDK-ARM V4.60 or higher. Debugging Tools  ULINK2 o  ULINK2 is recommended to be used under Keil MDK-ARM for best debugging performance; JLINK-V9.1 o JLINK-V9.1 is recommended to be used under IAR EWARM for best debugging performance Drivers and Example Applications  Basic peripheral driver examples;  BSP example applications based on uC/OS-II_v2.91 real-time operating system  BSP example applications based on emWin5.18 (GUI)  Example applications of OV9655 Camera implemented through SGPIO
EDM1070BR-01 价格&库存

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