CL-BU-27X27

Model : MBA27002 Series For 27x27 Chip set BGA Heat Sink MBA27002 Series Specification: 1.Material: Heat Sink : CU1100 Clip : Plastic (UL94-V0) 2.Heat sink dimension : Foot print : 27x27mm Part no. Height Fin shape Base MBA27002MBA27002MBA27002MBA27002- 12 15 20 25 P P P P /2.6 /2.6 /2.6 /2.6 Clip Weight - Y, BU, O - Y, BU, O - Y, BU, O - Y, BU, O 27.9g 30.9g 35.9g 40.9g 5. Clip available: Chip set thickness 3.0-3.6mm Y -Yellow colored clip 1.4-2.0mm BU - Blue colored clip 0.5-1.1mm O - Orange colored clip 3.Technology: Precision Forging 4.Finish: Oxygenless Treament 7.2 0.24 6.6 0.22 6.0 0.20 5.4 0.18 4.8 4.2 0.16 0.14 3.6 0.12 3.0 2.4 0.10 0.08 1.8 0.06 1.2 0.6 0.04 0.02 Thermal resistance MBA27002-12PCU/2.6 Thermal resistance MBA27002-15PCU/2.6 Pressure drop (in-H2O) Rsa (oC/W) Performance Data: Thermal resistance MBA27002-20PCU/2.6 Thermal resistance MBA27002-25PCU/2.6 Pressure drop MBA27002-12PCU/2.6 Pressure drop MBA27002-15PCU/2.6 Pressure drop MBA27002-20PCU/2.6 0.0 Pressure drop MBA27002-25PCU/2.6 0.00 0 100 200 300 400 500 600 700 800 900 1000 Air Velocity (LFM) Heat Source Size : Uniform No.5, Min Lung Road, Yang M ei Taiwan, R.O.C. Tel : 886-3-4728155 Fax : 886-3-4725979 E-mail : sales@malico.com.tw